Untitled
Abstract: No abstract text available
Text: SPECIFICATION FOR APPROVAL REF : 20100706-C PROD. NAME PAGE: 1 ABC'S DWG NO. HIGH CURRENT MULTILAYER CHIP BEAD MB□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： H A D D C I G I PCB Pattern B Unit : m/m Series A
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20100706-C
MB2029
MB1608
AR-001A
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Untitled
Abstract: No abstract text available
Text: SPECIFICATION FOR APPROVAL REF. : PROD. High Current Multilayer Chip Bead MB□□□□□□□□L□-□□□ ABC'S DWG NO. NAME 20130819-D REV. PAGE 1 Ⅰ﹒Configuration and dimensions： A D H C D B I G I Unit：m/m PCB Pattern Series MB2029 MB1608
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20130819-D
MB2029
MB1608
AR-001C
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MB2029
Abstract: MB4532700 20100407-B MB2029300YL mb160 MB3261
Text: SPECIFICATION FOR APPROVAL REF : 20100407-B PROD. NAME PAGE: 1 ABC'S DWG NO. HIGH CURRENT MULTILAYER CHIP BEAD MB□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： H A D D G C I I PCB Pattern B Series MB4532 MB4516
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20100407-B
MB4532
MB4516
MB3261
MB2029
MB1608
MB2029
MB4532700
20100407-B
MB2029300YL
mb160
MB3261
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