IPC-7527
Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2
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IPC-7525
Abstract: IPC-SM-7525A FDMF8705 QFN 52 8x8 footprint AN-9037 100C IPC610D JESD22-B102D J-STD-001C IPC-4101B
Text: AN-9037 Assembly Guidelines for 8x8 MLP DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 8x8 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its
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AN-9037
IPC-A-610-D,
J-STD-001D,
IPC-SM-7525A,
JESD22-B102D,
FDMF8700,
FDMF8704,
FDMF8704V,
FDMF8705
IPC-7525
IPC-SM-7525A
FDMF8705
QFN 52 8x8 footprint
AN-9037
100C
IPC610D
JESD22-B102D
J-STD-001C
IPC-4101B
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Untitled
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
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Untitled
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
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AK08D300-CLCC
Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
AK08D300-CLCC
AK08D300-LFCSP2X3 .5mm
AK08D300-LFCSP3x3 .5mm
AK08D300-MLP.65mm
AK10D300-8SON .65mm
MLP 3X3
MLP 4X4
AK22D300-DFN
AK24D300-LLP
MLP 5X5
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QFN leadframe
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
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8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
QFN leadframe
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sot-23 pinout
Abstract: 431 sot23-5 FAN21SV06 11n60f FAN7385 FAN7382 FAN7380 fan3000 5N60 datasheet 4N60 fairchild
Text: Power Seminar 2007 – New Product Update Q3/Q4 Jon Harper, Market Development Manager, Industrial & White Goods Systems, Europe September 2007 www.fairchildsemi.com Products for Power Supplies • • • • • Power33 and Power56 MOSFETs Low input voltage drivers: FAN3xxx
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Power33
Power56
FAN73xx
FAN4800
sot-23 pinout
431 sot23-5
FAN21SV06
11n60f
FAN7385
FAN7382
FAN7380
fan3000
5N60 datasheet
4N60 fairchild
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Untitled
Abstract: No abstract text available
Text: 52 Pin to 56 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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AK56D900-TSOP14x20
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Untitled
Abstract: No abstract text available
Text: 52 Pin to 56 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
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AK56D900-TSOP14x20
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7805 DPAK
Abstract: piezo injector driver CFL 6v inverter circuit schematic diagram free 7805 D2PAK common rail piezo injector driver COMMON RAIL SOLENOID DIRECT INJECTION AN-7522 Common rail injector driver FDDS10H04 7805 sot-223
Text: AUTOMOTIVE SOLUTIONS TO MAXIMIZE FUEL EFFICIENCY & REDUCE CO2 EMISSIONS Saving our world, 1mW at a time www.fairchildsemi.com INTRODUCTION Fairchild Semiconductor Automotive Solutions Whether specifying an intelligent ignition control for high performance engine management systems or
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12v 30a pwm diagram
Abstract: FDMF8704 VR11
Text: FDMF8704 tm High Current / High Frequency FET plus Driver Multi-chip Module Benefits General Description Fully optimized system efficiency. Higher efficiency levels are achievable compared with conventional discrete components. The FDMF8704 is a fully optimized integrated Driver plus
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FDMF8704
FDMF8704
56-pin
12v 30a pwm diagram
VR11
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Untitled
Abstract: No abstract text available
Text: FDMF8704V tm High Efficiency / High Frequency FET plus Driver Multi-chip Module with Internal Voltage Regulator Benefits General Description ̈ Fully optimized system efficiency. Higher efficiency levels are achievable compared with conventional discrete components.
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FDMF8704V
FDMF8704V
56-pin
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12V 30A 3 pin mosfet
Abstract: 12V 30A diode FAIRCHILD SMD MARKING FDMF8704 VR11 12v 30a pwm diagram CGND
Text: FDMF8704 tm High Efficiency / High Frequency FET plus Driver Multi-chip Module Benefits General Description Fully optimized system efficiency. Higher efficiency levels are achievable compared with conventional discrete components. The FDMF8704 is a fully optimized integrated Driver plus
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FDMF8704
FDMF8704
56-pin
12V 30A 3 pin mosfet
12V 30A diode
FAIRCHILD SMD MARKING
VR11
12v 30a pwm diagram
CGND
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Untitled
Abstract: No abstract text available
Text: FDMF8704 tm High Efficiency / High Frequency FET plus Driver Multi-chip Module Benefits General Description ̈ Fully optimized system efficiency. Higher efficiency levels are achievable compared with conventional discrete components. The FDMF8704 is a fully optimized integrated Driver plus
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FDMF8704
FDMF8704
56-pin
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12v 30a pwm diagram
Abstract: SMD IC MARKING NC FDMF8704V VR11
Text: FDMF8704V tm High Efficiency / High Frequency FET plus Driver Multi-chip Module with Internal Voltage Regulator Benefits General Description Fully optimized system efficiency. Higher efficiency levels are achievable compared with conventional discrete components.
