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    M02014 Search Results

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    M02014 Price and Stock

    BM Group spa BM 02014

    Terminal: flat; 6.3mm; 0.8mm; 2 x male; M4; non-insulated,double
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME BM 02014 10
    • 1 -
    • 10 $0.176
    • 100 $0.133
    • 1000 $0.103
    • 10000 $0.103
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    VENKEL LTD FBM0201-400P

    Multi-Layer Ferrite Bead;0201;40R
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Venkel Ltd. FBM0201-400P Reel 13 Weeks, 4 Days 15,000
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    M02014 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    02014-DSH-001-C

    Abstract: MINDSPEED M02015 Mindspeed Technologies 266 dsh TIA AGC application note M02015
    Text: M02014 CMOS Transimpedance Amplifier with AGC for Fiber Optic Networks up to 2.5 Gbps The M02014 is a CMOS transimpedance amplifier with AGC. The AGC gives a wide dynamic range of 32 dB. The high transimpedance gain of 11 kΩ ensures good sensitivity. For optimum system performance, the M02014 die should be mounted with a photodetector inside a lensed


    Original     		PDF M02014 M02014 02014-DSH-001-C 02014-DSH-001-C MINDSPEED M02015 Mindspeed Technologies 266 dsh TIA AGC application note M02015

    02014-BRF-001-A

    Abstract: M02014 GPON block diagram TIA AGC application note avalanche photodiode ingaas ghz Avalanche cmos photodetector
    Text: 2.5 Gbps Transimpedance Amplifier with AGC M02014 Low-power, high-sensitivity 2.5 Gbps transimped ance amplifier fabricated in sub-micron CMOS The M02014 transimpedance amplifier TIA with automatic gain control (AGC) is fabricated in sub-micron CMOS for high


    Original     		PDF M02014 M02014 253na, 253na Overl000 02014-BRF-001-A 02014-BRF-001-A GPON block diagram TIA AGC application note avalanche photodiode ingaas ghz Avalanche cmos photodetector

    M02142

    Abstract: M02170 M82359 M83241 M83263 M83261 M02172 M21528 M82351 M82506
    Text: Silicon Solutions for Communication Applications Comcerto IP Processing Customer Premise 1000 Family of Low Power Embedded Packet Processors M83263 2 cores @ 650Mhz, VoIP, SMBSoC M83261 2 cores @ 650MHz, VoIP, Sec M83262 2 cores @ 650MHz, SMBSoC M83160 1 core @ 650MHz, Sec


    Original     		PDF M83263 650Mhz, M83261 M83262 M83160 M83251 533MHz, M02142 M02170 M82359 M83241 M83263 M83261 M02172 M21528 M82351 M82506

    020xx-PCN-006-A

    Abstract: M02007-3-WP-T H20-045-66C02 M02006-WP-T M02014-11 M02026-12 H20-050-16-66C02 M02007 M02006
    Text: May 13, 2009 CN 051309 Customer Notification Change to waffle pack used for die sales product Dear Valued Customer: This notification is to inform you of a change to the waffle pack tray for product sold in die form. This change is to migrate to a slightly larger die pocket dimension as shown in Table 1 below.


    Original     		PDF H20-045-66C02 H20-050-16-66C02 M02006-WP-T M02011-11 M02015-11 M02024-12 M02006E-WP-T M02013-3A M02016-3A M02026-12 020xx-PCN-006-A M02007-3-WP-T H20-045-66C02 M02006-WP-T M02014-11 M02026-12 H20-050-16-66C02 M02007 M02006