TL413
Abstract: crystal SM-49 74LS245DW IN5232B MMBT222ALT1 IC 92112 eeprom MMBT222a ZENER 1n5232 mch315c104kp 95MS15
Text: MOTOROLA SEMICONDUCTOR TECHNICAL INFORMATION BINGO MC68PM302 Passive ISA ISDN Card Signal Documentation Rev 0.6 Monday, March 4, 1996 This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
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MC68PM302
24-bit
0a0000h
0dc000h)
04000h)
TL413
crystal SM-49
74LS245DW
IN5232B
MMBT222ALT1
IC 92112 eeprom
MMBT222a
ZENER 1n5232
mch315c104kp
95MS15
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CA314DE
Abstract: 74ls154n SN72710N uln 2008 SN75450BN 1826-0138 SN74ALS00N MC889P SN72710L 9374PC
Text: INTEGRATED CIRCUIT CROSS REFERENCE 9 Integrated Circuits Replacement Part Cross Reference When selecting replacement parts for your HP products, you may notice that many manuals list only an HP part number for the part, even though it appears that this part is manufactured by one of the large semiconductor manufacturers. Service personnel often ask why only HP part numbers are
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UPD444CUPD5101L
UPD8228D
UPD8243C
UPD8251D
UPD8253D
UPD8255
UT-309
VFC32KP
WD8250A
XC79L05C
CA314DE
74ls154n
SN72710N
uln 2008
SN75450BN
1826-0138
SN74ALS00N
MC889P
SN72710L
9374PC
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mc31
Abstract: MCS31 MCS 4001
Text: Multi-Layer Ceramic Chip Capacitors MCS • MCH • MC Series #M C S Series [Dry plated termination type Termination is dry plated employing a thin film process, featuring high deflection resistance, high thermal cycle resistance and high heat resistance. This process helps to obtain larger capacitance in a smaller size and to achieve higher density mounting.
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MCS21
MCH21
MCS31
MCH31
mc31
MCS 4001
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Untitled
Abstract: No abstract text available
Text: 2- w io E 3 - in p u t " A N D - O R - IN V E R T " G A T E W IT H G A T E D C O M P L E M E N T A M TTL I MC500/400 series I V M C 5 0 3 •M C 5 5 3 M C403 • M C453 This device is the only gate of the basic positive A N D O R IN V E R T series that includes an additional
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MC500/400
MC50r
MCS53
MC403*
MC453
MC503,
MC403,
MC553/MC403,
MC453
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agpd capacitor cog 50v 0603
Abstract: b8888 IS555
Text: Multi-Layer Ceramic Chip Capacitors M CS • MCH • M C Series # M C S Series [Dry plated termination type Termination is dry plated employing a thin film process, featuring high deflection resistance, high thermal cycle resistance and high heat resistance. This process helps to obtain larger capacitance in a smaller size and to achieve higher density mounting.
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MCS18
MCS21
MCH21
agpd capacitor cog 50v 0603
b8888
IS555
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MC403
Abstract: MC563 TWT Wiring MC453 MC500 MC4531 ldr v/i characteristic mc400 MC503 MC553
Text: M T T L 2 -W ID E 3 -IN P U T A N D -O R -IN V E R T " G A T E W IT H G A T E D C O M P L E M E N T I M C 5 0 0 /4 0 0 s e r ie s M C 503 • M C 553 M C 403 • M C 453 T h is d e v ic e is th e o n l y g a te o f th e b a s ic p o s itiv e A M D O R IN V E R T
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MC500/400
MC503
MC553
MC403
MC453
MC503"
MC403"
MC503,
MC403
MC563
TWT Wiring
MC453
MC500
MC4531
ldr v/i characteristic
mc400
MC503
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Untitled
Abstract: No abstract text available
Text: TÏÏTTÏÏ7I C a p a citors • M ulti-Layer C eram ic Chip Capacitors • M C H Series Solder Plating Type 1) Capacitance range ■Class I A characteristic Type 50V SL characteristic 50V M C H18 0 5 - 330 MCH21 0 5 - 1,100 3 - Class II (U nit pF) UJ characteristic
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MCH21
MCH31
0178mm)
0330m
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RCM2008R
Abstract: 1SS299 bu24204 RCM2027 BA3422S BA843 BA6490FS da119 k2 BA6404 BA857
Text: 87 87 87 87 87 88 88 88 88 87 87 87 87 87 87 87 87 87 87 87 87 87 87 87 87 87 87 87 90 90 90 87 87 87 87 87 87 86 86 86 86 88 88 88 88 88 88 88 88 88 88 88 88 88 88 88 88 86 86 86 86 86 87 86 86 86 86 86 86 86 86 86 86 86 86 86 86 86 86 86 87 86 86 86 88 88
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2N3906
2N3946
2N3947
2N4059
N4060
2N4061
2N4062
2N4123
2N4124
2N4125
RCM2008R
1SS299
bu24204
RCM2027
BA3422S
BA843
BA6490FS
da119 k2
BA6404
BA857
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MFC6034
Abstract: MFC4040 MFC 4060A mc1312 MC1303 MC1371p lt 8202 mc1741 2n3055 application note LT 8224 TRANSISTOR triac tag 8518
Text: GENERAL INFORMATION Master Index Product Highlights 2 Selector Guides 3 Previews of Coming Linear Integrated Circuits Interchangeability Guide 5 Chip Information 6 M IL-M -38510 Program DATA SHEET SPECIFICATIONS 8 . . . in alpha-numerical sequence by device type number, unless otherwise
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