MS-022
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Metric Plastic Quad Flatpack Packages MQFP D MDP0055 D1 14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT SPREADER) 3.2mm FOOTPRINT 128 PIN 1 ID 1 SYMBOL 20.000 ±0.100 (E1) 19.870 ±0.100 18.500 REF E1 E 12.500 REF C0.600x0.350
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MDP0055
14x20mm
MS-022.
MS-022
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tip 220
Abstract: MS022 MS-022 r025 14X20MM
Text: Plastic Packages for Integrated Circuits Metric Plastic Quad Flatpack Packages MQFP D MDP0055 D1 14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT SPREADER) 3.2mm FOOTPRINT 128 PIN 1 ID 1 DIMENSIONS (MILLIMETERS) A Max 3.40 20.000 ±0.100 (E1) 19.870 ±0.100
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MDP0055
14x20mm
MS-022.
tip 220
MS022
MS-022
r025
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ipc-SM-782
Abstract: 14x14-64 MQFP 14X14 AN49 fairchild 245
Text: www.fairchildsemi.com Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to
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AN30000049
ipc-SM-782
14x14-64
MQFP 14X14
AN49
fairchild 245
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ipc-SM-782
Abstract: 128 QFP 14x20 footprint jedec mo-108 RAYTHEON Raytheon Electronics MQFP 80 PACKAGE qfp 64 land pattern qfp land pattern QFP-10X10-44 Raytheon Company
Text: Electronics Semiconductor Division Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to
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AN30000049
ipc-SM-782
128 QFP 14x20
footprint jedec mo-108
RAYTHEON
Raytheon Electronics
MQFP 80 PACKAGE
qfp 64 land pattern
qfp land pattern
QFP-10X10-44
Raytheon Company
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QFP JEDEC tray
Abstract: JEDEC TRAY QFP QFP 14 14 tray SSD-A-H5899-1 QFp Package tray JEDEC tray standard
Text: TRAY CONTAINER 105.0 150°C MAX A' 27.00 18.6 21.00 MQFP 14x20 2.7mm A 15.45 24.6 22.50 270.0 315.0 322.6 SECTION A – A' 24.6 Applied Package 4.82 6.35 19.6 7.62 135.9 UNIT : mm Quantity (pcs) MQFP 14 × 20 2.7mm Tray Carbon PPE 64-pin Plastic QFP (2.7mm thick)
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64-pin
80-pin
100-pin
SSD-A-H5899-1
QFP JEDEC tray
JEDEC TRAY QFP
QFP 14 14 tray
SSD-A-H5899-1
QFp Package tray
JEDEC tray standard
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QFP JEDEC tray
Abstract: QFP 14 14 tray qfp tray standard
Text: 105.0 150°C MAX A' 27.00 18.6 21.00 MQFP 14x20 2.7mm A 15.45 24.6 22.50 270.0 315.0 322.6 SECTION A – A' 24.6 4.82 6.35 19.6 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) Tray 64-pin Plastic QFP (2.7mm thick) MAX. 66 Material 80-pin Plastic QFP (2.7mm thick)
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64-pin
80-pin
100-pin
QFP JEDEC tray
QFP 14 14 tray
qfp tray standard
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2701 NEC
Abstract: nec 2701
Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 64 65 41 40 detail of lead end S C D R Q 25 24 80 1 F J G H I P M K M N S L NOTE ITEM 1. Controlling dimension
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LA-2244A-1
LA-1244A-1
LA-044A-1
S80GF-80-3B9-4
2701 NEC
nec 2701
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NEC 2701
Abstract: 2701 NEC JEDEC tray dimension SC-581-A LA-044A-1 r-2524
Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 41 40 64 65 detail of lead end S C D Q R 25 24 80 1 F G J H I M K P M N S L S NOTE 1. Controlling dimension
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LA-2244A-1
LA-1244A-1
LA-044A-1
P80GF-80-3B9-4
SC-581-A
NEC 2701
2701 NEC
JEDEC tray dimension
SC-581-A
LA-044A-1
r-2524
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NEC 2701
Abstract: NEC D 582 2701 NEC LA-1244A-1 transistor NEC D 582 QFP JEDEC tray 1802M
Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 detail of lead end 33 32 C D S R Q 64 1 20 19 F G H I M P J K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of
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LA-2244A-1
LA-1244A-1
LA-044A-1
SC-582-A
P64GF-100-3B8,
P64GF-100-3B8
NEC 2701
NEC D 582
2701 NEC
LA-1244A-1
transistor NEC D 582
QFP JEDEC tray
1802M
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NEC 2701
Abstract: 2701 NEC P100GF-65-3BA1-3
Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 51 50 80 81 detail of lead end C D S R Q 31 30 100 1 F J G H I M P K M N L NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of
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LA-2244A-1
LA-1244A-1
LA-044A-1
P100GF-65-3BA1-3
NEC 2701
2701 NEC
P100GF-65-3BA1-3
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S64GF
Abstract: No abstract text available
Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 33 32 detail of lead end C D S R Q 64 1 20 19 F J G H I M P K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of
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LA-2244A-1
LA-1244A-1
LA-044A-1
039ch)
S64GF-100-3B8,
S64GF
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S100GF-65-JBT-1
Abstract: No abstract text available
Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 80 81 51 50 detail of lead end C S D R Q 31 30 100 1 F G H I M J K P M N NOTE ITEM Each lead centerline is located within 0.13 mm (0.005 inch) of
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LA-2244A-1
LA-1244A-1
LA-044A-1
S100GF-65-JBT-1
S100GF-65-JBT-1
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Untitled
Abstract: No abstract text available
Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 JEDEC Tray MQFP 14x20 2.7mm LA-044A-1 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 51 50 80 81 detail of lead end C D S Q R 31 30 100 1 F G H I J M P K M N NOTE ITEM Each lead centerline is located within 0.15 mm (0.006 inch) of
