AN1984
Abstract: SOIC16 1320A-02
Text: Freescale Semiconductor, Inc. MOTOROLA Order number: AN1984 Rev 1, 03/2004 SEMICONDUCTOR TECHNICAL DATA AN1984 Handling Motorola Pressure Sensors By William McDonald Freescale Semiconductor, Inc. INTRODUCTION Smaller package outlines and higher board densities require the need for automated placement of components. These
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AN1984
AN1984
SOIC16
1320A-02
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motorola rf Power Transistor
Abstract: an555 motorola transistor handbook motorola rf power dow corning silicone compound
Text: Order this document by AN555/D MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN555 MOUNTING STRIPLINE-OPPOSED-EMITTER SOE TRANSISTORS Prepared by: Lou Danley INTRODUCTION The Stripline Opposed Emitter (SOE) package presently used by Motorola for a number of rf power transistors
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AN555/D
AN555
motorola rf Power Transistor
an555
motorola transistor handbook
motorola rf power
dow corning silicone compound
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751E
Abstract: 940C 948F BR1339 ansi y14.5m motorola plastic package outlines
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Ordering Information Device Nomenclature MC 74 XXXX YYYYYY ZZ Motorola Circuit Identifier Package Type •D • DW •M • SD • DT Temperature Range • 74 = –40 to +85°C = = = = = Plastic Narrow JECDEC SOIC Plastic Wide JEDEC SOIC
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BR1339
14-Pin
751E
940C
948F
ansi y14.5m
motorola plastic package outlines
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NXR-1400
Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s
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AN1231/D
AN1231
AN1231/D*
NXR-1400
nicolet nxr1400
reballing
Air-Vac Engineering Company
830B
A112
AN1231
JESD22
MPC105
OMPAC
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transistor nec 8772
Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s
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AN1231/D
AN1231
transistor nec 8772
nec 7912
nec 8772
motorola 7912
1764 676
kapton
NXR-1400
2SB444
8772 P
bga dye pry
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vhc4316
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Advance Information MC74VHC4316 Quad Analog Switch/Multiplexer/ Demultiplexer with Separate Analog and Digital Power Supplies High–Performance Silicon–Gate CMOS D SUFFIX 16–LEAD SOIC PACKAGE CASE 751B–05 The MC74VHC4316 utilizes silicon–gate CMOS technology to achieve
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MC74VHC4316
MC74VHC4316
VHC4316
VHC4066,
MC14016
MC14066,
HC4066A.
DL203
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62Sn36Pb2Ag
Abstract: 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302
Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Freescale Semiconductor Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in
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AN1850/D
62Sn36Pb2Ag
90Pb10Sn
CBGA 255 motorola
480 PBGA pad recommendations
Solder Balls
63Sn37Pb
cte table epoxy substrate
motorola pbga 302
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CBGA 255 motorola
Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin
Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in
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AN1850/D
CBGA 255 motorola
90Pb10Sn
cte table epoxy
BGA cte
pbga package weight
cte table epoxy substrate
AN-1850
360-Pin
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powerpc dhrystone
Abstract: e500 I2C boot sequencer SMC 1015 L1 DM9161 pcb MPC826* debug register pir chip POWERPC E500 instruction set E500CORERM DM9161 powerpc dhrystone mips
Text: Freescale Semiconductor, Inc. Application Note AN2662 Rev. 0, 05/2004 Freescale Semiconductor, Inc. Migrating from PowerQUICC II to PowerQUICC III Nigel Dick NCSD Applications East Kilbrade, Scotland This application note outlines the considerations that are relevant to migrating from the
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AN2662
MPC826x
MPC85xx
powerpc dhrystone
e500 I2C boot sequencer
SMC 1015 L1
DM9161 pcb
MPC826* debug register
pir chip
POWERPC E500 instruction set
E500CORERM
DM9161
powerpc dhrystone mips
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MC145475DW
Abstract: MC145475P MC145474P MC145474 8 bit 92112 IC 92112 block diagram ADI1523 BR10 MC145472 MC145475
Text: Order this document by MC145474/D Rev. 1 MC145474 MC145475 ISDN S/T Interface Transceiver Coming through loud and clear. NOTICE PRODUCT ENHANCEMENT AND DATA UPDATE This notice outlines changes made to the first and second printings of the Advance Information
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MC145474/D
MC145474
MC145475
MC145474/75
MC145474/75.
