ANSI C78.377
Abstract: CREE MCE RGBW LM 3751 Lm 4046 cree lm
Text: CLD-AP20 Rev 7A binning & labeling Cree XLamp MC-E LED ® MC-E White MC-E Color Introduction MC-E Dynamic White table of contents This document describes the product nomenclature Introduction. 1 required to select and order Cree XLamp MC-E LEDs.
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CLD-AP20
ANSI C78.377
CREE MCE RGBW
LM 3751
Lm 4046
cree lm
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CREE MCE
Abstract: cree led mce lm 3844 LM 386-3 3874 Cree optics transistor k 4212 wp 4046 4017
Text: Cree XLamp® MC-E LED Binning and Labeling Introduction This document describes the product nomenclature required to select and order Cree XLamp MC-E LEDs. XLamp MC-E LEDs are tested and sorted into bins which are then combined into orderable kits identified by an order code.
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CLD-AP20
CREE MCE
cree led mce
lm 3844
LM 386-3
3874
Cree optics
transistor k 4212
wp 4046
4017
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LM 4138
Abstract: k 3919
Text: CLD-AP20 REV 6 BINNING & LABELING Cree XLamp MC-E LED ® INTRODUCTION TABLE OF CONTENTS This document describes the product nomenclature Introduction. 2 required to select and order Cree XLamp MC-E LEDs.
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CLD-AP20
LM 4138
k 3919
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0650
Abstract: No abstract text available
Text: 0.650" 0.650" top and bottom pad width only see side view for side pad width 0.503" 0.018" typ. Top View 1 0.050" typ. 0.018" dia. typ. 2 0.250" 0.062" MO 12/1 MC Side View .65 mm 0.015" typ. Rev Cha Upd B A compatible target board land dimensions A< 0.590"
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FR4/G10
SF-QFE080SA-L-01
0650
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irfb4115
Abstract: BTY79 equivalent diode skn 21-04 marking CODE W04 sot-23 bbc 598 479 DIODE mw 137 600g TFK 401 S 673 Vishay Telefunken tfk transistor INFINEON transistor marking W31 JYs marking transistor
Text: 573 Technical portal and online community for Design Engineers - www.element-14.com Discrete & Power Devices Page 700 Bridge Rectifiers . . . . . . . . . . . . . . . . . . . . . . . . Diodes Schottky . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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element-14
F155-6A
F155-10A
F165-15A
F175-25A
irfb4115
BTY79 equivalent
diode skn 21-04
marking CODE W04 sot-23
bbc 598 479 DIODE
mw 137 600g
TFK 401 S 673
Vishay Telefunken tfk transistor
INFINEON transistor marking W31
JYs marking transistor
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Untitled
Abstract: No abstract text available
Text: C200H-MC221 Motion Control Unit Operation Manual: Details Revised January 1999 iv Notice: OMRON products are manufactured for use according to proper procedures by a qualified operator and only for the purposes described in this manual. The following conventions are used to indicate and classify precautions in this manual. Always heed
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C200H-MC221
W315-E1-2
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PA-QIP70-01
Abstract: No abstract text available
Text: 0.600" 0.400" 0.100" 0.050" 1991 I.E. 1.800" QIP70-01/02 0.100" Top View 1.000" Side View 0.297" 0.173" 0.300" Side View with Wire Wrap Pins 0.018" 0.193" 0.700" 0.025" sqr. PA-QIP70-01 Drawing © 1995 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121
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QIP70-01/02
PA-QIP70-01
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SF-QFE144SB-L-01
Abstract: QFP132-G-01 qfp132
Text: Surface mountable QFP emulator foot; leadless version, sized to fit on 144 Body + 3.9mm. position 0.65mm. pitch land pattern. 1.220" 0.050" 0.018" 0.250" 0.063" 0.65mm 1.220" A Substrate: FR4/G10, 0.0625"±0.007" thick. Pins: Material - Brass Alloy 360, 1/2H ; finish - 10µ" Gold over 100/150µ" Nickel.
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FR4/G10,
SF-QFE144SB-L-01
PC-PGA132/QFP132-G-01
QFP132-G-01
qfp132
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SF-PLCC52-J-05
Abstract: No abstract text available
Text: 0.050" 1 47 8 2 0.770" 34 21 2 0.770" 0.050" 0.018"±0.001" dia. 1 0.266" Top View 0.094" Side View 1 2 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . Description: Surface Mount PLCC emulator foot (low profile)
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FR4/G10
SF-PLCC52-J-05
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dip32
Abstract: No abstract text available
Text: 0.700" 1.600" 0.100" typ. 1 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 0.600" 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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FR4/G10
finish10µ
PC-DIP/DIP32-01
dip32
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Untitled
Abstract: No abstract text available
Text: 0.500" 1.200" 1 0.300" PC-DIP/DIP24-06 0.173" 0.297" 2 0.400" PC-DIP/DIP24-06W 0.200" 0.700" End Views 1 0.3" Female-0.4" Male 2 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;
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PC-DIP/DIP24-06
PC-DIP/DIP24-06W
FR4/G10
finish10µ
PS-DIP/DIP24-06
PC-DIP/DIP24-06Dwg,
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Untitled
Abstract: No abstract text available
Text: 0.700" DIP20-02 PCB 1991 I.E. 1.000" 1 0.600" 3 0.173" 0.297" 2 0.020" 0.400" 0.6" Female -0.4" Male PC-DIP/DIP20-02 Drawing © 1998 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: 651 452-8100 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high
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DIP20-02
FR4/G10
PC-DIP/DIP20-02
finish10µ
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Untitled
Abstract: No abstract text available
Text: 0.500" 1.400" 1 0.400" 3 0.173" 0.288" .4"F-.3"M 0.018" 0.300" PC-DIP/DIP28-05 Drawing 1998 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating
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FR4/G10
PC-DIP/DIP28-05
finish10µ
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Untitled
Abstract: No abstract text available
Text: 0.700" 1.400" 1 0.600" 3 0.173" 0.297" .6"F-.3"M 0.018" 2 0.300" PC-DIP/DIP28-03 Drawing 1998 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating
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PC-DIP/DIP28-03
FR4/G10
finish10µ
DIP/DIP28-03
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Untitled
Abstract: No abstract text available
Text: 0.700" 1.600" 1 Top View 0.600" 3 0.173" 0.297" 0.020" 2 0.400" End View 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. .
