realtek alc883
Abstract: ALC883 i7-920 CSE-733TQ-465B intel i7 nehalem ICH10R i7 920
Text: Hom e C onta ct Us Search Adva nce d Se arch X8SAX Products Motherboards Xeon Boards [ X8SAX ] Key Features 1. Intel Core i7 / i7 Extreme Edition, and future Intel® Nehalem processor families QPI up to 6.4 GT/s Links & Resources 2. Intel® X58 Express Chipset
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82574L
64-bit
133/100MHz
32-bit
ALC883
1394a
CBL-0044L
CBL-0173L
MCP-260-00030-0N
realtek alc883
i7-920
CSE-733TQ-465B
intel i7 nehalem
ICH10R
i7 920
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Untitled
Abstract: No abstract text available
Text: NAR-7102 Tylersburg platform Intel 5520 , Up to 10 GbE ports Intel Nehalem-EP and Westmere-EP Flexible Ethernet modules Up to ten Gigabit Ethernet ports PCI-E X 8 expansion slot Redundant 275W ATX PSU Support Compact Flash and Disk on Module(DOM)
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NAR-7102
82574L)
E5645
E5620
L5638
L5618
E5540
NAR-7102-1011
E5504
E5518
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FHS-A6025B01
Abstract: W5500 Dow Corning 2073 Dow Corning TC-1996 2759T A602 Dow Corning TC 1996 intel nehalem e5500 TC-1996
Text: Model Name: FHS-A6025B01 DELTA ELECTRONICS, INC. Application: • Intel Nehalem Socket 1366 2U • Xeon 45nm W5500/X5500/E5500/L5500 CPU sequence Pictures Thermal & Mechanical Spec.: • Thermal performance for 130W CPU • HSK Assembly Weight: 590 g (ref.)
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FHS-A6025B01
W5500/X5500/E5500/L5500
A1100/ADC12/C1100
TC-1996
60x60x25
2759T
27-Apr-07
FHS-A6025B01
W5500
Dow Corning 2073
Dow Corning TC-1996
A602
Dow Corning TC 1996
intel nehalem
e5500
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LGA1156
Abstract: LGA115 a6063 intel i5 Dow Corning TC 1996 2759t Dow Corning TC-1996* Dow Corning TC-1996 LGA1156 thermal
Text: 2009 Ne w LGA115 6 FHS-A9025S19 DELTA ELECTRONICS, INC. Application: Intel Core i5 Picture: Intel LGA1156 Nehalem(45nm 95W) / Westmere (32nm 87W) CPU Lynnfield & Clarkdale sequence (Low Profile M/B mounting hole pitch 75x 75mm) Thermal & Mechanical Spec.:
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LGA115
FHS-A9025S19
LGA1156
A6063
C1100
TC-1996
90x90x25
Vo7054-1000
2759T
July-2009
LGA115
a6063
intel i5
Dow Corning TC 1996
Dow Corning
TC-1996* Dow Corning
LGA1156 thermal
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intel nehalem
Abstract: A1050 4405 Delta Electronics TC-1996 young
Text: Model Name: DHS-B9090-11 DELTA ELECTRONICS, INC. 1. Application: Intel Nehalem Socket 1366 1U Passive HSK 2.Material：Fin: Aluminum A1050 + Base: Copper 1100 3.Weight：410g 4.Type：Soldering 5.Dimension：90*90*27 mm 6.Heat source size：34*32(mm) 7.Thermal Interface Material：TC-1996
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DHS-B9090-11
A1050
Weight410g
Dimension90
size34
MaterialTC-1996
27-Apr-07
intel nehalem
A1050
4405
Delta Electronics
TC-1996
young
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Dow Corning TC 1996
Abstract: Dow Corning TC-1996 TC-1996 225G delta 4405 Dow Corning Taiwan nehalem DHS-B9090-22 TC-1996* Dow Corning
Text: Model Name: DHS-B9090-22 DELTA ELECTRONICS, INC. 1. Application：Intel Nehalem/Westmere Socket 1366 1U Passive HSK 2. Material：Al1050 + Vapor chamber + SK7 3. Weight：225g 4. Type：Soldering 5. Dimension：90*90*25.5 [mm^2] 6. Heat source size：34*32 [mm^2]
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DHS-B9090-22
MaterialAl1050
Weight225g
Dimension90
size34
TC-1996
Dow Corning TC 1996
Dow Corning TC-1996
TC-1996
225G
delta
4405
Dow Corning Taiwan
nehalem
DHS-B9090-22
TC-1996* Dow Corning
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i7 nehalem
Abstract: intel nehalem nehalem intel i7
Text: White Paper November 2008 Intel Turbo Boost Technology in Intel® Core Microarchitecture Nehalem Based Processors 2 White Paper Table of Contents Table of
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WPCM450R
Abstract: lsi 2108 LSI SAS 2108 WPCM450 SC818 X8QB6
Text: SUPER X8QB6/X8QBE Specifications Key Features 1. Intel® Xeon® processor 7500 series codenamed Nehalem-EX 2. Intel® 7500 Chipset 3. Up to 256Gb DDR3 Reg. ECC in 32 DIMM 4. Dual-Port Intel PCI-Express Gigabit Ethernet 5. SATA controller support 6 SATA; RAID 0, 1, 5, 10
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256Gb
SC818TQ-R1400
SC748TQ-R1400
WPCM450R
lsi 2108
LSI SAS 2108
WPCM450
SC818
X8QB6
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auc0912d
Abstract: Delta 3 wire fan
