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    MICRON POWER RESISTOR Search Results

    MICRON POWER RESISTOR Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4164K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4207F Toshiba Electronic Devices & Storage Corporation Intelligent power device 600V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation

    MICRON POWER RESISTOR Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CMOS Process Family

    Abstract: XH018 bsim3 bsim3 0.18 micron parameters analog devices transistor tutorials TRANSISTORS BJT list IMD2 transistor XP018 process flow diagram "X-Fab" Core cell library
    Text: 0.18 µm CMOS Process Family XP018 MIXED-SIGNAL FOUNDRY EXPERTS 0.18 Micron CMOS Power Management Process Technology Description The XP018 series is X-FAB’s 0.18 micron Modular Mixed Signal CMOS Power Management Technology. Based upon the industrial standard single


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    PDF XP018 XP018 18-micron CMOS Process Family XH018 bsim3 bsim3 0.18 micron parameters analog devices transistor tutorials TRANSISTORS BJT list IMD2 transistor process flow diagram "X-Fab" Core cell library

    02011-BRF-001-A

    Abstract: M02011 TIA AGC application note
    Text: 622Mbps Transimpedance Amplifier with AGC M02011 Low-power, high-sensitivity, 622Mbps transimpedance amplifier fabricated in sub-micron CMOS The M02011 transimpedance amplifier TIA with automatic gain control (AGC) is fabricated in sub-micron CMOS for


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    PDF 622Mbps M02011 M02011 02011-BRF-001-A 02011-BRF-001-A TIA AGC application note

    02015-BRF-001-A

    Abstract: MINDSPEED M02015 M02015 ONU block diagram cmos agc GPON block diagram TIA AGC application note automatic gain control agc
    Text: 2.5 Gbps Transimpedance Amplifier with AGC M02015 Low-power, high-sensitivity 2.5 Gbps transimped ance amplifier fabricated in sub-micron CMOS The M02015 transimpedance amplifier TIA with automatic gain control (AGC) is fabricated in sub-micron CMOS for high


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    PDF M02015 M02015 280na, 280na Overlo000 02015-BRF-001-A 02015-BRF-001-A MINDSPEED M02015 ONU block diagram cmos agc GPON block diagram TIA AGC application note automatic gain control agc

    02014-BRF-001-A

    Abstract: M02014 GPON block diagram TIA AGC application note avalanche photodiode ingaas ghz Avalanche cmos photodetector
    Text: 2.5 Gbps Transimpedance Amplifier with AGC M02014 Low-power, high-sensitivity 2.5 Gbps transimped ance amplifier fabricated in sub-micron CMOS The M02014 transimpedance amplifier TIA with automatic gain control (AGC) is fabricated in sub-micron CMOS for high


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    PDF M02014 M02014 253na, 253na Overl000 02014-BRF-001-A 02014-BRF-001-A GPON block diagram TIA AGC application note avalanche photodiode ingaas ghz Avalanche cmos photodetector

    0.18-um CMOS technology characteristics

    Abstract: atmel 048 MICRON RESISTOR Mos NMOS transistor 0.18 um CMOS atmel 018 0.18-um CMOS technology
    Text: RF CMOS RF cmos 0.18 Micron Technology Atmel's 0.18 micron RF CMOS process technology provides a low-cost solution for high-performance RF applications. Key Features Key Benefits • 1.8V CMOS Transistors • Low Power • 3.3V I/O • Low Cost • Embedded EEPROM


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    PDF 5136B-05/06/1K 0.18-um CMOS technology characteristics atmel 048 MICRON RESISTOR Mos NMOS transistor 0.18 um CMOS atmel 018 0.18-um CMOS technology

    TF-680

    Abstract: L302 FV09 macros in embedded computing
    Text: DATA SHEET QB-8 / QB-8E 3.3 Volt , 0.44-Micron Gate-Array Description NEC’s 3.3V QB-8 family consists of ultra-high performance, sub-micron gate arrays, targeted for applications requiring high speeds and low power dissipation. The QB-8 family offers not


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    PDF 44-Micron TF-680 L302 FV09 macros in embedded computing

    nmos transistor 0.35 um

    Abstract: npn pnp rf transistor bipolar cross reference l24c using a zener diode as a varicap NMOS depletion pspice model bsim3 model for 0.18 micron technology for hspice bsim3 model MOS RM3 QS 100 NPN Transistor analog devices transistor tutorials
    Text: 0.6 µm BiCMOS Process Family XHB06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular HV BCD Technology Description The XHB06 is X-FAB's 0.6 Micron High-Voltage Bipolar CMOS DMOS BCD Technology, optimized for applications requiring operating voltages of 5V to 30V. Main target applications are power


