Untitled
Abstract: No abstract text available
Text: BUMP CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC LCC-48P-M02 48-pin plastic BCC Lead pitch 0.50 mm Package width x package length 7.00 mm × 7.00 mm Sealing method Plastic mold Mounting height 0.80 mm MAX LCC-48P-M02 48-pin plastic BCC
|
Original
|
LCC-48P-M02
48-pin
LCC-48P-M02)
C48055S-c-4-2
|
PDF
|
9806
Abstract: Package 48 LCC
Text: BUMP CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PAD PLASTIC LCC-48P-M02 Lead pitch Vertical: 0.5 mm Horizontal: 0.5 mm Package width x package length 7.0 × 7.0 mm Sealing method Plastic mold 48-pads plastic BCC LCC-48P-M02 48-pads plastic BCC (LCC-48P-M02)
|
Original
|
LCC-48P-M02
48-pads
LCC-48P-M02)
C48055SC-1-1
9806
Package 48 LCC
|
PDF
|
LQFP 48
Abstract: HV220 HV2201 HV2221 HV230 HV2301 HV2321 HV2601 HV2631 HV2701
Text: Selector Guide High Voltage Analog Multiplexer/Switch ICs Device Interface Configuration Supply Voltage Analog Signal Voltage Switch Current V (V) (A) VPP-VNN Switch Resistance typ5 Output Bleed Resistors Package Options Notes 48-Lead LQFP (FG) - 48-Ball fpBGA (GA)
|
Original
|
48-Lead
48-Ball
HV2601
16-SPST
HV2701
HV2612
LQFP 48
HV220
HV2201
HV2221
HV230
HV2301
HV2321
HV2601
HV2631
HV2701
|
PDF
|
MO-137-AB
Abstract: pericom sot23-6 MO-153-AB PD-1301 MO-150AH PD2001 MO-150AB bcc sot23-5 78 mo 5 PD-1803
Text: Pericom Standard Packages and Dimensions PERICOM CODE A B C FA FB H J K L NA NB NC P Q R S T U V W PACKAGE TYPE DRAWING NUMBER JE D E C P U B 95 TSSOP-48 TSSOP-56 BQSOP-40 BQSOP-48 BQSOP-80 SC70-5 TQFP-32 LQFP-32 LQFP-52 SSOP-14 SSOP-16 SSOP-20 SSOP-24 SSOP-28
|
Original
|
TSSOP-48
TSSOP-56
BQSOP-40
BQSOP-48
BQSOP-80
SC70-5
TQFP-32
LQFP-32
LQFP-52
SSOP-14
MO-137-AB
pericom sot23-6
MO-153-AB
PD-1301
MO-150AH
PD2001
MO-150AB
bcc sot23-5
78 mo 5
PD-1803
|
PDF
|
BY128 diode
Abstract: BY128 REMOTE CONTROL IC FP18 HC05 noise cancel MC68HC705L26 Nippon capacitors f10b2
Text: Freescale Semiconductor, Inc. Ayame MC68HC705L26 MCU Rev 0.3 Tuesday, February 24, 2004 Gordon T. Sasamori CSIC MCU Design Section Tokyo Design Operations Nippon Motorola Ltd. Tokyo 106 Japan The MC68HC705L26 is an MCU device in a 48-pin QFP package with the HC05
|
Original
|
MC68HC705L26
MC68HC705L26
48-pin
24x4/25x3
16-bit
BY128 diode
BY128
REMOTE CONTROL IC
FP18
HC05
noise cancel
Nippon capacitors
f10b2
|
PDF
|
Untitled
Abstract: No abstract text available
Text: New Products MB39A123 6-Channel DC/DC Converter IC with Synchronous Rectification MB39A123 MB39A123 is a 6-channel DC/DC converter IC with a synchronous rectification function based on the pulse-width modulation PWM type . Each of the six channels built into a BCC-48+ or LQFP-48P package can be controlled and soft-started
|
Original
|
MB39A123
MB39A123
BCC-48+
LQFP-48P
MB3785A,
MB3825A,
|
PDF
|
1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
|
Original
|
60WMBG
60M/54WBGA-8
10X15
10-8X12-A
LA69-00635A
48TBGA
48-TBGA-10
0-8X16-O
LA69-00267A
ADS11981
1f1-1717-a19
153FBGA
BGA 6x6 tray
FBGA tray kostat
tray bga 6x6
169fbga-12.0x16.0-8x16-0
78BOC-11
78BOC
ePAK BGA 5x5 tray
153FBGA-9
|
PDF
|
S028
Abstract: TDA1305T
Text: Philips Semiconductors Preliminary specification Stereo 1fs data input up-sampling filter with bitstream continuous dual DAC BCC-DAC2 FEATURES TDA1305T mill Easy application 16fs Finite-duration Impulse-Response (FIR) filter incorporated Selectable system clock (fsys) 256fs or 384fs
