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    PACKAGE 337 Search Results

    PACKAGE 337 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE 337 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MO178AA

    Abstract: MO178AB JEDEC to 243 MO-137 MO-187 TSOT23 SOT23W-3 JEDEC MO-187 ba
    Text: PACKAGE OUTLINES PLASTIC QUARTER-SIZED SMALL OUTLINE PACKAGE QSOP 24 leads Package Designator LF 8.74 .344 8.55 .337 8º 0º 24 0.25 .010 0.19 .007 3.99 .157 3.81 .150 6.20 .244 5.79 .228 A 1 1.27 .050 0.40 .016 2 0.254 .010 REF 24X SEATING PLANE GAUGE PLANE


    Original     		PDF MO-137 MO-187 MO178AA MO178AB JEDEC to 243 TSOT23 SOT23W-3 JEDEC MO-187 ba

    324pc

    Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension


    Original     		PDF 240mil SP050PC 340mil SP070PC 440mil 12P9B 14P5A 16P5A 20P5A 24P5A 324pc L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881

    SSOP48W

    Abstract: SSOP20N 18w sot23 transistor TSSOP16 MO-150 MO-187 MO-220 MS-013 SSOP20S 103001 for mouse
    Text: Package Information Package Types The following are the package types and widths offered by Holtek. Pin Count DIP Dual In-line Package 80, 100, 128 14mm ´ 20mm 208 28mm ´ 28mm Pin Count Package Width 8, 14, 16, 18, 20 300mil 24, 28, 32, 40, 42 600mil 28, 32, 40 (Ceramic)


    Original     		PDF 300mil 600mil SSOP48W SSOP20N 18w sot23 transistor TSSOP16 MO-150 MO-187 MO-220 MS-013 SSOP20S 103001 for mouse

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    APA600

    Abstract: AA23 APA075 APA1000 APA150 APA300 APA450 APA750
    Text: ProASICPLUS Flash Family FPGAs Package Pin Assignments 100-Pin TQFP 1 100 100-Pin TQFP Note For Package Manufacturing and Environmental information, visit the Package Resource center at . v5.8 2-1 ProASICPLUS Flash Family FPGAs


    Original     		PDF 100-Pin APA075 APA150 APA600 AA23 APA075 APA1000 APA150 APA300 APA450 APA750

    Pb95Sn5

    Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
    Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377


    Original     		PDF DS2411: DS2415: DS2417: DS2432: DS2433: DS2502: DS2760: DS2761: DS2762: DS9503: Pb95Sn5 pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses


    Original     		PDF

    0555B

    Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
    Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7


    Original     		PDF 44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238

    c 337 25

    Abstract: 337 SMD B39341-B3686-Z710 B3686 C61157-A7-A49 337 g marking code
    Text: SAW Components Data Sheet B3686 SAW Components B3686 Low-Loss Filter 337,5 MHz Data Sheet Ceramic package QCC10B Features • ■ ■ ■ High performance IF bandpass filter 15 MHz usable bandwidth Constant group delay Ceramic SMD package Terminals ■ Gold plated


    Original     		PDF B3686 QCC10B B39341-B3686-Z710 C61157-A7-A49 D-81617 c 337 25 337 SMD B39341-B3686-Z710 B3686 C61157-A7-A49 337 g marking code

    SN-74LS153N

    Abstract: SN74LS153N SN74LS153N texas
    Text: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 76011012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 7601101EA


    Original     		PDF 26-Sep-2005 6011012A 7601101EA 7601101FA JM38510/07902BEA JM38510/07902BFA SN-74LS153N SN74LS153N SN74LS153N texas

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 76007012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 7600701EA


    Original     		PDF 26-Sep-2005 6007012A 7600701EA 7600701FA 7700401EA 7700401FA

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package 2 D PAK Package Weight mg 1700 Product Group Type No. SB820D –SB8200D SB820DC –SB8200DC SB1020D –SB10200D SB1020DC –SB10200DC SB1620D –SB16200D SB1620DC –SB16200DC


    Original     		PDF SB820D SB8200D SB820DC SB8200DC SB1020D SB10200D SB1020DC SB10200DC SB1620D SB16200D

    9806

    Abstract: 9721 220 diode 9806 K 872 LM137 LT137 RH137 k 786
    Text: RELIABILITY DATA LM137 / 337 LT137 / 337 RH137 12/8/2000 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE HERMETIC TO-3 TO-220 1,632 8344 770 8410 133 8344 2,535 • HIGHLY ACCELERATED STRESS TEST AT +131°C/85%RH PACKAGE TYPE SAMPLE SIZE


    Original     		PDF LM137 LT137 RH137 O-220 816CODE 00-03-6209B. 9806 9721 220 diode 9806 K 872 RH137 k 786

