AUS308
Abstract: AUS308 thermal kester 256 AUS303 AUS-308 aus5 kester 245 solder wire Lead Free reflow soldering profile BGA
Text: Challenges in Manufacturing Reliable Lead-Free and RoHS-Compliant Components WP-CHMFGRELLDFR-2.0 White Paper The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that
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Abstract: No abstract text available
Text: 7 Series FPGAs SelectIO Resources User Guide UG471 v1.3 October 31, 2012 The information disclosed to you hereunder (the "Materials") is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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UG471
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FBG676
Abstract: FFG1156
Text: 7 Series FPGAs Packaging and Pinout Product Specification UG475 v1.9 February 14, 2013 The information disclosed to you hereunder (the "Materials") is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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UG475
FBG676
FFG1156
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T443
Abstract: Chomerics T710 D257 D374 D792 T310 T725 chomerics 77 PARKER HANNIFIN parker
Text: TECHNICAL BULLETIN • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs
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KJR9022E
Abstract: KJR4013E GTO thyristor driver KJR651 KJR9061E silicone low volatile potting G1821 KJR-9010E KJR651E KJR9060E
Text: Shin-Etsu Liquid Coating Materials for Electronic Devices KJR Series Junction Coating Resins Liquid Type Silicone & Polyimide Silicone for Electronic, Electric and Optical Devices Main Features ●Ultra High Purity ●High Thermal Stability ●High Electrical Stability
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TCR500
Abstract: SiCr wire bond 60k4
Text: PMC Passive Micro Components OVERVIEW PMC thin-film technology offers comprehensive materials and processes combinations allowing electronic designers superior space saving, tolerance and signal integrity for semi custom designs in the MHz to GHz spectrum.
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S-PMC00M107-N
TCR500
SiCr
wire bond
60k4
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intel mch 945gc
Abstract: bga dye pry UL1439 945gc PCM45F atx specification v2.2 BGA heatsink compressive force 437-pin foxconn motherboard 945gc datasheet
Text: Intel Atom Processor 300Δ Series Thermal and Mechanical Design Guidelines — Supporting Nettop Platform for ‘08 September 2008 Document Number: 320530-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITH NO WARRANTIES, EXPRESS OR
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E20724-001
E40825-001
945GC
E37585-001
intel mch 945gc
bga dye pry
UL1439
PCM45F
atx specification v2.2
BGA heatsink compressive force
437-pin
foxconn motherboard
945gc datasheet
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antimony trioxide epoxy molding
Abstract: material declaration semiconductor package Material declaration organic materials oxygen material declaration amd 104 c1k
Text: Chapter 4 Package Materials Material Declaration Data Sheets. AMD has created material data sheets for some of its more popular package designs. These data sheets are organized as follows: • Suface-Mount Array Packages PBGA, page 6-19 • Surface-Mount Leaded Packages
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micro Sim Card connector
Abstract: QUALCOMM FLIP CHIP ASSEMBLY LICC avx 2004 circuit of smart hearing aid varistor diode spice model transient time extract MSM6000 qualcomm 7200 smd w2h 100v varistor K30 diode 25PH 800
Text: AVX is the technology leader in the Passive electronic component and connector markets. Each year AVX Corporation accepts the challenge of helping Design Engineers create superior products for their customers. Our team of innovators around the world, utilize cutting edge research, design expertise and materials
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S-WN0415M1004-R
micro Sim Card connector
QUALCOMM FLIP CHIP ASSEMBLY
LICC avx 2004
circuit of smart hearing aid
varistor diode spice model transient time extract
MSM6000
qualcomm 7200
smd w2h
100v varistor K30
diode 25PH 800
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capacitor 630v
Abstract: make SMPS inverter welding machine Kyocera Kinseki CRYSTAL CX smd 0306 package KT2520 electronic passive components catalog AVX vARICON qpl ic laptop motherboard skycap LCD inverter 94v 0
Text: AVX is the technology leader in the Passive electronic component and connector markets. Each year AVX Corporation accepts the challenge of helping Design Engineers create superior products for their customers. Our team of innovators around the world, utilize cutting edge research, design expertise and materials
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S-WN0610M1006-R
capacitor 630v
make SMPS inverter welding machine
Kyocera Kinseki CRYSTAL CX
smd 0306 package
KT2520
electronic passive components catalog
AVX vARICON qpl
ic laptop motherboard
skycap
LCD inverter 94v 0
