P09N02
Abstract: No abstract text available
Text: v03.0207 QUALITY & RELIABILITY QUALITY ASSURANCE Standard Process for Packaged MMICs C8, G7, G8, G16, LC3B, LC4, LC5, LH5, LH250, LM1, LM3, LM3B, P7 Packages Pick Die from Qualified Wafers 100 % Visual Inspect Kit and Record Lot Numbers Clean Package Die Attach/Epoxy Cure
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Original
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PDF
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LH250,
W10N02,
W10N03,
W09N03,
W09N04,
P15N04,
P03N01,
P09N02,
P09N02
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P09N02
Abstract: No abstract text available
Text: v00.1106 QUALITY ASSURANCE Record Lot Number on List of Materials for Each Part Listed Inspect MMICs and ICs Clean Housing Install Feedthrus Clean Housing Epoxy Substrates Solder Components Clean Housing Epoxy Attach All Chip Components Wirebond 100% Visual Inspection
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Original
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PDF
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W10N02,
W09N01,
W09N32
W09N03,
MIL-STD-883
P15N04,
P03N01,
P09N02,
P09N02
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Untitled
Abstract: No abstract text available
Text: v03.0207 Standard Process for Plastic Encapsulated MMICs DFN, MSOP, QFN, QSOP, SOIC, SOT Packages Kit Qualified Wafers Visual Inspection Ship IC Sub-contract Assembly Vendor Inspect and Configure Kit at IC Sub-Contractor 100% Visual Inspect “2nd Optical”
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Original
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PDF
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P15N04,
P03N01,
P09N02,
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Untitled
Abstract: No abstract text available
Text: v02.0106 Standard Process for Commercial MMIC Chips Die Receive Wafers 1. Per P10N02, Receiving Inspection Traceability 2. Per 101099, Wafer Incoming Inspection Procedure PCM Review 3. Per 101099, Wafer Incoming Inspection Procedure 4. Per W10N03, Wafer Inspection Procedure
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Original
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PDF
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P10N02,
W10N03,
MIL-STD-883
2011D
P03N01,
P09N02,
W15N02,
W10N02,
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