Text: FHS-A9015S00 DELTA ELECTRONICS, INC. Application: Picture: Intel Nehalem LGA1156 45nm & Intel Sandy Bridge LGA1155 (32nm) Thermal & Mechanical Spec Thermal performance for 45 W CPU HSK Assembly Weight: 120 g (ref.) Clipping Force: 16 Kgf (ref.) Component Specification:
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FHS-A9015S00
LGA1156
LGA1155
A6063
TC-1996
90x90x17
auc0912d
Delta 3 wire fan
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bcm5709 sr-iov
Abstract: BCM5709 Broadcom 5709 vmxnet netxtreme BCM5709C Broadcom shell SR-IOV-WP100-R BCM5709 SRIOV procurve
Text: White Paper SR-IOV Architecture and Benefits on VMware ESX HP and Broadcom® are natural partners in providing customers with a server and storage infrastructure under a virtualization environment. The trend towards server virtualization has advanced the market offerings and role for I/O virtualization IOV . IOV plays an essential role in
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SR-IOV-WP100-R
bcm5709 sr-iov
BCM5709
Broadcom 5709
vmxnet
netxtreme
BCM5709C
Broadcom shell
SR-IOV-WP100-R
BCM5709 SRIOV
procurve
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FCLGA1366
Abstract: L5518 computer processor spec 45NM60 at80602002
Text: Intel Xeon® Processor L5518 8M Cache, 2.13 GHz, 5.86 GT/s Intel® QPI with SPEC Code(s) SLBFW Compare Queue (0) Send Feedback Home Intel® Processors Intel® Xeon® Processor Intel® Xeon® Processor 5500 Series ● Products ● Technology ● Communities●
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L5518
L5518
64-bit
FCLGA1366
computer processor spec
45NM60
at80602002
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"pilot ii"
Abstract: SC5650 SC5650DP APP3RACKIT SC5650BRP SC5600 MB intel canada ices 003 ARIGRACK S5520hc intel device mark
Text: Product Brief Intel Server Board S5520HC Intel® Server Chassis SC5600 Intel® Server Chassis SC5650 Intel® Server Board S5520HC Intel® Server Chassis SC5600 Intel® Server Chassis SC5650 A pedestal-optimized server product family designed with world-class performance, scalable management, and maximum
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S5520HC
SC5600
SC5650
0309/JH/MD/PDF
320936-001US
"pilot ii"
SC5650
SC5650DP
APP3RACKIT
SC5650BRP
MB intel canada ices 003
ARIGRACK
intel device mark
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Matrox g200eW
Abstract: MATROX
Text: Contact Us Advanced Search Reseller Resource Center X8DTi Products Motherboards Xeon Boards [ X8DTi ] Key Features Links & Resources 1. Intel Xeon® processor 5600/5500 series, with QPI up to 6.4 GT/s Tested Memory List 2. Intel® 5520 Tylersburg Chipset
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192GB
800MHz
ICH10R
33MHz
G200eW
Matrox g200eW
MATROX
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socket lga 1156 pinout
Abstract: i3 processor ITE 8502 intel i3 lga 1156 switch 89HI0524G2PS socket lga 1156 DDR3 pcb layout guidelines IPMI BMC 82574L flash programming
Text: Intel Server Board S3420GPRX Technical Product Specification Intel order number E92065-001 Revision 1.0 March 2010 Enterprise Platforms and Services Division Revision History Intel® Server Board S3420GPRX TPS Revision History Date Oct. 2009 Revision Number
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S3420GPRX
E92065-001
S3420GPRX
16-bit
S5520HC
S5520HCS5500HCV
S3420GP
socket lga 1156 pinout
i3 processor
ITE 8502
intel i3
lga 1156
switch 89HI0524G2PS
socket lga 1156
DDR3 pcb layout guidelines
IPMI BMC
82574L flash programming
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BGA1288
Abstract: rPGA-988 circuit diagram laptop motherboard CN80617005745AB arrandale cn80617 i3 laptop MOTHERBOARD pcb CIRCUIT diagram i7-600 Mobile INTEL nehalem CPU arrandale MSR
Text: Intel Core i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series Datasheet — Volume One This is volume 1 of 2. Refer to document 322813 for Volume 2 January 2010 Document Number: 322812-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
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i7-600,
i5-500,
i5-400
i3-300
i7-610E
11-Feb-2011
BGA1288
rPGA-988
circuit diagram laptop motherboard
CN80617005745AB
arrandale
cn80617
i3 laptop MOTHERBOARD pcb CIRCUIT diagram
i7-600 Mobile
INTEL nehalem CPU
arrandale MSR
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A23 851 diode
Abstract: 741p BGA1288 AC-DC Adapter circuit diagram laptop motherboard power supply diagram of laptop motherboard do regulator 2gb 3.3v AK66 Diode AF51 intel Penryn
Text: Intel Celeron® Mobile Processor P4000 and U3000 Series Datasheet Revision 001 October 2010 Document Number: 324471-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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P4000