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    PDF XHB06 XHB06 nmos transistor 0.35 um npn pnp rf transistor bipolar cross reference l24c using a zener diode as a varicap NMOS depletion pspice model bsim3 model for 0.18 micron technology for hspice bsim3 model MOS RM3 QS 100 NPN Transistor analog devices transistor tutorials

    MwT-273

    Abstract: mwt 871 MwT-270 sii 021 s-parameter MWT273HP
    Text: MwT-2 26 GHz High Power GaAs FET M ic r o w a v e T e c h n o l o g y +24.5 DBM OUTPUT POWER AT 12 GHZ 9 DB SMALL SIGNAL GAIN AT 12 GHZ 0.3 MICRON REFRACTORY METAL7GOLD GATE 630 MICRON GATE WIDTH CHOICE OF CHIP AND THREE PACKAGE TYPES DESCRIPTION The MwT-2 is a GaAs M ESFET device whose nominal quarter-micron gate length and 630 micron gate width make it ideally


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    PDF QQQ0S51 MwT-273 mwt 871 MwT-270 sii 021 s-parameter MWT273HP

    F4029

    Abstract: No abstract text available
    Text: MwT-2 26 GHz High Power GaAs FET M ic r o w a v e T e c h n o l o g y +24.5 DBM OUTPUT POWER AT 12 GHZ 9 DB SMALL SIGNAL GAIN AT 12 GHZ 0.3 MICRON REFRACTORY METAUGOLD GATE 630 MICRON GATE WIDTH CHOICE OF CHIP AND THREE PACKAGE TYPES DESCRIPTION The MwT-2 is a GaAs M ESFET device whose nominal quarter-micron gate length and 630 micron gate width make it ideally


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    PDF 651-67Q0 F4029

    mwt-970

    Abstract: 16662 ic 74390 61787
    Text: MwT-9 M ic r o w ave 18 GHz High Power GaAs FET T echno lo g y ri iiiniiiMiiii! +26 dBm OUTPUT POWER AT 12 GHz 8.5 dB SMALL SIGNAL GAIN AT 12 GHz 0.3 MICRON REFRACTORY METAL/GOLD GATE 750 MICRON GATE WIDTH CHOICE OF CHIP AND THREE PACKAGE TYPES - • _ I


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    Untitled

    Abstract: No abstract text available
    Text: MwT-12 18 GHz High Power GaAs FET M ic r o w a v e T e c h n o l o g y 0.5 WATT POWER OUTPUT AT 12 GHz +39 dBm THIRD ORDER INTERCEPT HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METAL7GOLD GATE 900 MICRON GATE WIDTH DIAMOND-LIKE CARBON PASSIVATION DESCRIPTION


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    PDF MwT-12 MwT-12 at280

    TGS 822

    Abstract: No abstract text available
    Text: MwT-16 M ic r o w a v e • • • • • • 26 GHz High Power GaAs FET techno lo g y 0.5 WATT POWER OUTPUT AT 12 GHz +39 dBm THIRD ORDER INTERCEPT HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METAUGOLD GATE 900 MICRON GATE WIDTH DIAMOND-LIKE CARBON PASSIVATION


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    PDF MwT-16 MwT-16 TGS 822

    Untitled

    Abstract: No abstract text available
    Text: MwT-12 18 GHz High Power GaAs FET M ic r o w a v e T e c h n o l o g y 0.5 WATT POWER OUTPUT AT 12 GHz +39 dBm THIRD ORDER INTERCEPT HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METAL/GOLD GATE 900 MICRON GATE WIDTH DIAMOND-LIKE CARBON PASSIVATION DESCRIPTION


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    PDF MwT-12 MwT-12 ivT-12.

    RF MESFET S parameters

    Abstract: No abstract text available
    Text: MwT-A8 ÛÊVt M ic r o w a v e 16 GHz High Power GaAs FET techno lo g y H 0.6 WATT POWER OUTPUT AT 12 GHz +40 dBm THIRD ORDER INTERCEPT HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METALVGOLD GATE 1200 MICRON GATE WIDTH DIAMOND-UKE CARBON PASSIVATION CHOICE OF CHIP AND ONE


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    MWT-871HP

    Abstract: MWT871HP 557 b
    Text: MwT-8 16 GHz High Power GaAs FET M ic r o w a v e T e c h n o l o g y n • • • • 0.6 WATT POWER OUTPUT AT 12 GHz +40 dBm THIRD ORDER INTERCEPT HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METAL/GOLD GATE • 1200 MICRON GATE WIDTH • DIAMOND-LIKE CARBON PASSIVATION