MC145474/D*
MC145475DW
MC145475P
MC145474P
MC145474
8 bit 92112
IC 92112 block diagram
ADI1523
BR10
MC145472
MC145475
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Theta JB
Abstract: 2330B 100C MPC8240 MPC8260 PEAK tray drawing TBGA 214226-ICB TBGA480
Text: M Tape Ball Grid Array TBGA Q3 2000 Page 1 Motorola General Business Information Motorola TBGA Construction • Two Motorola products currently packaged in TBGA: – Voyager / MPC8260 / PowerQUICC II • • • • 480 pins (29x29 array, 1.27 mm pitch, 5 perimeter rows)
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MPC8260
29x29
MPC8240
26x26
Theta JB
2330B
100C
MPC8240
PEAK tray drawing
TBGA
214226-ICB
TBGA480
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MHLW8000
Abstract: MFF224B BGY88 Application MHW6225 MHW7222 Cable TV Hybrid MFF424B MHW5272A BGY85A MFF124B
Text: SG382/D RF Semiconductor Division Motorola RF CATV Distribution Amplifiers Since the very inception of the cable TV distribution industry, Motorola has excelled as a leading supplier of innovative technical products to the CATV market. Three examples of such solutions are the first 860 MHz
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SG382/D
MHLW8000
MFF224B
BGY88 Application
MHW6225
MHW7222
Cable TV Hybrid
MFF424B
MHW5272A
BGY85A
MFF124B
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PQFN
Abstract: PQFN footprint AN2467 DUAL ROW QFN leadframe MC33982PNA MC33982FC ADHESIVE GAP PAD PQFN 5 leads PQFN package power freescale JESD51-5
Text: Freescale Semiconductor, Inc. Application Note AN2467/D Revision 1.0 09/2004 Topic Page Freescale Semiconductor, Inc. 1.0 Purpose . 1 2.0 Scope. 1 3.0 Power Quad Flat No-Lead PQFN
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AN2467/D
AN2467/D
PQFN
PQFN footprint
AN2467
DUAL ROW QFN leadframe
MC33982PNA
MC33982FC
ADHESIVE GAP PAD
PQFN 5 leads
PQFN package power freescale
JESD51-5
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mhw6342t
Abstract: MHW9182B Cable TV Hybrid p 1302 capacitor BGY887B MHW6182T MHW6222T 714p cable tv amplifier capacitor cross reference
Text: SG382/D REV 3 Motorola RF CATV Distribution Amplifiers Since the very inception of the cable TV distribution industry, Motorola has excelled as a leading supplier of innovative technical products for the CATV market. Continuing our history of leadership in the CATV market,
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714Y/1
mhw6342t
MHW9182B
Cable TV Hybrid
p 1302 capacitor
BGY887B
MHW6182T
MHW6222T
714p
cable tv amplifier
capacitor cross reference
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MOTOROLA mac15 TRANSISTOR
Abstract: MCR225-2FP 2FP TRANSISTOR mac21B motorola transistor mac15 MJF10012 MJF16006A RECTIFIER 638 MOTOROLA tolerancing "Power Semiconductor Applications"
Text: MOTOROLA SC XST RS/ R F MbE D • b 3 b ? 2 S 4 DDTbESl b H MOTb Ç) Selection by Package (continued) THYRISTORS SCRs — Style 2 TRIACs — Style 3 Device T2500BFP T2500DFP T2500MFP T2500NFP MAC21B-4FP MAC218-6FP MAC218-8FP MAC218-10FP MAC228-4FP MAC228-6FP
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T2500BFP
T2500DFP
T2500MFP
T2500NFP
MAC21B-4FP
MAC218-6FP
MAC218-8FP
MAC218-10FP
MAC228-4FP
MAC228-6FP
MOTOROLA mac15 TRANSISTOR
MCR225-2FP
2FP TRANSISTOR
mac21B
motorola transistor mac15
MJF10012
MJF16006A
RECTIFIER 638 MOTOROLA
tolerancing
"Power Semiconductor Applications"
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MOTOROLA TOP MARK
Abstract: motorola package outlines
Text: MECHANICAL OUTLINES 98ASH98061A D1CT1ONARY PAGE 1128A DO NOT SCALE THIS DRAWING ISSUE 0 DATE 15DEC97 Ä M O TO rtO LJk Semiconductor Products Sector COPYRIGHT 1997 MOTOROLA ALL RIGHTS RESERVED X —« LASER MARK FOR PIN 1 IDENTIFICATION IN THIS AREA "N
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98ASH98061A
15DEC97
128A-01
5M-1994.
