PCN0119
Abstract: Nitto-HC100 HC100 shin-etsu nitto hc100 Nitto HC 672-BALL Compound Nitto EP20K200E
Text: PROCESS CHANGE NOTICE PCN0119 FineLine BGA Package Molding Compound Change Change Description: ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100. This change will not affect the package thickness specification, overall
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PCN0119
HC-100.
HC-100
EPF10K100E
484-Ball
EPF10K130E
EP20K200E
484-Ball
PCN0119
Nitto-HC100
HC100
shin-etsu
nitto hc100
Nitto HC
672-BALL
Compound
Nitto
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PCN0415
Abstract: HC100-XJ Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking
Text: PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera FineLine BGA® packages assembled at ASE Malaysia. This change does not affect form, fit or function.
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PCN0415
HC100-XJ
HC100-XJAA
PCN0415
Nitto Denko HC100-XJ
Denko
trace code altera
HC100
HC100XJAA
altera top marking
nitto hc100
altera marking
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PCN0515
Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently
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PCN0515
HC-100
UL-94
1x1011
PCN0515
sumitomo G770
G770* sumitomo
G770 mold compound
G770 sumitomo
Unbiased HAST 130, 85 RH, 100 Hrs
G770
G770* G770 mold compound Sumitomo 1000
thermal conductivity of sumitomo g770
G770 HC
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R7181-38
Abstract: ablebond HC100 HC100XJAA mold compound Compound HC100-XJAA
Text: August 12, 2009 CN 081209 Customer Notification R7181-38 Mold Compound Change Dear Valued Customer: This notification is for the purpose of informing you of a change to the mold compound material for the R7181-38. Purpose Amkor has notified Mindspeed that their supplier has discontinued the Cookson SMT-B1 and
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R7181-38
R7181-38.
HC100XJAA
R7181-39.
ablebond
HC100
mold compound
Compound
HC100-XJAA
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ABLEBOND
Abstract: M28945-13 HC100 HC100XJAA M28945 Nitto mold compound 28237-12 M28950-13 Amkor mold compound
Text: August 7, 2009 CN 080709 Customer Notification Mold Compound Change Dear Valued Customer: This notification is for the purpose of informing you of a change to the mold compound material for the parts listed below. Purpose Amkor has notified Mindspeed that their supplier has discontinued the Cookson SMT-B1 and
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HC100XJAA
CX28398-27
M28947-13
M28945-13
M28950-13
M28946-13
ABLEBOND
M28945-13
HC100
M28945
Nitto
mold compound
28237-12
M28950-13
Amkor mold compound
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JEDEC JESD22-B117
Abstract: JESD22-B117 Nitto HC Maxim ic date code Nitto 17X17X1 HC100 underfill JESD22-B100
Text: 01/23/2004 RELIABILITY REPORT FOR DS21Q55, Rev B2, ASAT no underfill Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292
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DS21Q55,
30C/60%
JEDEC JESD22-B117
JESD22-B117
Nitto HC
Maxim ic date code
Nitto
17X17X1
HC100
underfill
JESD22-B100
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PCN0116
Abstract: nitto hc100 HC100 Nitto EPF10K100E EPF10K130E EPF10K200E EPF10K200S
Text: PROCESS CHANGE NOTICE PCN0116 FineLine BGA Assembly Plant Addition Change Description: Amkor, Korea will be added as a second source for FineLine BGAä packages currently assembled in ASAT, Hong Kong. This change will not affect moisture rating, nor will there
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PCN0116
HC100
EPF10K100E
484-Ball
EPF10K130E
EPF10K200S
672-Ball
EPF10K200E
PCN0116
nitto hc100
HC100
Nitto
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nitto GE
Abstract: GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-07 Product Affected: DATE: September 17, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 17mm x 17mm TEBGA-580 (Green) Product Mark
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A1008-07
TEBGA-580
facilitSD22-A110
JESD22-A104
JESD22-A103
JESD22-A113
SXVX-110BHG
SXVX-200BHG
SXVX-210BHG
nitto GE
GE-100L
SXVX-50BHG
nitto GE-100L
SXVX-210BHG
SXVX-50
HL832NX
SXVX-210
Nitto GE 100
HL832HS
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Sn95Sb5
Abstract: QMI519 nitto hc100 QMI-519 epoxy qualification Qualification JESD22-C101-C CARSEM HC100 JESD22-A115
Text: Product Qualification Report Skyworks Part Number: SKY12145-315 Product Type: HIP3 Variable Attenuator for UMTS Base Stations Report No: 300374 Approved by: Product/Package Reliability: Tom Wood Prepared by Skyworks Solutions, Inc. Product / Package Reliability Group
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SKY12145-315
SKY12145-315
SKY12145-315.
JESD22-A114-B,
JESD22-C101-C,
JESD22-A115-A.
Sn95Sb5
QMI519
nitto hc100
QMI-519
epoxy qualification
Qualification
JESD22-C101-C
CARSEM
HC100
JESD22-A115
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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JESD22-B117
Abstract: JEDEC JESD22-B117 JESD22B117 dallas date code JESD22-B100
Text: 05/06/2003 RELIABILITY REPORT FOR Dallas, no underfill, 144 Chip Scale BGA Interposer Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy.
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NITTO HC-100-XJAA-M
Abstract: CRM1525D HC100-XJ HC100 HC-100-XJAA-M HC100-XJAA JEDEC JESD22-B117
Text: 12/17/2003 RELIABILITY REPORT FOR DS31412, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS31412,
30C/60%
NITTO HC-100-XJAA-M
CRM1525D
HC100-XJ
HC100
HC-100-XJAA-M
HC100-XJAA
JEDEC JESD22-B117
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S 0319
Abstract: CRM1525D
Text: 12/17/2003 RELIABILITY REPORT FOR DS3146, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS3146,
30C/60%
S 0319
CRM1525D
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J-STD-020
Abstract: HC100-XJ JSTD-020 NITTO HC-100-XJAA-M 94V-0 0303
Text: 05/21/03 RELIABILITY REPORT FOR DS4000, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS4000,
JESD78,
J-STD-020
HC100-XJ
JSTD-020
NITTO HC-100-XJAA-M
94V-0 0303
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Ablebond 8390
Abstract: sil154 kyro PowerVR B1G5 HC100 PowerVR imagination technologies bitblt kyro 2 Bt868
Text: Integrated 2D/3D graphics accelerator – Product Overview PRELIMINARY DATA FEATURES • PowerVR Series 3 arcade performance 3D ● DirectX7 Flexible Vertex Format support ● 8 layer Multi-texturing ● Twin high performance texturing pipelines ● Full triangle setup hidden surface
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128-bit
Ablebond 8390
sil154
kyro
PowerVR
B1G5
HC100
PowerVR imagination technologies
bitblt
kyro 2
Bt868
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taiyo PSR4000
Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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fBGA package tray 12 x 19
Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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bcm 4330
Abstract: telemecanique contactor catalogue A5 GNC mosfet philips ecg master replacement guide Elektronikon II keltron electrolytic capacitors PART NO SELEMA DRIVER MOTOR AC 12v dc EIM Basic MK3 lenze 8600 Atlas copco rc universal 60 min
Text: NEED IT NOW? BUY REMAN! SEE PAGE lxx xx xvi SOLUTIONS, SOLUTIONS. Q A r e q u a l i t y, c o s t , a n d t i m e i m p o r t a n t to you? A ELECTRICAL SOUTH! Q Do you spend too much of your valuable time dealing with too m a n y d i ff e r e n t r e p a i r v e n d o r s ?
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