    Untitled

    Abstract: No abstract text available
    Text: High Voltage P-Type Quad Silicon Detector SD 551-23-41-221 PACKAGE DIMENSIONS INCH[mm] [mm] PACKAGE DIMENSIONS INCH .337 [8.56] Ø1.032 [26.21] Ø.730 [18.54] PIN CIRCLE .105 [2.67] 7X Ø.018 [0.46] 3 2 A B 30° Ø.730 [18.54] D C Ø.955 [24.27] 43° VIEWING


    Original     		PDF 1064nm, 3x10-13 660nm

    Untitled

    Abstract: No abstract text available
    Text: High Voltage P-Type Quad Silicon Detector SD 551-23-41-221 PACKAGE DIMENSIONS INCH[mm] [mm] PACKAGE DIMENSIONS INCH .337 [8.56] Ø1.032 [26.21] Ø.730 [18.54] PIN CIRCLE .105 [2.67] 7X Ø.018 [0.46] 3 2 A B 30° Ø.730 [18.54] D C Ø.955 [24.27] 43° VIEWING


    Original     		PDF 1064nm, 3x10-13 660nm

    SD 337

    Abstract: No abstract text available
    Text: High Voltage P-Type Quad Silicon Detector SD 551-23-41-221 PACKAGE DIMENSIONS INCH[mm] [mm] PACKAGE DIMENSIONS INCH .337 [8.56] Ø1.032 [26.21] Ø.730 [18.54] PIN CIRCLE .105 [2.67] 7X Ø.018 [0.46] 3 2 A B 30° Ø.730 [18.54] D C Ø.955 [24.27] 43° VIEWING


    Original     		PDF 1064nm, 3x10-13 660nm SD 337

    LT22

    Abstract: AZ100ELT22 AZ100ELT22D AZ100ELT22T AZ10ELT22 AZ10ELT22D AZ10ELT22T AZM10 ELT22 MC100ELT22
    Text: ARIZONA MICROTEK, INC. AZ10ELT22 AZ100ELT22 CMOS/TTL to Differential PECL Translator PACKAGE AVAILABILITY FEATURES PACKAGE • Green / RoHS Compliant / Lead Pb Free package available • 0.5ns Typical Propagation Delay • <100ps Typical Output to Output


    Original     		PDF AZ10ELT22 AZ100ELT22 100ps MC10ELT22 MC100ELT22 AZ10ELT22D AZ10ELT22D+ AZM10+ ELT22 AZ100ELT22D LT22 AZ100ELT22 AZ100ELT22D AZ100ELT22T AZ10ELT22 AZ10ELT22D AZ10ELT22T AZM10 ELT22 MC100ELT22

    Yamaichi ic354

    Abstract: IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 8. RELATED INFORMATION This document is Chapter 8 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 8. RELATED INFORMATION 8. RELATED INFORMATION


    Original     		PDF MIL-M-38510 MIL-STD-883 Yamaichi ic354 IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240

    74HC9046

    Abstract: 74HCT4050 74hct7014 74HCT4049 74HC7541 74hct133 74HC9046A 74HC90 74HCT4059 74HC5555
    Text: INTEGRATED CIRCUITS Package information Supersedes data of 2001 Nov 02 File under Integrated Circuits, IC06 Philips Semiconductors 2002 Aug 08 Philips Semiconductors Package information PACKAGE INFORMATION PART NUMBER DIL N SO (D) SSOP (DB) TSSOP (PW) PIN COUNT


    Original     		PDF 74HCU04 74HCTU04 74HC00 74HCT00 74HC02 74HCT02 74HC03 74HCT03 74HC04 74HC86 74HC9046 74HCT4050 74hct7014 74HCT4049 74HC7541 74hct133 74HC9046A 74HC90 74HCT4059 74HC5555

    B39321-B3711-U410

    Abstract: saw filter 315 B3711 C61157-A7-A67 CE 315 F61074-V8168-Z000
    Text: SAW Components Data Sheet B3711 SAW Components B3711 Low Loss Filter 315,00 MHz Data Sheet Ceramic package DCC6C Features • RF low-loss filter for remote control application ■ Package for Surface Mounted Technology SMT ■ Hermetically sealed ceramic package


    Original     		PDF B3711 B39321-B3711-U410 C61157-A7-A67 F61074-V8168-Z000 B39321-B3711-U410 saw filter 315 B3711 C61157-A7-A67 CE 315 F61074-V8168-Z000

    d3376

    Abstract: 74AC11828
    Text: 54AC 11828, 74AC11828 10-BIT BUFFERS/BUS DRIVERS WITH 3-STATE OUTPUTS TI0156— D 3376, NOVEMBER 1909— REVISED MARCH 1990 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers S4AC11828 . . . JT PACKAGE 74AC11828 . . . DW OR NT PACKAGE TOP VIEW


    OCR Scan     		PDF 74AC11828 10-BIT TI0156-- 500-mA 300-mil S4AC11828 74AC11828 d3376