Nitto
Abstract: CY7C199 JESD22
Text: Qualification Report August 1996, QTP# 96114, Version 1.0 NITTO LOW ALPHA MOLDING COMPOUND PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:
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CY7C199
28-pin,
300-mil
7C199C
0075V)
CY7C199-VC
85C/85
Nitto
CY7C199
JESD22
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M24C16K
Abstract: Nitto MP8000 QREE0016 Nitto MP8000 601 so8
Text: QREE0016 QUALIFICATION REPORT MP8000 Mold Compound SO8 Shenzhen THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called MP8000 used on SO8 package Small Outline Package in Shenzhen plan. This
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QREE0016
MP8000
R99008)
M24C16K
M24C08L
M24256N
M24C16K
Nitto MP8000
QREE0016
Nitto
601 so8
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MP8000
Abstract: MP-8000 Nitto MP8000 QREE0023 mold compound
Text: QREE0023 QUALIFICATION REPORT MP8000 Mold Compound SO14 Muar THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called MP8000 used on SO14 package Small Outline Package in Muar plan. This material
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QREE0023
MP8000
R99008)
M93CS66F
M93CS66F
MP-8000
Nitto MP8000
QREE0023
mold compound
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t7778a
Abstract: LM24014H LM24014 T7778 T7900 74HC138F LF0B08 T7900 LCD LF0B09 LM2401
Text: LM24014H Dot Matrix LCD Unit LCD Data Sheet FEATURES DESCRIPTION • Display Format: 240 x 64 The SHARP LM24014H Dot Matrix LCD Unit is a 240 × 64 full dot graphic display unit which consists of gray type STN, transflective mode, positive type with an LCD controller and a CG-ROM. NITTO transflector P1 type R = 66.4% (TYP , T = 30.4% (TYP).
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LM24014H
LM24014H
LF0B08
LF0B09
254Px9)
t7778a
LM24014
T7778
T7900
74HC138F
LF0B08
T7900 LCD
LF0B09
LM2401
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nitto SWT 10
Abstract: nitto SWT-20 W07 sot 23 w04 transistor sot 23 UE-111AJ W04 sot 23 transistor w07 transistor marking w08 marking W07 transistor marking w04
Text: PRODUCT CODING SYSTEM QSP0005_WEB.028 1 2.4.2007 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document. ESD EWS ID MAS MBB T&R 2 Electrostatic Sensitive Device
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QSP0005
MAS1234AB3
MAS1234AB3xxxxx)
98AA2
MAS9198AA2xxxxx)
nitto SWT 10
nitto SWT-20
W07 sot 23
w04 transistor sot 23
UE-111AJ
W04 sot 23
transistor w07
transistor marking w08
marking W07
transistor marking w04
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UE-111AJ
Abstract: nitto SWT-20 transistor marking PB nitto UE111AJ ke marking transistor 2091J Nitto marking code transistor HK mas1025 UE111
Text: 1 PRODUCT CODING SYSTEM 9.12.2004 QSP0005_WEB.026 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document: ESD EWS ID MBB T&R 2 Electrostatic Sensitive Device
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QSP0005
MAS1025AC
MAS1025ACSAxx)
MAS9124AACAxx)
UE-111AJ
nitto SWT-20
transistor marking PB
nitto UE111AJ
ke marking transistor
2091J
Nitto
marking code transistor HK
mas1025
UE111
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Sumitomo G700K
Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077,
JESD78,
Sumitomo G700K
sumitomo 6600h
Compound c7025
JESD22-B101
Nitto MP8000
G700K
SUMITOMO-G600
epoxy 8290
ablebond ablestik 8290
SUMITOMO g600 UL
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Nitto MP8000
Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1086,
JESD78,
Nitto MP8000
Sumitomo G700K
g700k
JESD78
JESD-78
sumitomo 6600h
ablebond ablestik
BCB4026
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Sumitomo G700K
Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Text: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1094L,
JESD78,
Sumitomo G700K
SUMITOMO g600
Ablestik 84-1
sumitomo 6600h
G700K
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PCN0515
Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently
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PCN0515
HC-100
UL-94
1x1011
PCN0515
sumitomo G770
G770* sumitomo
G770 mold compound
G770 sumitomo
Unbiased HAST 130, 85 RH, 100 Hrs
G770
G770* G770 mold compound Sumitomo 1000
thermal conductivity of sumitomo g770
G770 HC
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PCN0702
Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line
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PCN0702