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FDMF8704V
FDMF8704V
56-pin
12v 30a pwm diagram
SMD IC MARKING NC
VR11
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400 xtal
Abstract: No abstract text available
Text: Technical note TN8722.01 SX8722 operating modes Current consumption and timings ADVANCED COMMUNICATIONS & SENSING PRELIMINARY SX8722 operating modes Current consumption and timings Technical note TN8722.01 2007 Semtech Corp. www.semtech.com 1 Technical note TN8722.01
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TN8722
SX8722
400 xtal
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IS140
Abstract: 400 xtal
Text: Technical note TN8722.01 SX8722 operating modes Current consumption and timings ADVANCED COMMUNICATIONS & SENSING PRELIMINARY SX8722 operating modes Current consumption and timings Technical note TN8722.01 2007 Semtech Corp. www.semtech.com 1 Technical note TN8722.01
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TN8722
SX8722
IS140
400 xtal
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SG-BGA-6046
Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.
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025mm
FR4/G10
Sn63Pb37
SG-BGA-6046
SG-MLF-7004
156 QFN 12X12
diode sg 87
1mm pitch BGA socket
SG-BGA-6094
BGA Solder Ball compressive force
17X17* BGA 289
SG-MLF-7003
SG-BGA-6033
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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Turn-Key
Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
Text: RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25
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75GHz
50-80grams
Turn-Key
Adapters
Sockets
Product Presentations
Giga-snaP™ BGA SMT Adapters
Receptacles
Prototyping Adapters
Surface Mount Package Emulation
Probing and Analysis Adapters
BGA Sockets
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PD69104
Abstract: PD69108 PD69104A Solar Garden Light Controller 4 pin LX5535 lx6503 PD69100 lx6523a LX5518 LX1980
Text: Microsemi • Microsemi • Microsemi • Microsemi Analog Mixed Signal Group The vision of Microsemi’s Analog Mixed Signal Group AMSG is to engineer high performance power management products differentiated for the most demanding applications. The technical teams
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sp3721
Abstract: TMS320DA255 free home theater 7.1 pcb circuit diagram creative subwoofer circuit diagram creative subwoofer 4.1 diagram TMS320DA610 1500 watts subwoofer amplifier circuit diagram AEG CS DVD 700 free home theater circuit diagram free home theater 2.1 circuit diagram
Text: R E A L W O R L D S P I G N A L TM R O C E S S I N G Audio Solutions Guide Analog and Digital Amplifiers, Audio Converters, Digital Signal Processors, Interface, Power Management 1Q 2004 ➔ Inside Home Theater Products 4-13 Home Audio 14-16 Digital Radio
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TSB43CA43A/TSB43CB43A,
DSD1608,
PCM1850
SZZB002B
sp3721
TMS320DA255
free home theater 7.1 pcb circuit diagram
creative subwoofer circuit diagram
creative subwoofer 4.1 diagram
TMS320DA610
1500 watts subwoofer amplifier circuit diagram
AEG CS DVD 700
free home theater circuit diagram
free home theater 2.1 circuit diagram
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PIC16F72 inverter ups
Abstract: UPS inverter PIC16F72 PIC16F676 inverter hex code 16F877 with sd-card and lcd project circuit diagram wireless spy camera NH82801GB xmega-a4 online ups service manual back-ups ES 500 ARM LPC2148 INTERFACING WITH RFID circuit diagram realtek rtd 1186
Text: the solutions are out there you just haven’t registered yet. RoadTest the newest products in the market! View the latest news, design support and hot new technologies for a range of applications Join the RoadTest group and be in with a chance to trial exclusive new products for free. Plus, read
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element-14
element14.
element14,
PIC16F72 inverter ups
UPS inverter PIC16F72
PIC16F676 inverter hex code
16F877 with sd-card and lcd project
circuit diagram wireless spy camera
NH82801GB
xmega-a4
online ups service manual back-ups ES 500
ARM LPC2148 INTERFACING WITH RFID circuit diagram
realtek rtd 1186
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sky77528
Abstract: SKY77344 SKY77531 sky77534 srf 3417 SKY77526 SKY73009-11 SKY77518 sky77524 SKY77519
Text: Product Selection Guide Fall 2009 Skyworks Solutions Skyworks Solutions, Inc. is an innovator of high reliability analog and mixed signal semiconductors. Leveraging core technologies, Skyworks offers diverse standard and custom linear products supporting automotive, broadband, cellular infrastructure, energy management,
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BRO254-09B
sky77528
SKY77344
SKY77531
sky77534
srf 3417
SKY77526
SKY73009-11
SKY77518
sky77524
SKY77519
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