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    transistor WT6

    Abstract: transistor WT6 45 transistor WT6 Equivalent WT6 transistor 651-220K pin configuration of ic 1496
    Text: MwT-6 18 GHz High Power GaAs FET M ic r o w a v e T e c h n o l o g y if 50f| • • • • • • 0.5 WATT POWER OUTPUT AT 12 GHz +39 dBm THIRD ORDER INTERCEPT HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METAUGOLD GATE 900 MICRON GATE WIDTH CHOICE OF CHIP AND ONE


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    Untitled

    Abstract: No abstract text available
    Text: $ k \ rs m M ic r o w a v e T e c h n o l o g y • • • • • MwT-H16 32 GHz High Power AIGaAs/lnGaAs PHEMT 28 dBm POWER OUTPUT AT 12 GHz 11 dB GAIN AT 12 GHz 0.3 MICRON REFRACTORY METAL/GOLD GATE 900 MICRON GATE WIDTH DIAMOND-LIKE CARBON PASSIVATION


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    PDF MwT-H16

    transistor MWTA 06

    Abstract: No abstract text available
    Text: MwT-11 M ic r o w a v e 14 GHz High Power GaAs FET tec h no lo g y l«-75 -*| i«-75 -*| 4> e » W7mi F • • • 1 WATT POWER OUTPUT AT 12 GHz HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METALVGOLD GATE • 2400 MICRON GATE WIDTH • DIAMOND-LIKE CARBON PASSIVATION


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    PDF wT-11 in11m MwT-11 transistor MWTA 06

    IC tt 3034

    Abstract: MWT7HP MWT-7 MwT-770 mwt 773 MWT-770HP
    Text: MwT-7 26 GHz Medium Power GaAs FET M ic r o w a v e T e c h n o l o g y n +20 dBm OUTPUT POWER AT 12 GHz EXCELLENT FOR BROADBAND GAIN OR OSCILLATOR APPUCATIONS • 0.3 MICRON REFRACTORY METALJGOLD GATE • 250 MICRON GATE WIDTH • CHOICE OF CHIP AND TWO PACKAGE TYPES


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    Untitled

    Abstract: No abstract text available
    Text: MwT-12 18 GHz High Power GaAs FET M ic r o w a v e T e c h n o l o g y • 0.5 WATT POWER OUTPUT AT 12 GHz • +39 dBm THIRD ORDER INTERCEPT • HIGH ASSOCIATED GAIN • 0.3 MICRON REFRACTORY METAL/GOLD GATE • 900 MICRON GATE WIDTH • DIAMOND-UKE CARBON PASSIVATION


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    PDF MwT-12 MwT-12

    Untitled

    Abstract: No abstract text available
    Text: MwT-15 M ic r o w a v e T 26 GHz High Power GaAs FET echnology -»j 50 p • • • • +24 dBm OUTPUT POWER AT 12 GHz 9.5 dB SMALL SIGNAL GAIN AT 12 GHz 0.3 MICRON REFRACTORY METAUGOLD GATE 630 MICRON GATE WIDTH ÏF j* | ^ 0 M » » j P _ 75 241 _ 72


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    PDF MwT-15 MwT-15

    transistor MWTA 06

    Abstract: mwta 06
    Text: MwT-A11 14 GHz High Power GaAs FET M ic r o w a v e T e c h n o l o g y • • • • • • 1 WATT POWER OUTPUT AT 12 GHz HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METAUGOLD GATE 2400 MICRON GATE WIDTH DIAMOND-LIKE CARBON PASSIVATION CHOICE OF CHIP AND ONE


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    PDF MwT-A11 MwT-A11 syste80 000Gb23 transistor MWTA 06 mwta 06

    Untitled

    Abstract: No abstract text available
    Text: MwT-3 26 GHz High Power GaAs FET M ic r o w a v e T e c h n o l o g y rr • • • • • +21 DBM OUTPUT POWER AT 12 GHZ 11 DB SMALL SIGNAL GAIN AT 12 GHZ 0.3 MICRON REFRACTORY METAL/GOLD GATE 300 MICRON GATE WIDTH CHOICE OF CHIP AND THREE PACKAGE TYPES


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    Untitled

    Abstract: No abstract text available
    Text: M w T -1 6 26 GHz High Power GaAs FET M ic r o w a v e T e c h n o l o g y rr • • • • • • 0.5 WATT POWER OUTPUT AT 12 GHz +39 dBm THIRD ORDER INTERCEPT HIGH ASSOCIATED GAIN 0.3 MICRON REFRACTORY METALVGOLD GATE 900 MICRON GATE WIDTH DIAMOND-UKE CARBON PASSIVATION


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    PDF MwT-16