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    MMIC CORE CHIP Search Results

    MMIC CORE CHIP Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TMPM3HMFYAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HPFYADFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP128-1420-0.50-001 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HLFYAUG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP64-1010-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HNFZAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP100-1414-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HLFZAUG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP64-1010-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HPFDADFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP128-1420-0.50-001 Visit Toshiba Electronic Devices & Storage Corporation

    MMIC CORE CHIP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    XZ1002-BD

    Abstract: XZ1002-BD-EV1 mmic core chip TA10C XZ100
    Text: XZ1002-BD 8.5-11.0 GHz GaAs MMIC Core Chip Rev 11-Nov-10 Features General Description The XZ1002-BD is a highly integrated dual path transmit/receive 3 port core chip. It is designed for applications operating within the 8.5 to 11.0 GHz range. The core consists of integrated transmit/receive


    Original     		PDF XZ1002-BD 11-Nov-10 MIL-STD-883 XZ1002-BD XZ1002-BD-EV1 mmic core chip TA10C XZ100

    XZ1002-BD-000V

    Abstract: xz1002-bd mmic core chip Z1002-BD XZ100 1521e Mimix Broadband m11
    Text: 8.5-11.0 GHz GaAs MMIC Core Chip Z1002-BD March 2009 - Rev 11-Mar-09 Features General Description The XZ1002-BD is a highly integrated dual path transmit/receive 3 port core chip. It is designed for applications operating within the 8.5 to 11.0 GHz range. The core consists of integrated transmit/receive


    Original     		PDF 11-Mar-09 Z1002-BD XZ1002-BD MIL-STD-883 XZ1002-BD-000V XZ1002-BD-000V xz1002-bd mmic core chip XZ100 1521e Mimix Broadband m11

    Untitled

    Abstract: No abstract text available
    Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • +5dBm Input Third Order Intercept Point (IIP3) • Low Current Consumption : IDD_LNA=30mA


    Original     		PDF SMM5722XZ 16GHz 50ohm SMM5722XZ

    Untitled

    Abstract: No abstract text available
    Text: Preliminary ES/SMM5723XZ 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • +4dBm Input Third Order Intercept Point (IIP3)


    Original     		PDF ES/SMM5723XZ 24GHz 50ohm ES/SMM5723XZ

    Untitled

    Abstract: No abstract text available
    Text: Preliminary ES/SMM5724XZ 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • +4dBm Input Third Order Intercept Point (IIP3)


    Original     		PDF ES/SMM5724XZ 30GHz 50ohm ES/SMM5724XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • 10dB Conversion Gain • 2.5dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3


    Original     		PDF SMM5139XZ SMM5139XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc


    Original     		PDF SMM5138XZ -13dB 22dBm 30dBc SMM5138XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Balｌ • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • 10dB Conversion Gain • 2.6dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3


    Original     		PDF SMM5142XZ SMM5142XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc


    Original     		PDF SMM5138XZ -13dB 22dBm 30dBc SMM5138XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB


    Original     		PDF SMM5145XZ -12dB 22dBm 10dBm SMM5145XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB


    Original     		PDF SMM5145XZ -12dB 22dBm 10dBm SMM5145XZ

    JEP95 MS-028

    Abstract: No abstract text available
    Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm


    Original     		PDF SMM5146XZ 10dBm SMM5146XZ JEP95 MS-028

    JEP95 MS-028

    Abstract: No abstract text available
    Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm


    Original     		PDF SMM5146XZ 10dBm SMM5146XZ JEP95 MS-028

    x-band mmic core chip

    Abstract: x-band mmic phase shifter using lumped elements mmic core chip x-band microwave fet X band 5-bit phase shifter X-Band T/R digital phase shifter X band attenuator mmic A
    Text: A GaAs X-Band Multifunction Control MMIC Using the MSAG Process Abstract This paper describes efforts to achieve first pass design success for an X-band control MMIC consisting of multi-bit phase shifter, multi-bit attenuator, amplifier and serial-to-parallel


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: ES/SMM5141XZ Preliminary 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm


    Original     		PDF ES/SMM5141XZ -12dB 22dBm 30dBc ES/SMM5141XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA


    Original     		PDF SMM5722XZ 16GHz 50ohm SMM5722XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA


    Original     		PDF SMM5722XZ 16GHz 50ohm SMM5722XZ

    Untitled

    Abstract: No abstract text available
    Text: ES/SMM5724XZ Preliminary 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm


    Original     		PDF ES/SMM5724XZ 30GHz 50ohm ES/SMM5724XZ

    Untitled

    Abstract: No abstract text available
    Text: Preliminary ES/SMM5724XZ 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm


    Original     		PDF ES/SMM5724XZ 30GHz 50ohm ES/SMM5724XZ

    Untitled

    Abstract: No abstract text available
    Text: Preliminary ES/SMM5723XZ 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm


    Original     		PDF ES/SMM5723XZ 24GHz 50ohm ES/SMM5723XZ

    Untitled

    Abstract: No abstract text available
    Text: ES/SMM5143XZ Preliminary 24 – 30GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +24dBm


    Original     		PDF ES/SMM5143XZ 30GHz -12dB 24dBm ES/SMM5143XZ

    JEP95 MS-028

    Abstract: No abstract text available
    Text: ES/SMM5723XZ Preliminary 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm


    Original     		PDF ES/SMM5723XZ 24GHz 50ohm ES/SMM5723XZ JEP95 MS-028

    Untitled

    Abstract: No abstract text available
    Text: APPLICATION NOTE - ACD SERIES ACD SERIES DOWNCONVERTER MMIC FOR CATV Preliminary Rev 1 Introduction The ACD downconverter MMIC is designed to be used as the second downconverter in double conversion cable television tuners. The chip, fabricated in gallium arsenide, incorporates a high degree of integration, which


    OCR Scan     		PDF

    H5C2T

    Abstract: VJ0805U osc-54
    Text: APPLICATION NOTE - ACD SERIES ACD SERIES DOWNCONVERTER MMIC FOR CATV Preliminary Rev 1 Introduction The ACD downconverter MMIC is designed to be used as the second downconverter in double conversion cable television tuners. The chip, fabricated in gallium arsenide, incorporates a high degree of integration, which


    OCR Scan     		PDF