MOTOROLA TOP MARK
motorola package outlines
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1J27
Abstract: No abstract text available
Text: Case Outlines 1 4 -P in P ackag es D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F - S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MHUMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.0061
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51A-03
BR1492
1J27
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Untitled
Abstract: No abstract text available
Text: Case Outlines 1 4 -Pin P ackag es D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F P7 PL | 0 1 0.25 0.0101 t n x — JG I— o I B 1 i c D 14 PL_ [ $ I 0.25(0.0101 © K I t r 1 IT 1 B ® _ J F L- / R X 45J E 3 " SEATING PLANE NOTES'
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51A-03
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HF 1932
Abstract: No abstract text available
Text: Case Outlines L SUFFIX - s CERAMIC PACKAGE CASE 620-10 ISSUE V i - NOTES. 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982 2. CONTROLLING DIMENSION: INCH. 3. OlMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 0 030
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BR1334
HF 1932
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motorola plastic package outlines
Abstract: No abstract text available
Text: Case Outlines C a se O utlines 4-P in P ackage DT SUFFIX PLASTIC PACKAGE CASE 369A-13 DPAK ISSUE W _ f _ 1 SEATING — — 1 PLANE NOTES: 1. 2 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. INCHES ' 1 MIN MAX MIN MAX A 0.235
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69A-13
BR1486
motorola plastic package outlines
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TRANSISTOR BJ 026
Abstract: No abstract text available
Text: PACKAGE OUTLINES NOTES: 1. DIMENSIONING AND TOLERANCING PER SOT-23 2. 3. STYLE 6: PIN 1. S " WLE 12: PIN 1. CATHODE BASE STYLE 7: PIN 1. EMITTER 1.40 1.11 0.0150 0.0200 0.37 0.0701 0.0807 1.78 0.50 2.04 0.0005 0.0034 0.0040 0.013 0.100 0.0070 0.085 0.177 0.0180
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OT-23
TRANSISTOR BJ 026
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Untitled
Abstract: No abstract text available
Text: Case Outlines L SUFFIX NOTES 1 DIMENSIONING AND TOLERANCING PER a n d v i i cjj i ono 2 3 CONTROLLING DIMENSION: INCH. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL DIMENSION F MAY NARROW TO 0.76 0 030 WHERE THE LEAD ENTERS THE CERAMIC BOOY 4 DIM A
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BR1334
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C-0120
Abstract: No abstract text available
Text: T F TMos Package Outlines - A - ► \ 1 C 1 i I t T t- E - * l •*— D 2 PL I s e a t in g p la n e NOTES. 1. DIM ENSIONING AND TOLERANCING PER ANSI Y14 5M, 1982 2 CONTROLLING DIMENSION INCH 3. ALL RULES AND NOTES ASSOCIATED WITH STYLE 3. PIN 1 GATE
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T0-204AA
C-0120
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Motorola 206
Abstract: No abstract text available
Text: C a s e Outlines 14-P in Packages D SUFFIX PLASTIC SO IC PACKAGE C A SE 751A-03 ISSU E F | ^ l 0.25 0.010 I NOTES: 1. DIMENSIONING AND TOl£RANClNG PER ANSI Y14.5M, 1962. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
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51A-03
DL203
Motorola 206
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