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    PACKAGE DIMENSION Search Results

    PACKAGE DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE DIMENSION Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    Package Dimension Samsung Electronics 28TSOP2-300 Package Dimension Scan PDF

    PACKAGE DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    d1ca

    Abstract: S10VB STO-220 s4vb 67 s15vb s4vb AX057 AX06 AX078 S2VB
    Text: OUTLINE DIMENSIONS Fig. 1 Package: AX057 Fig. 2 Package: AX06 Fig. 3 Package: AX06 Fig. 4 Package: AX06 Fig. 5 Package: AX078 Fig. 6 Package: AX10 Fig. 7 Package: AX10 Fig. 8 Package: AX14 Fig. 9 Package: AX14 1 • 8 0 0 • 6 3 4 • 3 6 5 4 OUTLINE DIMENSIONS


    Original     		AX057 AX078 S10WB ITO-220 FTO-220 O-221 ZIP-27 HSOP-28 d1ca S10VB STO-220 s4vb 67 s15vb s4vb AX057 AX06 AX078 S2VB PDF

    820 marking

    Abstract: top marking codes MARKING CODE e1 6 lead marking 34 Marking code CS Marking MB linear marking code
    Text: Package Description How Package Dimensions Are Indicated/Codes/Marking 1. How Package Dimensions Are Indicated 2. Package Codes 3. Marking DB81-10003-1E 1 Package Description (How Package Dimensions Are Indicated/Codes/Marking) 1. How Package Dimensions Are Indicated


    Original     		DB81-10003-1E 820 marking top marking codes MARKING CODE e1 6 lead marking 34 Marking code CS Marking MB linear marking code PDF

    7261 markem

    Abstract: Markem 7224 Ink 7224 markem Markem 7254 Ink 7224 markem black 7261 markem black 7261 markem white k 897 TO-46 weight 7224 white
    Text: HERMETIC PACKAGE INFORMATION PACKAGE TYPE CERDIP PACKAGE MATERIAL Ceramic DESCRIPTION Package Dimensions mm inch WIDTH HEIGHT(2) PACKAGE STYLE = PACKAGE Package Code CODE + Lead Count Flat Pack Glass Sealed Notes 2-June-2010 Lead Frame, Board Type RAIL/BULK


    Original     		14-Lead 18-Lead 150degC TPC460 2-June-2010 7261 markem Markem 7224 Ink 7224 markem Markem 7254 Ink 7224 markem black 7261 markem black 7261 markem white k 897 TO-46 weight 7224 white PDF

    reel

    Abstract: KCPSX04 300PCS Package 200PCS
    Text: SMD DISPLAY TAPE SPECIFICATIONS KCSX02 PACKAGE: 650PCS / REEL KCDX02 PACKAGE: 300PCS / REEL KCSX03 PACKAGE: 550PCS / REEL KCDX03 PACKAGE: 300PCS / REEL KCDX04 PACKAGE: 250PCS / REEL KCPDX04 PACKAGE: 250PCS / REEL KCSX04 KCPSX04 NOTE: 1. All dimensions are in millimeters


    Original     		KCSX02 650PCS KCDX02 300PCS KCSX03 550PCS KCDX03 KCSX04 400PCS reel KCPSX04 Package 200PCS PDF

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo PDF

    32TSOP

    Abstract: No abstract text available
    Text: PACKAGE INFORMATION 1. OUTLINE DIMENSIONS FOR CDIP PACKAGE 2. OUTLINE DIMENSIONS FOR .600 FAMILY PDIP PACKAGE 3. OUTLINE DIMENSIONS FOR .300 FAMILY SOP PACKAGE 4. OUTLINE DIMENSIONS FOR .330 FAMILY SOP PACKAGE 5. OUTLINE DIMENSIONS FOR .450 FAMILY SOP PACKAGE


    Original     		32TSOP 40TSOP 64LQFP- 28TSOP 40TTLINE PDF

    tensolite

    Abstract: No abstract text available
    Text: v01.0310 C-11 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-11 Package Outline Drawing Package Information NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. PLATING: GOLD PLATE OVER NICKEL PLATE Package Type C-11 Package Weight [1] 20 gms [2] 4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].


    Original     		231CCSF tensolite PDF

    BGA and QFP Package mounting

    Abstract: oki Package SOJ PGA wire bonding he package information document consisting of 8 chapters in total "the package information document consisting of 8 chapters in total"
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 2. PACKAGE OUTLINES AND DIMENSIONS This document is Chapter 2 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 2. PACKAGE OUTLINES AND DIMENSIONS


    Original     		PDF

    10C2

    Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension


    Original     		12P9B 14P5A 16P5A 20P5A 24P5A 18P4G 20P4G 22P4H 24P4D 24P4Y 10C2 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G PDF

    2SC5652

    Abstract: NE685 NE685M23 S21E RF TRANSISTOR 10 GHZ low noise
    Text: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE685M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height


    Original     		NE685M23 NE685M23 24-Hour 2SC5652 NE685 S21E RF TRANSISTOR 10 GHZ low noise PDF

    2SC5651

    Abstract: NE688 NE688M23 S21E
    Text: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE688M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M03 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height


    Original     		NE688M23 NE688M23 24-Hour 2SC5651 NE688 S21E PDF

    2SC5650

    Abstract: NE681 NE681M23 S21E
    Text: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE681M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height


    Original     		NE681M23 NE681M23 24-Hour 2SC5650 NE681 S21E PDF

    NEC NPN 2SC5653

    Abstract: 2SC5653 NE687 NE687M23 S21E
    Text: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE687M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height


