Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    MOTOROLA PACKAGE OUTLINES Search Results

    MOTOROLA PACKAGE OUTLINES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    MOTOROLA PACKAGE OUTLINES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    AN1984

    Abstract: SOIC16 1320A-02
    Text: Freescale Semiconductor, Inc. MOTOROLA Order number: AN1984 Rev 1, 03/2004 SEMICONDUCTOR TECHNICAL DATA AN1984 Handling Motorola Pressure Sensors By William McDonald Freescale Semiconductor, Inc. INTRODUCTION Smaller package outlines and higher board densities require the need for automated placement of components. These


    Original     		PDF AN1984 AN1984 SOIC16 1320A-02

    motorola rf Power Transistor

    Abstract: an555 motorola transistor handbook motorola rf power dow corning silicone compound
    Text: Order this document by AN555/D MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN555 MOUNTING STRIPLINE-OPPOSED-EMITTER SOE TRANSISTORS Prepared by: Lou Danley INTRODUCTION The Stripline Opposed Emitter (SOE) package presently used by Motorola for a number of rf power transistors


    Original     		PDF AN555/D AN555 motorola rf Power Transistor an555 motorola transistor handbook motorola rf power dow corning silicone compound

    751E

    Abstract: 940C 948F BR1339 ansi y14.5m motorola plastic package outlines
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Ordering Information Device Nomenclature MC 74 XXXX YYYYYY ZZ Motorola Circuit Identifier Package Type •D • DW •M • SD • DT Temperature Range • 74 = –40 to +85°C = = = = = Plastic Narrow JECDEC SOIC Plastic Wide JEDEC SOIC


    Original     		PDF BR1339 14-Pin 751E 940C 948F ansi y14.5m motorola plastic package outlines

    NXR-1400

    Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC

    transistor nec 8772

    Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry

    vhc4316

    Abstract: No abstract text available
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Advance Information MC74VHC4316 Quad Analog Switch/Multiplexer/ Demultiplexer with Separate Analog and Digital Power Supplies High–Performance Silicon–Gate CMOS D SUFFIX 16–LEAD SOIC PACKAGE CASE 751B–05 The MC74VHC4316 utilizes silicon–gate CMOS technology to achieve


    Original     		PDF MC74VHC4316 MC74VHC4316 VHC4316 VHC4066, MC14016 MC14066, HC4066A. DL203

    62Sn36Pb2Ag

    Abstract: 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302
    Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Freescale Semiconductor Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in


    Original     		PDF AN1850/D 62Sn36Pb2Ag 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302

    CBGA 255 motorola

    Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin
    Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in


    Original     		PDF AN1850/D CBGA 255 motorola 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin

    powerpc dhrystone

    Abstract: e500 I2C boot sequencer SMC 1015 L1 DM9161 pcb MPC826* debug register pir chip POWERPC E500 instruction set E500CORERM DM9161 powerpc dhrystone mips
    Text: Freescale Semiconductor, Inc. Application Note AN2662 Rev. 0, 05/2004 Freescale Semiconductor, Inc. Migrating from PowerQUICC II to PowerQUICC III Nigel Dick NCSD Applications East Kilbrade, Scotland This application note outlines the considerations that are relevant to migrating from the


    Original     		PDF AN2662 MPC826x MPC85xx powerpc dhrystone e500 I2C boot sequencer SMC 1015 L1 DM9161 pcb MPC826* debug register pir chip POWERPC E500 instruction set E500CORERM DM9161 powerpc dhrystone mips

    MC145475DW

    Abstract: MC145475P MC145474P MC145474 8 bit 92112 IC 92112 block diagram ADI1523 BR10 MC145472 MC145475
    Text: Order this document by MC145474/D Rev. 1 MC145474 MC145475 ISDN S/T Interface Transceiver Coming through loud and clear. NOTICE PRODUCT ENHANCEMENT AND DATA UPDATE This notice outlines changes made to the first and second printings of the Advance Information


