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    NSMD SMD Search Results

    NSMD SMD Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    BLM15PX121BH1D Murata Manufacturing Co Ltd FB SMD 0402inch 120ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM15PX181SH1D Murata Manufacturing Co Ltd FB SMD 0402inch 180ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM21HE802SN1L Murata Manufacturing Co Ltd FB SMD 0805inch 8000ohm NONAUTO Visit Murata Manufacturing Co Ltd
    BLM15PX330BH1D Murata Manufacturing Co Ltd FB SMD 0402inch 33ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM15PX600SH1D Murata Manufacturing Co Ltd FB SMD 0402inch 60ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM21HE601SN1L Murata Manufacturing Co Ltd FB SMD 0805inch 600ohm NONAUTO Visit Murata Manufacturing Co Ltd

    NSMD SMD Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Kostat

    Abstract: JEDEC Kostat AN101094-1 Kostat tray J-STD-013 AN-1126 pcb design 0,5 mm pitch Shipping Trays kostat 10 x 10 Kostat tray 3.0 JEDEC Kostat component tray
    Text: National Semiconductor Application Note 1126 September 1999 Printed Circuit Board PCB Layout Guidelines NSMD defined pads enhance vision registration of copper fiducials compared to the SMD defined pad. For SMD defined pads, any misregistration of the solder mask will contribute


    Original     		PDF AN-1126 Kostat JEDEC Kostat AN101094-1 Kostat tray J-STD-013 AN-1126 pcb design 0,5 mm pitch Shipping Trays kostat 10 x 10 Kostat tray 3.0 JEDEC Kostat component tray

    stencil tension

    Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
    Text: National Semiconductor Application Note 1112 June 2001 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning


    Original     		PDF AN-1112 stencil tension IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design

    IPC-SM-785

    Abstract: GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
    Text: National Semiconductor Application Note 1112 March 2002 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning


    Original     		PDF AN-1112 IPC-SM-785 GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP

    BGA-3000

    Abstract: smd ic marking A9 smd a10 shaker smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 top mark smd A9 250 micro solder ball
    Text: National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Technology SMT Assembly Considerations Printed Circuit Board Layout Stencil Printing Solder Paste


    Original     		PDF

    AN-1112

    Abstract: solder joint reliability IPC-SM-785 Solder paste stencil life thick bga die size Semiconductor smd marking BY SMD 420
    Text: National Semiconductor Application Note 1112 March 2002 Table of Contents Introduction to MICRO SMD . Package Construction .


    Original     		PDF

    BGA-3000

    Abstract: BGA reflow guide AN-1112 DEK268 AN100926-6 Amistar
    Text: National Semiconductor Application Note 1112 May 1999 CONTENTS Package Construction lation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for micro-SMD 8 I/O Smallest Footprint


    Original     		PDF AN-1112 BGA-3000 BGA reflow guide AN-1112 DEK268 AN100926-6 Amistar

    8 PIN SMD IC 211

    Abstract: BGA-3000 top mark smd A9 SMD MARK A9 shaker
    Text: National Semiconductor Application Note 1112 September 1999 CONTENTS Package Construction ing, singulation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for Micro SMD 4 and 8 I/O Packages


    Original     		PDF AN-1112 8 PIN SMD IC 211 BGA-3000 top mark smd A9 SMD MARK A9 shaker

    solder mask

    Abstract: BGA NSMD ball Application Note 1126 BGA
    Text: Solder Mask and Trace Recommendations for FBGAs Application Note By Rudy Sterner 1. Abstract This application note provides recommendations for solder masks used with FBGAs and escape considerations for traces. The recommendations reflect current industry practices. As always, it is a good idea


    Original     		PDF

    IPC-7095

    Abstract: J-STD-013 SM-782A
    Text: AND8075/D Board Mounting Considerations for FCBGA Packages Prepared by: Phill Celaya, Packaging Manager Mark D. Barrera, Broadband Knowledge Engineer http://onsemi.com APPLICATION NOTE APPLICATION NOTE USAGE Resin Seal Package Board Organic ÈÈÈÈÈÈÈÈÈÈÈÈÈÈ


    Original     		PDF AND8075/D r14525 IPC-7095 J-STD-013 SM-782A

    PBGA 256 reflow profile

    Abstract: bt 2328 pbga 144 BGA cte pbga JESD22-A113 OSP FLIPCHIP CRACK 304-pin dimensions bga jedec thermocouple WELD nsmd smd
    Text: Customer Applications Support and Reliability Test Center Page 1 Motorola General Business Information Customer Applications Support and Reliability Test Center Customer support for new and current packaging technology; Package-to-board Interconnect reliability


    Original     		PDF

    EPC16U88

    Abstract: No abstract text available
    Text: Designing With High-Density BGA Packages for Altera Devices Application Note 114 December 2007, ver. 5.1 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues


    Original     		PDF

    "0.4mm" bga "ball collapse" height

    Abstract: TMS320C6x BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch
    Text: TMS320C6x Manufacturing with the BGA Package APPLICATION REPORT: SPRA429 David Bell Digital Signal Processing Solutions March 1998 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of