    Original     		NE687M23 NE687M23 24-Hour NEC NPN 2SC5653 2SC5653 NE687 S21E PDF

    2SC5649

    Abstract: 2SC564 NE856 NE856M23 S21E
    Text: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE856M23 OUTLINE DIMENSIONS Units in mm FEATURES PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height


    Original     		NE856M23 NE856M23 24-Hour 2SC5649 2SC564 NE856 S21E PDF

    Application Notes

    Abstract: MWT-7
    Text: FET Application Notes Package Information Package Outlines All Leads are Gold-Plated Kovar Dimensions are in Inches and mm Package 71 (Solder Seal) Package 70 (Solder Seal) Package 73 (Epoxy Seal) 0.98 (2.5) 0.07 (1.78) 0.10 (2.5) Min. All Leads D D .25


    Original     		Package71* Package73 MwT-17 MIL-STD-202, Application Notes MWT-7 PDF

    Untitled

    Abstract: No abstract text available
    Text: SUBMINIATURE SOLID STATE LAMP AM2520F3C03 Features Description ! SUBMINIATURE PACKAGE. F3 Made with Gallium Arsenide Infrared Emitting ! GULL WING. diodes. ! LONG LIFE - SOLID STATE RELIABILITY. ! LOW PACKAGE PROFILE. ! PACKAGE: 1000PCS / REEL. Package Dimensions


    Original     		AM2520F3C03 1000PCS DSAB2262 MAR/29/2003 AM2520F3C03 PDF

    Untitled

    Abstract: No abstract text available
    Text: SUBMINIATURE SOLID STATE LAMP AM2520F3C03 Features Description ! SUBMINIATURE PACKAGE. F3 Made with Gallium Arsenide Infrared Emitting diodes. ! GULL WING. ! LONG LIFE - SOLID STATE RELIABILITY. ! LOW PACKAGE PROFILE. ! PACKAGE: 1000PCS / REEL. Package Dimensions


    Original     		AM2520F3C03 1000PCS DSAB2262 MAY/08/2002 PDF

    tensolite

    Abstract: tensolite price
    Text: v01.0310 C-9 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-9 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE 3. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]


    Original     		231CCSF tensolite tensolite price PDF

    TO-251 footprint

    Abstract: motorola triac catalog DO204AH Packages thyristor T 218 N Thyristor catalog RCA THYRISTOR isolated gate Thyristor
    Text: M1 Package Dimensions M1 This section contains the dimensions for the following packages: • F Package — TO-202AB, Type 1 Non-isolated • Y Package — DO-35 or DO-204AH • R Package — TO-220AB (Non-isolated) • L Package — TO-220AB (Isolated)


    Original     		O-202AB, DO-35 DO-204AH O-220AB DO-214AA O-218AC O-218X TO-251 footprint motorola triac catalog DO204AH Packages thyristor T 218 N Thyristor catalog RCA THYRISTOR isolated gate Thyristor PDF

    igbt

    Abstract: No abstract text available
    Text: Package Dimensions SAMSUNG IGBT ♦ Package Dimensions 285 ELECTRONICS Package Dimensions SAMSUNG ÍGBT ♦ Package Dimensions 286 ELECTRONICS Package Dimensions SAMSUNG IGBT ♦ Package Dimensions 287 ELECTRONICS Package Dimensions SAMSUNG IGBT 4* Package Dimensions


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE DIMENSIONS CMOS DRAM PLASTIC DUAL IN-LINE PACKAGE 407 ELECTRONICS PACKAGE DIMENSIONS CMOS DRAM PLASTIC ZIGZAG IN-LINE PACKAGE 408 ELECTRONICS PACKAGE DIMENSIONS CMOS DRAM PLASTIC SMALL OUT-LINE J-LEAD 409 ELECTRONICS PACKAGE DIMENSIONS CMOS DRAM PLASTIC SMALL OUT-LINE J-LEAD


    OCR Scan     		PDF

    transistor b 647 c

    Abstract: No abstract text available
    Text: PACKAGE DIMENSIONS Dimensions in Milimeters SOT-23 2 9 0 . o 20 SOT-89 . 1 5 0 0 20 _ Ì L _ I 1— $ - 641 ELECTRONICS PACKAGE DIMENSIONS 642 ELECTRONICS PACKAGE DIMENSIONS 643 ELECTRONICS PACKAGE DIMENSIONS Dimensions in Milimeters 644 ELECTRONICS PACKAGE DIMENSIONS


    OCR Scan     		OT-23 OT-89 O-92/TO-92S/TO-92L transistor b 647 c PDF

    R604A

    Abstract: diode r207 R605A 60 diode R702 erg28 AF91-471 R205A R606A
    Text: DIODE MODULES Dimensions mm ERG28-12 ERG78-12 2 in one-package R201 19.6m >•> 017" AF89-692 (AF88-456) + ERG28 4-ERG78 1 1n one-package R101 (AF91-473) 2 in one-package R204 1 in one-package R102 (AF91-471) 3 M5<10 p" 59 mm 2 in one-package R207 2 in one-package


    OCR Scan     		ERG28-12 ERG78-12 AF89-692) AF88-456) ERG28 4-ERG78 AF91-473) AF91-471) R205A AF89-746) R604A diode r207 R605A 60 diode R702 AF91-471 R606A PDF

    HD64572

    Abstract: No abstract text available
    Text: Section 10 Package Dimensions 10.1 Package Dimensions Figure 10-1 shows the HD64572 package dimensions. 132 26.0 + 0.2 D 24 133 1.25 1.0 0.510.1 Figure 10-1 Package Dimensions FP-176 HITACHI 497


    OCR Scan     		HD64572 FP-176) PDF