    Original     		PDF MC145474/D MC145474 MC145475 MC145474/75 MC145474/75. MC145474/D* MC145475DW MC145475P MC145474P MC145474 8 bit 92112 IC 92112 block diagram ADI1523 BR10 MC145472 MC145475

    Theta JB

    Abstract: 2330B 100C MPC8240 MPC8260 PEAK tray drawing TBGA 214226-ICB TBGA480
    Text: M Tape Ball Grid Array TBGA Q3 2000 Page 1 Motorola General Business Information Motorola TBGA Construction • Two Motorola products currently packaged in TBGA: – Voyager / MPC8260 / PowerQUICC II • • • • 480 pins (29x29 array, 1.27 mm pitch, 5 perimeter rows)


    Original     		PDF MPC8260 29x29 MPC8240 26x26 Theta JB 2330B 100C MPC8240 PEAK tray drawing TBGA 214226-ICB TBGA480

    MHLW8000

    Abstract: MFF224B BGY88 Application MHW6225 MHW7222 Cable TV Hybrid MFF424B MHW5272A BGY85A MFF124B
    Text: SG382/D RF Semiconductor Division Motorola RF CATV Distribution Amplifiers Since the very inception of the cable TV distribution industry, Motorola has excelled as a leading supplier of innovative technical products to the CATV market. Three examples of such solutions are the first 860 MHz


    Original     		PDF SG382/D MHLW8000 MFF224B BGY88 Application MHW6225 MHW7222 Cable TV Hybrid MFF424B MHW5272A BGY85A MFF124B

    PQFN

    Abstract: PQFN footprint AN2467 DUAL ROW QFN leadframe MC33982PNA MC33982FC ADHESIVE GAP PAD PQFN 5 leads PQFN package power freescale JESD51-5
    Text: Freescale Semiconductor, Inc. Application Note AN2467/D Revision 1.0 09/2004 Topic Page Freescale Semiconductor, Inc. 1.0 Purpose . 1 2.0 Scope. 1 3.0 Power Quad Flat No-Lead PQFN


    Original     		PDF AN2467/D AN2467/D PQFN PQFN footprint AN2467 DUAL ROW QFN leadframe MC33982PNA MC33982FC ADHESIVE GAP PAD PQFN 5 leads PQFN package power freescale JESD51-5

    mhw6342t

    Abstract: MHW9182B Cable TV Hybrid p 1302 capacitor BGY887B MHW6182T MHW6222T 714p cable tv amplifier capacitor cross reference
    Text: SG382/D REV 3 Motorola RF CATV Distribution Amplifiers Since the very inception of the cable TV distribution industry, Motorola has excelled as a leading supplier of innovative technical products for the CATV market. Continuing our history of leadership in the CATV market,


    Original     		PDF SG382/D 714Y/1 mhw6342t MHW9182B Cable TV Hybrid p 1302 capacitor BGY887B MHW6182T MHW6222T 714p cable tv amplifier capacitor cross reference

    MOTOROLA mac15 TRANSISTOR

    Abstract: MCR225-2FP 2FP TRANSISTOR mac21B motorola transistor mac15 MJF10012 MJF16006A RECTIFIER 638 MOTOROLA tolerancing "Power Semiconductor Applications"
    Text: MOTOROLA SC XST RS/ R F MbE D • b 3 b ? 2 S 4 DDTbESl b H MOTb Ç) Selection by Package (continued) THYRISTORS SCRs — Style 2 TRIACs — Style 3 Device T2500BFP T2500DFP T2500MFP T2500NFP MAC21B-4FP MAC218-6FP MAC218-8FP MAC218-10FP MAC228-4FP MAC228-6FP


    OCR Scan     		PDF T2500BFP T2500DFP T2500MFP T2500NFP MAC21B-4FP MAC218-6FP MAC218-8FP MAC218-10FP MAC228-4FP MAC228-6FP MOTOROLA mac15 TRANSISTOR MCR225-2FP 2FP TRANSISTOR mac21B motorola transistor mac15 MJF10012 MJF16006A RECTIFIER 638 MOTOROLA tolerancing "Power Semiconductor Applications"