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FR4/G10
finish10µ
PC-DIP/DIP32-02
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Untitled
Abstract: No abstract text available
Text: 1.600" 1 0.382" 0.700" 0.297" 0.173" 2 3 0.018" Dia. Typ. 0.600" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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FR4/G10
finish10µ
PC-DIP/DIP32-04
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SF-PLCC84-J-01
Abstract: No abstract text available
Text: Pin 1 75 12 75 1 12 54 33 Top View with pin assignments 54 33 Side A 0.050" typ. 0.018"±0.001" dia. typ. 0.373" 0.207" Side View 0.050" typ. 0.017" 1.136" 1.186" A compatible target board land dimensions A< 1.096" B> 1.176" Generic pattern not representative
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FR4/G10,
SF-PLCC84-J-01
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DIP64
Abstract: No abstract text available
Text: 1.000" 3.200" 1 0.900" 0.297" 0.173" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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FR4/G10
finish10µ
PC-DIP/DIP64-01
DIP64
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Untitled
Abstract: No abstract text available
Text: 1 22 1 22 11 12 0.800" 0.100" 1 12 0.400" 3 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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FR4/G10
finish10µ
PC-DIP/DIP16-01
PA-DIP/DIP16-01
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qfp132
Abstract: SF-PLCC84-J-05 QFP132-G-01
Text: Pin 1 75 12 75 1 12 54 33 Top View with pin assignments 54 33 0.050" typ. 0.018"±0.001" dia. typ. 0.264" 0.098" Side View 0.017" 0.050" typ. 1.136" 1.186" A compatible target board land dimensions A< 1.096" B> 1.176" Generic pattern not representative of actual land
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FR4/G10,
SF-PLCC84-J-05
PC-PGA132/QFP132-G-01
qfp132
QFP132-G-01
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ec81 TUBE
Abstract: MC 4528 4528 EC81 philips BC ec81w
Text: PHILIPS fÊcsi UHF OSCILLATOR TRIODE up to 750 Mc/s TB IODE OSCILLATRICE U.H.F.( Jusqu'à 750 Jîo/s) UHF-OSZILLATORTRIODE (bis 750 MHz) Heating : indirect by A.C.or D.O. parallel supply Chauffage: indirect par C.A.ou C.C. alimentation- parallèle Heizung s indirekt durch Wechselöder Gleichstrom
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7R0327&
ec81 TUBE
MC 4528
4528
EC81
philips BC
ec81w
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Untitled
Abstract: No abstract text available
Text: F-205-1 M M C X -P -P -H -S T -T H 1 M M C X -J-P -H -S T -T H 1 M MC X -J -P -H -R A -T H 1 in ru u y ii \ JEWMICRO-MINI RF THRU-HOLE SERIES SPECIFICATIONS For complete specifications see www.samtec.com?MMCX-TH C ontact Material: BeCu Insu lator Material:
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F-205-1
1000M12
500Vrms,
170Vrms,
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JRC 45600
Abstract: YD 803 SGS 45600 JRC TDA 7277 TDA 5072 krp power source sps 6360 2904 JRC Sony SHA T90 SA philips HFE 4541
Text: I SEMICON INDEXES Contents and Introduction Manufacturers' Information V O LU M E 3 INTERNATIONAL INTEGRATED CIRCUITS INDEX 15th EDITION 1997 Numerical Listing of Integrated Circuits Substitution Guide U D C 621.382.3 Diagram s THE S E M IC O N INTERNATIONAL INDEXES
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ZOP033
ZOP035
ZOP036
ZOP037
ZOP038
ZOP039
ZOP045
ZOP042
ZOP041
ZOP043
JRC 45600
YD 803 SGS
45600 JRC
TDA 7277
TDA 5072
krp power source sps 6360
2904 JRC
Sony
SHA T90 SA
philips HFE 4541
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logos 4012B
Abstract: 1LB553 Rauland ETS-003 Silec Semiconductors MCP 7833 4057A transistor sr52 74c912 1TK552 74S485
Text: L p i > « , * S E m Ic O N VOLUM E 3 INTERNATIONAL INTEGRATED CIRCUITS INDEX 5th EDITION 1985 Revised June 1985 COMPILED AND PUBLISHED BY S E M IC O N IN D E X E S L IM IT E D THE SEMICON INDEX SERIES CONSISTS OF VOLUME 1 TRANSISTOR INDEX VOLUME 2 DIODE & SCR INDEX
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TDA1510
TDA1510A
logos 4012B
1LB553
Rauland ETS-003
Silec Semiconductors
MCP 7833
4057A
transistor sr52
74c912
1TK552
74S485
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