U3000
A23 851 diode
741p
BGA1288
AC-DC Adapter
circuit diagram laptop motherboard
power supply diagram of laptop motherboard do
regulator 2gb 3.3v
AK66
Diode AF51
intel Penryn
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Untitled
Abstract: No abstract text available
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 04 — 25 November 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
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EZIO-300
Abstract: LGA1366 atx power 500W 24 pin atx 500W intel nehalem EZIO-G400 ABN-522 82571EB 128X64 LCD 2X16 lcd module
Text: NAR-7100 PCI-Express Gen2 2U communication appliance rack-mount server with Dual Quad-core processors for high-performance application n n n n n n n n Dual Quad-core Xeon E55XX w/ 8M cache Flexible removable Ethernet/HDD modules w/ PCI-E Gen.2 Up to twenty-six Gigabit Ethernet ports
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NAR-7100
E55XX
128x32,
128x64
E55XX/L55XX
800/1066/133roject
E5540
LGA1366
E5504
EZIO-300
LGA1366
atx power 500W 24 pin
atx 500W
intel nehalem
EZIO-G400
ABN-522
82571EB
128X64 LCD
2X16 lcd module
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lan rj45 color code diagram
Abstract: NTP 7100 128X64 graphical LCD screen RTL8111 Realtek PCIe GBE Family Controller cn5010 16 pin diagram of lcd display 16x2 CN5020 Realtek RTL8111 SL3516
Text: Complete Your Networld www.cas-well.com 3G Wireless Wireless Gateway Media Server VoIP, Video/Image Processing Network Management ( RAS, QoS, Load Balancing ) Security ( Firewall/VPN, IDS/IPS, Anti-Virus, TABLE of CONTENTS 2 4 9 About CA Reference Table
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PMG-7095
NAR-7100
NAR-7090
NAR-5650
M090507
lan rj45 color code diagram
NTP 7100
128X64 graphical LCD screen
RTL8111
Realtek PCIe GBE Family Controller
cn5010
16 pin diagram of lcd display 16x2
CN5020
Realtek RTL8111
SL3516
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u5000
Abstract: No abstract text available
Text: Intel Pentium® P6000 and U5000 Mobile Processor Series Datasheet This is volume 1 of 2. Refer to Document 322813 for Volume 2 Revision 004 January 2011 Document Number: 323873-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
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P6000
U5000
u5000
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LGA1156
Abstract: lga 1155 LGA weight lga1155
Text: This document was generated on 08/08/2012 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 47596-8830 Active LGA 1155 and LGA 1156 Back-plate Assembly, Shoulder Screw and 2 Pan Screws for Desktop PC, Lead-Free, Halogen-Free
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PS-47596-001
LGA1156
47596Series
PS-47596-001
SD-47596-107
lga 1155
LGA weight
lga1155
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PWS-1K41F-1R
Abstract: iBBU07 CBL-0097L-02 SAS2108 BTR-0018L-0000-LSI lsi 2108 LSI SAS 2108 0420L 83527HB 836 vga cable
Text: Contact Us Advanced Search Search Reseller Resource Center SuperServer 8026B-6RF Products Systems [ 8026B-6RF ] 2U Key Features Integrated Board 1. Quad Intel Xeon® processor 7500 series 8-Core or new gen. Intel® Xeon® processors E7-4800 family (10-Core), with QPI up to 6.4 GT/s
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8026B-6RF
E7-4800
10-Core)
512GB
IBBU07
SAS2108
1066MHz
PWS-1K41F-1R
CBL-0097L-02
BTR-0018L-0000-LSI
lsi 2108
LSI SAS 2108
0420L
83527HB
836 vga cable
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W83527
Abstract: WPCM450 rtl8201n spi flash memory 8gb 1000w 12v dc regulator
Text: Contact Us Advanced Search Search Reseller Resource Center SuperServer 1026TT-IBQF Products Systems 1U [ 1026TT-IBQF ] Key Features Integrated Boards Two systems nodes in a 1U form factor. Each node supports the following: 1. Intel Xeon® processor 5600/5500
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1026TT-IBQF
192GB*
800MHz
40Gbps
W83527
WPCM450
rtl8201n
spi flash memory 8gb
1000w 12v dc regulator
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samsung DDR3 SDRAM 2GB
Abstract: i7 nehalem DDR3 DIMM Samsung ddr3 1600 SDRAM
Text: Memoria DDR3: da oggi potrai Fare più cose con meno energia. Samsung Semiconductor Europe, 2008 e l'Immaginazione spicca 11volo © Samsung Semiconductor Europe 2008 Memoria avanzata DDR3 Samsung per PC Il nuovo standard prestazionale nel campo delle memorie
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240pin
25GB/secondo.
D-65760
samsung DDR3 SDRAM 2GB
i7 nehalem
DDR3 DIMM
Samsung ddr3 1600 SDRAM
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