|
OCR Scan
|
TDA1305T
256fs
384fs
256fs)
384fs)
7110fl2b
DcI7Li23
S028
TDA1305T
|
PDF
|
TDA1305T
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS DATA SHEET TDA1305T Stereo 1fs data input up-sampling filter with bitstream continuous dual DAC BCC-DAC2 Preliminary specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1995 Dec 08 Philips Semiconductors
|
Original
|
TDA1305T
256fs
384fs
256fs)
384fs)
SCD47
513061/50/02/pp20
TDA1305T
|
PDF
|
TDA1305T
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS DATA SHEET TDA1305T Stereo 1fs data input up-sampling filter with bitstream continuous dual DAC BCC-DAC2 Preliminary specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1995 Dec 08 Philips Semiconductors
|
Original
|
TDA1305T
256fs
384fs
256fs)
384fs)
SCD47
513061/50/02/pp20
TDA1305T
|
PDF
|
TDA1305T
Abstract: Sine Wave Generation Techniques
Text: INTEGRATED CIRCUITS DATA SHEET TDA1305T Stereo 1fs data input up-sampling filter with bitstream continuous dual DAC BCC-DAC2 Preliminary specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1995 Dec 08 Philips Semiconductors
|
Original
|
TDA1305T
256fs
384fs
256fs)
384fs)
SCD47
513061/50/02/pp20
TDA1305T
Sine Wave Generation Techniques
|
PDF
|
TDA1305T
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS DATA SHEET TDA1305T Stereo 1fs data input up-sampling filter with bitstream continuous dual DAC BCC-DAC2 Preliminary specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1995 Dec 08 Philips Semiconductors
|
Original
|
TDA1305T
256fs
384fs
256fs)
384fs)
SCD47
513061/50/02/pp20
TDA1305T
|
PDF
|
BP317
Abstract: TDA1305T
Text: Philips Semiconductors Objective specification Stereo 1fs data input up-sampling filter with bitstream continuous calibration dual DAC BCC-DAC2 TDA1305T FEATURES • Easy application • 16fs Finite-duration Impulse-Response (FIR) filter incorporated • Selectable system clock (fsys) 256fs or 384fs
|
Original
|
TDA1305T
256fs
384fs
256fs)
384fs)
SCD35
BP317
TDA1305T
|
PDF
|
A3232
Abstract: bga 7x7 CSP2 BGA thermal resistance 6x8 bga 6x8 Package BGA 48 PACKAGE thermal resistance
Text: FBGA Chip Scale BGA Encapsulant Au Wire Die Mold Resin Die Au Wire Polyimide Tape Substrate Solder Laminate Substrate Solder Ball Die Attach Super CSP Si Al SON BCC™ Leadless Redistribution Line Cu Leadframe Metal post (Cu/Barrier) Polyimide Layer SiN
|
Original
|
|
PDF
|
|
|
TDA1305T
Abstract: TDA1305 S028
Text: Philips Semiconductors Objective specification Stereo 1fs data input up-sampling filter with bitstream continuous calibration dual DAC BCC-DAC2 TDA1305T FEATURES • Easy application • 16fs Finite-duration Im pulse-Response (FIR) filter incorporated • Selectable system clock (fsys) 256fs or 384fs
|
OCR Scan
|
TDA1305T
256fs
384fs
256fs)
384fs)
0Dfil07T
7110aEb
TDA1305T
TDA1305
S028
|
PDF
|
Philips MKP 378
Abstract: capacitor MKP 630V capacitor MKP 1000V MKP power capacitor 74124 MKP BC MKP capacitor Philips film capacitors MKP 1000V 74183
Text: BCcomponents MISD ROESELARE METALLIZED POLYPROPYLENE FILM AC AND PULSE CAPACITOR MKP 378 MKP/MKP 378 MKP AND MKP/MKP RADIAL POTTED TYPE Modification: Supersedes: HQN-384-17/102 010 Pages: 48 03-02-18 01-12-11 See amendment record MKP 378 MKP/MKP 378 AC and Pulse metallized
|
Original
|
HQN-384-17/102
F930406A.
