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    OUTLINE OF THE HEAT SINK FOR FBGA WITH JEDEC STANDARD Search Results

    OUTLINE OF THE HEAT SINK FOR FBGA WITH JEDEC STANDARD Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    DF2B5M4ASL Toshiba Electronic Devices & Storage Corporation TVS Diode (ESD Protection Diode), Bidirectional, +/-3.6 V, SOD-962 (SL2) Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    OUTLINE OF THE HEAT SINK FOR FBGA WITH JEDEC STANDARD Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    fbga Substrate design guidelines

    Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
    Text: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		PDF

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    smd transistor M7A

    Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
    Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages


    Original     		PDF PD41265L-12-E1 PD41256L PD23C32000AGX-$ PD23C32000A smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747

    CERAMIC PIN GRID ARRAY wire lead frame

    Abstract: BGA and QFP Package TO metal package aluminum kovar TSOP 2E TSOP 54 Package nail qfp 32 land pattern ceramic pin grid array package plating ceramic pin grid array package lead finish PGA wire bonding
    Text: Package Lineup/ Forms/ Structures 1. Package Lineup 2. Package Forms 3. Package Structures DB81-10002-2E 1 Package Lineup/ Forms/ Structures 1. Package Lineup PACKAGE 1. Package Lineup The packages are classified as follows, according to form, material, and the mounting methods


    Original     		PDF DB81-10002-2E CERAMIC PIN GRID ARRAY wire lead frame BGA and QFP Package TO metal package aluminum kovar TSOP 2E TSOP 54 Package nail qfp 32 land pattern ceramic pin grid array package plating ceramic pin grid array package lead finish PGA wire bonding

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


    Original     		PDF

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    Untitled

    Abstract: No abstract text available
    Text: Internet Data Sheet, Rev. 1.00, Apr. 2006 Cover Page HYS72T512422HFN–3.7–A 240-Pin F ully-Buffered DDR2 SDRAM Modules DDR2 SDRAM FB-DIMM SDRAM RoHS Compliant Products Green Product High-Speed Differential Point-to-Point Link Interface at 1.5 V Memory Products


    Original     		PDF HYS72T512422HFNâ 240-Pin DDR2-800 DDR2-667 DDR2-533 DDR2-400 03292006-QQ89-IKE4

    Untitled

    Abstract: No abstract text available
    Text: Internet Data Sheet, Rev. 1.00, Mar. 2006 Cover Page HYS72T512022HFN–3.7–A 240-Pin F ully-Buffered DDR2 SDRAM Modules DDR2 SDRAM FB-DIMM SDRAM RoHS Compliant Products Green Product High-Speed Differential Point-to-Point Link Interface at 1.5 V Memory Products


    Original     		PDF HYS72T512022HFNâ 240-Pin DDR2-800 DDR2-667 DDR2-533 DDR2-400 03292006-WK9O-3A6G

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    Untitled

    Abstract: No abstract text available
    Text: July 2008 HYS72T128401EFA–3S–C2 HYS72T256421EFA–3S–C2 HYS72T512[42/54]0EFA–3S–C2 240-Pin Fully-Buffered DDR2 SDRAM Modules DDR2 SDRAM EU RoHS Compliant Products Internet Data Sheet Rev. 1.15 Internet Data Sheet HYS72T[128/256/512][4/5][0/2/4][0/1]EFA–3S–C2


    Original     		PDF HYS72T128401EFA HYS72T256421EFA HYS72T512 240-Pin HYS72T

    HYS72T256521EFD-3S-C2

    Abstract: No abstract text available
    Text: July 2008 HYS72T128501EFD–3S–C2 HYS72T256521EFD–3S–C2 HYS72T5125[2/4]0EFD–3S–C2 240-Pin Fully-Buffered DDR2 SDRAM Modules DDR2 SDRAM EU RoHS Compliant Products Advance Internet Data Sheet Rev.0.80 Advance Internet Data Sheet HYS72T[128/256/512]5[2/4]0EFD–3S–C2


    Original     		PDF HYS72T128501EFD HYS72T256521EFD HYS72T5125 240-Pin HYS72T HYS72T256521EFD-3S-C2

    240-22

    Abstract: No abstract text available
    Text: Aug 2008 HYS72T128501EFD–3S–C2 HYS72T[256/512]4[20/21]EFD–3S–C2 HYS72T[256/512]5[20/21/40]EFD–3S–C2 HYS72T[256/512]5[20/21/40]EFD–25FC2 240-Pin Fully-Buffered DDR2 SDRAM Modules DDR2 SDRAM EU RoHS Compliant Products Advance Internet Data Sheet


    Original     		PDF HYS72T128501EFD HYS72T 25FC2 240-Pin 25F/3S 240-22

    Datasheet of IC 7432

    Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
    Text: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Aug. 2006 Cover Page HYS72T 512022 H FD– 3 . 7 – A Internet Data Sheet Rev. 1.10 Internet Data Sheet HYS72T512022HFD–3.7–A Revision History Revision History: Rev. 1.10, 2006-08-17 All Adapted internet edition All Converted Data Sheet with new template.