PCN0702,
6300HJ
G700M
PCN0702
MP8000CH4
48hrs)
X10-5
UL-94
SUMITOMO G700
SUMITOMO G600
SUMITOMO EME G700
sumitomo 6300h mold compound
SUMITOMO EME G600
EME G600
material properties G600 mold compound
sumitomo G700 Tg
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PCN0712
Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array
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PCN0712
CEL-9750ZHF10AKL
GE-100LFCS
GE-100LFCS
PCN0712
GE100LFCS
SUMITOMO EME G770
Hitachi CEL-9750ZHF10AKL
nitto GE
sumitomo g770
EME-G770
Nitto GE100LFCS
Nitto GE 100
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ABLEBOND
Abstract: No abstract text available
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1086L,
JESD78,
ABLEBOND
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G700K
Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077L,
JESD78,
G700K
Nitto MP8000
Sumitomo G600
Sumitomo G700K
JESD78
sumitomo 6600h
Compound c7025
JESD-78
BCB4026
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Untitled
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1818, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1818,
JESD78,
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mark a7 sot23
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1815, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1815,
JESD78,
mark a7 sot23
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Ablebond 84-1 LMISR4
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1812, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1812,
JESD78,
Ablebond 84-1 LMISR4
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Untitled
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1813, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1813,
JESD78,
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mark a7 sot23
Abstract: J-STD-20A atec 6710S CDA194 mp8000
Text: 08/23/2004 RELIABILITY REPORT FOR DS1816, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1816,
JESD78,
mark a7 sot23
J-STD-20A
atec
6710S
CDA194
mp8000
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CDA194
Abstract: mark a7 sot23
Text: 08/23/2004 RELIABILITY REPORT FOR DS1810, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1810,
JESD78,
CDA194
mark a7 sot23
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LMISR4
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1811, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1811,
JESD78,
LMISR4
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nitto GE
Abstract: GE-7470L-A G770H GE-74 sumitomo g770h GE mold compound Nitto HI-3582PCI-10 mold compound 7470-LA
Text: Assembly Location and Mold Compound Change for QFN Packages Product Change Notice PCN0806 v1.0 September 12, 2008 Overview This notice describes two changes to the ARINC 429 and MIL-STD 1553 family of devices which are manufactured in QFN packages: o Assembly plant location change for all QFN Packages (40PCS, 44PCS, and 64PCS) from current CARSEM,
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40PCS,
44PCS,
64PCS)
GE-7470L-A
PCN0806
JESD46-C,
QR-8033
QFN-64
nitto GE
G770H
GE-74
sumitomo g770h
GE mold compound
Nitto
HI-3582PCI-10
mold compound
7470-LA
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japan servo co
Abstract: "japan servo" Air COnditioner toyama sagami transformer koganei Denko Japan Servo development trends in car manufacture hitachi-metals toner sagami transformer 5
Text: Data on Environmental Performance Fiscal 1999 í Contents b Environmental Management System GREEN 21 .1 • Hitachi Group Average Green Point Scores .1 • Green Points for Hitachi, Ltd. and Affiliated Firms .1
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14001-Certified
japan servo co
"japan servo"
Air COnditioner toyama
sagami transformer
koganei
Denko
Japan Servo
development trends in car manufacture
hitachi-metals toner
sagami transformer 5
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cirocomm gps receiver
Abstract: cirocomm Cirocomm GPS
Text: AP.12B.07.0046A Specification Part No. AP.12B.07.0046A Product Name 12mm Two Stage Active GPS Patch Antenna Feature Ultra Miniature GPS active patch High performance Ultra low power consumption RoHS compliant SPE-11-8-126/B | page 1 of 13 1. Introduction This miniaturised GPS Active Antenna
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SPE-11-8-126/B
cirocomm gps receiver
cirocomm
Cirocomm GPS
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