HQN-384-01/102:
WV-HQ0011K)
WV-HQ0066K)
WV-HQ0198K)
WV-HQ0240K)
WV-HQ0252K)
Philips MKP 378
capacitor MKP 630V
capacitor MKP 1000V
MKP power capacitor
74124
MKP BC
MKP capacitor
Philips film capacitors
MKP 1000V
74183
|
PDF
|
AN 7823
Abstract: Techpoint
Text: BCC Bump Chip Carrier BCC+ exposed paddle without ground ring • Saw singulated format • Package height 0.8mm max. • Square body size (rectangular body designable) • Staggered dual row or single row bump design BCC+ (exposed paddle with ground ring)
|
Original
|
|
PDF
|
TDA1549T
Abstract: 23473
Text: INTEGRATED CIRCUITS DATA SHEET TDA1549T Stereo 4fs data input up-sampling filter with bitstream continuous calibration DAC BCC-DAC1 Objective specification File under Integrated Circuits, IC01 Philips Semiconductors August 1994 Philips Semiconductors Objective specification
|
Original
|
TDA1549T
18-bit
18-bitlips
SCD34
TDA1549T
23473
|
PDF
|
Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS DATA SHEET TDA1549T Stereo 4fs data input up-sampling filter with bitstream continuous calibration DAC BCC-DAC1 Objective specification File under Integrated Circuits, IC01 Philips Semiconductors August 1994 Philips Semiconductors Objective specification
|
Original
|
TDA1549T
18-bit
SCD34
|
PDF
|
LED audio spectrum analyser circuit diagram
Abstract: automatic speaker recognition microcontroller bass schematic BASS TREBLE CIRCUIT tone control digital TDA1305T TDA1546T MARKING EA1 DC controlled dual volume, balance, tone Bass and schematic diagram in bass treble 75th-order
Text: INTEGRATED CIRCUITS DATA SHEET TDA1546T Bitstream Continuous Calibration DAC with digital sound processing BCC-DAC Preliminary specification File under Integrated Circuits, IC01 Philips Semiconductors January 1995 Philips Semiconductors Preliminary specification
|
Original
|
TDA1546T
SCD36
513061/1500/01/pp40
LED audio spectrum analyser circuit diagram
automatic speaker recognition microcontroller bass
schematic BASS TREBLE CIRCUIT
tone control digital
TDA1305T
TDA1546T
MARKING EA1
DC controlled dual volume, balance, tone Bass and
schematic diagram in bass treble
75th-order
|
PDF
|
LED audio spectrum analyser circuit diagram
Abstract: digital BASS BOOST TREBLE tone control digital 10 band LED sound level indicator automatic speaker recognition microcontroller bass audio spectrum analyzer led display 6 pin remote bass boost pin out AUDIO amplifier digital volume control headphone automatic volume control extra bass circuit diagram
Text: INTEGRATED CIRCUITS DATA SHEET TDA1546T Bitstream Continuous Calibration DAC with digital sound processing BCC-DAC Preliminary specification File under Integrated Circuits, IC01 Philips Semiconductors January 1995 Philips Semiconductors Preliminary specification
|
Original
|
TDA1546T
SCD36
513061/1500/01/pp40
LED audio spectrum analyser circuit diagram
digital BASS BOOST TREBLE
tone control digital
10 band LED sound level indicator
automatic speaker recognition microcontroller bass
audio spectrum analyzer led display
6 pin remote bass boost pin out
AUDIO amplifier digital volume control headphone
automatic volume control
extra bass circuit diagram
|
PDF
|
BCC418
Abstract: MA4ST350 TQFP44 TQFP48 Manchester code
Text: BCC 418 SINGLE CHIP TRANSCEIVER DIRECT CONVERSION The BCC418 is a single chip integrated circuit for radio-based spread spectrum communication FHSS . This is an Ultra Low Power and a zero-IF device. The circuit is easily applied and RF knowledge is minimal. It has been developed for the
|
Original
|
BCC418
25kHz
BCC418
TQFP44
TQFP48
MA4ST350
TQFP44
TQFP48
Manchester code
|
PDF
|
BCC918
Abstract: MA4ST350 TQFP44 TQFP48 Manchester code 1n 918
Text: BCC 918 SINGLE CHIP TRANSCEIVER DIRECT CONVERSION The BCC918 is a single chip integrated circuit for radio-based spread spectrum communication FHSS . This is an Ultra Low Power and a zero-IF device. The circuit is easily applied and RF knowledge is minimal. It has been developed for the
|
Original
|
BCC918
25kHz
BCC918
TQFP44
TQFP48
MA4ST350
TQFP44
TQFP48
Manchester code
1n 918
|
PDF
|
MB39A121
Abstract: LQFP-48P
Text: New Products MB39A121 5-Channel DC/DC Converter IC with Synchronous Rectification MB39A121 MB39A121 is a 5-channel DC/DC converter IC with a synchronous rectification function based on the pulse width modulation type PWM type . Each of five channels built into a BCC-40P or LQFP-48P package can be controlled and soft-started
|
Original
|
MB39A121
MB39A121
BCC-40P
LQFP-48P
MB3785A,
MB3825A,
MB3827,
|
PDF
|