    MOTOROLA TOP MARK

    Abstract: motorola package outlines
    Text: MECHANICAL OUTLINES 98ASH98061A D1CT1ONARY PAGE 1128A DO NOT SCALE THIS DRAWING ISSUE 0 DATE 15DEC97 Ä M O TO rtO LJk Semiconductor Products Sector COPYRIGHT 1997 MOTOROLA ALL RIGHTS RESERVED X —« LASER MARK FOR PIN 1 IDENTIFICATION IN THIS AREA "N


    OCR Scan     		PDF 98ASH98061A 15DEC97 128A-01 5M-1994. MOTOROLA TOP MARK motorola package outlines

    1J27

    Abstract: No abstract text available
    Text: Case Outlines 1 4 -P in P ackag es D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F - S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MHUMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.0061


    OCR Scan     		PDF 51A-03 BR1492 1J27

    Untitled

    Abstract: No abstract text available
    Text: Case Outlines 1 4 -Pin P ackag es D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F P7 PL | 0 1 0.25 0.0101 t n x — JG I— o I B 1 i c D 14 PL_ [ $ I 0.25(0.0101 © K I t r 1 IT 1 B ® _ J F L- / R X 45J E 3 " SEATING PLANE NOTES'


    OCR Scan     		PDF 51A-03

    HF 1932

    Abstract: No abstract text available
    Text: Case Outlines L SUFFIX - s CERAMIC PACKAGE CASE 620-10 ISSUE V i - NOTES. 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982 2. CONTROLLING DIMENSION: INCH. 3. OlMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 0 030


    OCR Scan     		PDF BR1334 HF 1932

    motorola plastic package outlines

    Abstract: No abstract text available
    Text: Case Outlines C a se O utlines 4-P in P ackage DT SUFFIX PLASTIC PACKAGE CASE 369A-13 DPAK ISSUE W _ f _ 1 SEATING — — 1 PLANE NOTES: 1. 2 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. INCHES ' 1 MIN MAX MIN MAX A 0.235


    OCR Scan     		PDF 69A-13 BR1486 motorola plastic package outlines

    TRANSISTOR BJ 026

    Abstract: No abstract text available
    Text: PACKAGE OUTLINES NOTES: 1. DIMENSIONING AND TOLERANCING PER SOT-23 2. 3. STYLE 6: PIN 1. S " WLE 12: PIN 1. CATHODE BASE STYLE 7: PIN 1. EMITTER 1.40 1.11 0.0150 0.0200 0.37 0.0701 0.0807 1.78 0.50 2.04 0.0005 0.0034 0.0040 0.013 0.100 0.0070 0.085 0.177 0.0180


    OCR Scan     		PDF OT-23 TRANSISTOR BJ 026

    Untitled

    Abstract: No abstract text available
    Text: Case Outlines L SUFFIX NOTES 1 DIMENSIONING AND TOLERANCING PER a n d v i i cjj i ono 2 3 CONTROLLING DIMENSION: INCH. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL DIMENSION F MAY NARROW TO 0.76 0 030 WHERE THE LEAD ENTERS THE CERAMIC BOOY 4 DIM A


    OCR Scan     		PDF BR1334

    C-0120

    Abstract: No abstract text available
    Text: T F TMos Package Outlines - A - ► \ 1 C 1 i I t T t- E - * l •*— D 2 PL I s e a t in g p la n e NOTES. 1. DIM ENSIONING AND TOLERANCING PER ANSI Y14 5M, 1982 2 CONTROLLING DIMENSION INCH 3. ALL RULES AND NOTES ASSOCIATED WITH STYLE 3. PIN 1 GATE


    OCR Scan     		PDF T0-204AA C-0120

    Motorola 206

    Abstract: No abstract text available
    Text: C a s e Outlines 14-P in Packages D SUFFIX PLASTIC SO IC PACKAGE C A SE 751A-03 ISSU E F | ^ l 0.25 0.010 I NOTES: 1. DIMENSIONING AND TOl£RANClNG PER ANSI Y14.5M, 1962. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.


    OCR Scan     		PDF 51A-03 DL203 Motorola 206