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LA-2244A-1
LA-1244A-1
LA-044A-1
S100GF-65-3BA-3
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microprocessors architecture of 8251
Abstract: microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251 DS4812 CLA200
Text: CLA200 Series CMOS Gate Arrays Advance Information DS4812 - 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to
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CLA200
DS4812
microprocessors architecture of 8251
microprocessors interface 8086 to 8251
Mitel Semiconductor process flow
8251 uart vhdl
UART 8251
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zarlink clt
Abstract: 8251 uart vhdl microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Zarlink CLA200 CLA200 Series UART 8251 DS4812 zarlink asic
Text: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to
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CLA200
DS4812
zarlink clt
8251 uart vhdl
microprocessors architecture of 8251
microprocessors interface 8086 to 8251
Zarlink CLA200
CLA200 Series
UART 8251
DS4812
zarlink asic
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PC MOTHERBOARD ibm rev 1.5
Abstract: rev 1.5 ibm motherboard ibm xt MOTHERBOARD CIRCUIT diagram "LPC I/O" LPC47M172 PC MOTHERBOARD CIRCUIT diagram motherboard ibm rev 1.5 free circuit diagram of motherboard IBM Rev 1.6 MOTHERBOARD CIRCUIT diagram free circuit diagram of pc motherboard pd down
Text: LPC47M172 Advanced I/O Controller with Motherboard GLUE Logic Data Brief Product Features 3.3V Operation 5V tolerant LPC Interface − Multiplexed Command, Address and Data Bus − Serial IRQ Interface Compatible with Serialized IRQ Support for PCI Systems
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LPC47M172
PC99a/PC2001
PC MOTHERBOARD ibm rev 1.5
rev 1.5 ibm motherboard
ibm xt MOTHERBOARD CIRCUIT diagram
"LPC I/O"
LPC47M172
PC MOTHERBOARD CIRCUIT diagram
motherboard ibm rev 1.5
free circuit diagram of motherboard
IBM Rev 1.6 MOTHERBOARD CIRCUIT diagram
free circuit diagram of pc motherboard pd down
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FPQ 208 0.5 10
Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
Text: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch
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AC700V
AC500V
FPQ-44-0
FPQ-44-0.
FPQ 208 0.5 10
FPQ Package
FPQ-256
FPQ 240
FPQ-240-0
FPQ-240-0.5
FPQ-48-0
FPQ-52-0.65-01A 52
FPQ-64
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EIA 481 QFN pin 1
Abstract: smd transistor 5c sot-23 TB347 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1
Text: Tape and Reel Specification for Integrated Circuits Technical Brief January 5, 2007 TB347.10 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged
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TB347
EIA-481
EIA 481 QFN pin 1
smd transistor 5c sot-23
SMD 504 5E
smd transistor 5d sot-23
MO-169
fbga196
TQFP 48-1 PACKAGE
WLCSP
7x7x1
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tqfp 7X7X1.4mm
Abstract: 14x14x1.4mm wlcsp inspection MO-169 TB347 TQFP 48-1 PACKAGE
Text: Tape and Reel Specification for Integrated Circuits Technical Brief April 13, 2009 TB347.12 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged
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TB347
EIA-481
NOMINA24)
tqfp 7X7X1.4mm
14x14x1.4mm
wlcsp inspection
MO-169
TQFP 48-1 PACKAGE
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21x21
Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。
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P22C100300A1
P8C-100-300B
P8CT-100-300B2-1
P8C-100-300A-1
P-DIP8-0300-2
MD300-2A
MD300-1A
MD300-09A
21x21
MM554
tray bga
45x45 bga
X13769XJ2V0CD00
CPGA132
LA010
P14DH-100-300A2-1
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QFn 64 tape carrier
Abstract: Techwell 7x7x1 TB347 MO-169 1748 QFN
Text: Technical Brief 347 Author: Laszlo Nemeth Tape and Reel Specification for Integrated Circuits Introduction Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The Intersil Tape and Reel specifications are in compliance with
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EIA-481
TB347
QFn 64 tape carrier
Techwell
7x7x1
MO-169
1748 QFN
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Untitled
Abstract: No abstract text available
Text: CLA200 Series M IT E L CMOS Gate Arrays Advance Information SEMICONDUCTOR DS4812 -1 .3 July 1997 IN TR O D U C TIO N The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to
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OCR Scan
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PDF
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CLA200
DS4812
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Arm processor vlsi technology
Abstract: PC302 QFP 128 bonding
Text: VLSI T e ch n o lo g y o.5-m ic r o n in c. _ PRELIMINARY ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.5-micron 0.45-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec
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45-micron
Arm processor vlsi technology
PC302
QFP 128 bonding
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Untitled
Abstract: No abstract text available
Text: h a r r H C -5506 i s S E M I C O N D U C T O R Ê ADVANCE INFORMATION È \J DSLIC Dual Subscriber Line Interface Circuit June 1994 Features Description • Integration of Two SLlCs in One Package T h e H C -550 6 is a Dual Subscriber Line Interface Circuit
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5M-1982.
43QE271
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