    Original     		PDF TMS320C6x SPRA429 AN1231. TMS320C6201 "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch

    WLCSP stencil design

    Abstract: 7531A IPC-7531A FDZ191P FPF1003 AN-9045 WLCSP SMT IPC-SM-7525A FPF1004 JESD22-B102D
    Text: Application Note AN-9045 WLCSP Assembly Guidelines By Dennis Lang INTRODUCTION PAD FINISH Wafer level chip scale packaging WLCSP is actually an old packaging technology, likely the oldest finding significant growth today. The technology is valued today for the same reasons it


    Original     		PDF AN-9045 IPC-7531A JESD22-B102D, FPF1003, FPF1004, FDZ191P, FDZ193P WLCSP stencil design 7531A IPC-7531A FDZ191P FPF1003 AN-9045 WLCSP SMT IPC-SM-7525A FPF1004 JESD22-B102D

    "0.4mm" bga "ball collapse" height

    Abstract: BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 TMS320
    Text: TMS320 DSP Number 89 DESIGNER’S NOTEBOOK TMS320C6x Manufacturing with the BGA Package Contributed by David Bell April 14, 1998 Design Problem How do I solder the TMS320C6x to a board? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller


    Original     		PDF TMS320 TMS320C6x TMS320C6201 AN1231. "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231

    micro fineline BGA

    Abstract: Epoxy, glass laminate EPC16U88
    Text: Designing With Fineline BGA Packages for APEX, FLEX, ACEX, MAX 7000 & MAX 3000 Devices Application Note 114 October 2005, ver. 3.0 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues


    Original     		PDF

    Altera Flip Chip BGA warpage

    Abstract: cte table flip chip substrate 1806 footprint cte table epoxy substrate BGA cte cte table for epoxy adhesive and substrate with or without underfill bga warpage crack flip chip cte table epoxy
    Text: Reliability of Large Organic Flip-Chip Packages for Industrial Temperature Environments Anurag Bansal1, Yuan Li2, and Don Fritz2 1 Reliability Engineering Package Development Altera Corporation 101 Innovation Drive San Jose, CA 95134 abansal@altera.com 2 Abstract


    Original     		PDF

    ic 555 timer 10 minute

    Abstract: proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator
    Text: LMC555 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LMC555 AN-1112 ic 555 timer 10 minute proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator

    TRANSISTOR SMD MARKING CODE LF

    Abstract: SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin
    Text: LM431 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LM431 AN-1112 TRANSISTOR SMD MARKING CODE LF SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin

    SO8FL

    Abstract: FOOTPRINT PCB nsmd smd stencil tension WS3060 so8 pcb pattern 1505C 020C
    Text: AND8195/D Board Mounting Notes for SO8−Flat Lead Prepared by: Steve St. Germain, Phil Celaya, and Isauro Amaro ON Semiconductor http://onsemi.com APPLICATION NOTE INTRODUCTION Wire Bond Various ON Semiconductor devices are packaged in an advanced power leadless package named Quad Flat


    Original     		PDF AND8195/D SO8FL FOOTPRINT PCB nsmd smd stencil tension WS3060 so8 pcb pattern 1505C 020C

    nsmd smd

    Abstract: AN-289 PBGA256
    Text: BGA 256-pin Routing 1RWHV Application Note AN-289 By Paul Snell and John Afonasiev ,QWU ,QWURGXFWLRQ IDT uses the 256 PBGA package for several of its products. Although creating an optimal layout with a PBGA package is more challenging than with peripherally leaded packages such as the PQFP, this extra


    Original     		PDF 256-pin AN-289 nsmd smd AN-289 PBGA256

    AN-1126

    Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement
    Text: Table of Contents Introduction . 2 Package Overview . 3


    Original     		PDF AN-1126 AN-1126 AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement

    nsmd smd

    Abstract: AND8195 SO8FL Solder paste stencil life AND8195/D 020C 1505C
    Text: AND8195/D Board Mounting Notes for SO8−Flat Lead Prepared by: Steve St. Germain, Phil Celaya, and Isauro Amaro ON Semiconductor http://onsemi.com APPLICATION NOTE INTRODUCTION Wire Bond Various ON Semiconductor devices are packaged in an advanced power leadless package named Quad Flat


    Original     		PDF AND8195/D nsmd smd AND8195 SO8FL Solder paste stencil life AND8195/D 020C 1505C

    bga 0,8 mm

    Abstract: tray matrix bga AN-1126 MO-151 fine BGA thermal profile an1126
    Text: National Semiconductor Application Note 1126 December 2000 CONTENTS Introduction Package Overview PBGA Construction EBGA Construction Package Handling/Shipping Media Design Recommendations Solder Pad Geometry Escape Routing Guidlines Via Density Assembly Recommendations


    Original     		PDF

    IPC-6011

    Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
    Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications


    Original     		PDF 1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6011 IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222