    Original     		PDF HYS72T HYS72T512022HFDâ

    HYS72T512520ELA-3S-C2

    Abstract: No abstract text available
    Text: July 2008 HYS72T256521ELA–[25F/3S–]C2 HYS72T5125[2/4]0ELA–[25F/3S–]C2 240-Pin Fully-Buffered DDR2 SDRAM Modules DDR2 SDRAM EU RoHS Compliant Products Internet Data Sheet Rev. 1.00 Internet Data Sheet HYS72T[256/512]5[2/4][0/1]ELA–[25F/3S–]C2 Fully-Buffered DDR2 SDRAM Modules


    Original     		PDF HYS72T256521ELA­ 25F/3S­ HYS72T5125 240-Pin HYS72T 07302008-O09L-EIBT HYS72T512520ELA-3S-C2

    Untitled

    Abstract: No abstract text available
    Text: December 2006 Cover Page HYS72T 512022 H FD– 3 . 7 – A 240-Pin Fully-Buffered DDR2 SDRAM Modules DDR2 SDRAM RoHS Compliant Products Internet Data Sheet Rev. 1.2 Internet Data Sheet HYS72T512022HFD–3.7–A 240-Pin Fully-Buffered DDR2 SDRAM Modules Revision History


    Original     		PDF HYS72T 240-Pin HYS72T512022HFD

    Untitled

    Abstract: No abstract text available
    Text: Aug. 2006 Cover Page HYS72T64400HFN–[3S/3.7]–A HYS72T128420HFN–[3S/3.7]–A HYS72T256420HFN–[3S/3.7]–A Internet Data Sheet Rev. 1.10 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFN–[3S/3.7]–A Revision History Revision History: Rev. 1.10, 2006-08-17


    Original     		PDF HYS72T64400HFNâ HYS72T128420HFNâ HYS72T256420HFNâ HYS72T

    PC2-4200F-444-11-A

    Abstract: PC2-5300F-555 PC25300F 555 11 Qimonda AG 2Rx4 PC2-5300F-555 HYS72T128420HFD-3S-B HYS72T128520HFD-3S-B qimonda HYS72T HYS72T64400HFD-3S-B amb qimonda
    Text: February 2007 Cover Page HYS72T64[4/5]00HFD–3S–B HYS72T128[4/5]20HFD–3S–B HYS72T256[4/5]20HFD–3S–B 240-Pin Fully-Buffered DDR2 SDRAM Modules DDR2 SDRAM RoHS Compliant Products Internet Data Sheet Rev. 1.2 Internet Data Sheet HYS72T[64/128/256][4/5][00/20]HFD–3S–B


    Original     		PDF HYS72T64 00HFD HYS72T128 20HFD HYS72T256 240-Pin HYS72T PC2-4200F-444-11-A PC2-5300F-555 PC25300F 555 11 Qimonda AG 2Rx4 PC2-5300F-555 HYS72T128420HFD-3S-B HYS72T128520HFD-3S-B qimonda HYS72T64400HFD-3S-B amb qimonda

    barometric pressure sensor

    Abstract: HYS72T64400HFD-3S-B
    Text: Aug. 2006 Cover Page HYS72T64400HFD–[3S/3.7]–B HYS72T128420HFD–[3S/3.7]–B HYS72T256420HFD–[3S/3.7]–B Internet Data Sheet Rev. 1.00 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFD–[3S/3.7]–B Revision History Revision History: Rev. 1.00, 2006-08-18


    Original     		PDF HYS72T64400HFD­ HYS72T128420HFD­ HYS72T256420HFD­ HYS72T rev400 04252006-P6YX-XQHO 00/ce. barometric pressure sensor HYS72T64400HFD-3S-B

    Untitled

    Abstract: No abstract text available
    Text: December 2006 Cover Page HYS72T64400HFN–[3S/3.7]–A HYS72T128420HFN–[3S/3.7]–A HYS72T256420HFN–[3S/3.7]–A 240-Pin Fully-Buffered DDR2 SDRAM Modules DDR2 SDRAM RoHS Compliant Products Internet Data Sheet Rev. 1.2 Internet Data Sheet HYS72T[64/128/256]4[00/20]HFN–[3S/3.7]–A


    Original     		PDF HYS72T64400HFN­ HYS72T128420HFN­ HYS72T256420HFN­ 240-Pin HYS72T