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GR-78-CORE
Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with
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65-0n-Tien
GR-78-CORE
ROSIN FLUX TYPE ROL0
sn63pb37
Sn62Pb36Ag2
J-STD-006A
RF771
bellcore GR-78
sn63pb37 solder wire
959T
TC-527
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mt 1389 de
Abstract: srfe 1164 SAB 8048 P 220 SM 590 SRFE 1126 pin DIAGRAM OF IC 7400 SH7785 datasheet tea 1601 t ca2 fn 144 manual R8A77850 mt 1389
Text: REJ09B0261-0100 32 SH7785 Hardware Manual Renesas 32-Bit RISC Microcomputer SuperH RISC Engine Family SH7780 Series Rev.1.00 Revision Date: Jan. 10, 2008 Notes regarding these materials 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
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REJ09B0261-0100
SH7785
32-Bit
SH7780
mt 1389 de
srfe 1164
SAB 8048 P 220 SM 590
SRFE 1126
pin DIAGRAM OF IC 7400
SH7785 datasheet
tea 1601 t
ca2 fn 144 manual
R8A77850
mt 1389
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82915g motherboard
Abstract: Intel 915G 82915GV 915Gv BGA PACKAGE thermal profile lga775 intel 82915gl PENTIUM4 intel 915gv components 915PL ICH6
Text: R Intel 915G/915GV/915GL/910GL Express Chipset Thermal Design Guide For the Intel® 82915G/82915GV/82915GL, 82910GL Graphics and Memory Controller Hub GMCH February 2005 Document Number: 301469-006 R THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES,
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915G/915GV/915GL/910GL
82915G/82915GV/82915GL,
82910GL
915G/915GV/910GL
82915g motherboard
Intel 915G
82915GV
915Gv
BGA PACKAGE thermal profile lga775
intel 82915gl
PENTIUM4
intel 915gv components
915PL
ICH6
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4572 IC 8PIN
Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Text: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines
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503-Pin
4572 IC 8PIN
epx780
TQFP 144 PACKAGE DIMENSION
ALTERA EP610
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TRANSISTOR REPLACEMENT GUIDE d882
Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
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transistors BC 458
Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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ep600i
Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Text: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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EP20K100E
Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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49-pin
169-pin
EP20K100E
EP20K160E
EP20K200
EP20K200E
EP20K300E
EP20K60E
EP20K100
0245 TQFP-208
208RQFP
280-PGA
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DS-0030-03
Abstract: 78XX 7814 a23 Hifn Security Platform QFBR HDFK 16 I QED5231 172110 pro "ESP" K349
Text: 1HWZRUN 6HFXULW\ 3URFHVVRU 'HYLFH 6SHFLILFDWLRQ 7814/7851/7854 Network Security Processor Hifn supplies the Internet’s most important raw materials for the creation of intelligent and secure networks: compression, encryption, and flow classification. This is central to the growth of the Internet, helping to
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mt 1389 de
Abstract: 1838 b infrared Schematics AL 1450 DV stc 1740 relay ras 1210 1838 t infrared cd 1619 CP bt 1690 scr pin diagram for IC cd 1619 cr tea 1601
Text: REJ09B0256-0100 32 SH7763 Hardware Manual Renesas 32-Bit RISC Microcomputer SuperHTM RISC Engine Family SH-4A Series R5S77630 Rev.1.00 Revision Date: Oct. 01, 2007 Rev. 1.00 Oct. 01, 2007 Page ii of lxvi Notes regarding these materials 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
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REJ09B0256-0100
SH7763
32-Bit
R5S77630
mt 1389 de
1838 b infrared
Schematics AL 1450 DV
stc 1740
relay ras 1210
1838 t infrared
cd 1619 CP
bt 1690 scr
pin diagram for IC cd 1619 cr
tea 1601
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7 Series FPGAs GTP Transceivers User Guide, UG482 v1.5
Abstract: No abstract text available
Text: 7 Series FPGAs GTP Transceivers User Guide UG482 v1.6 August 28, 2013 Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available “AS IS” and with all faults, Xilinx hereby DISCLAIMS ALL
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UG482
7 Series FPGAs GTP Transceivers User Guide, UG482 v1.5
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PCN0708
Abstract: hysol BGA sumitomo CB0260AT cte table bga marking HB diode CRP-3900 CBO260AT EPF10K100A EPF10K100E
Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0708 UPDATE ENCAPSULANT MATERIAL CHANGE FOR BGA Pb-FREE PACKAGES Change Description This is an update to PCN0708, published July 2007. Altera is implementing encapsulant material changes on the ball-grid array BGA Pb-free packages assembled in Amkor Korea and
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PCN0708
PCN0708,
CRP-3300NH
CB0260AT
CRP-3900
CB062
PCN0708
hysol
BGA sumitomo
CB0260AT
cte table bga
marking HB diode
CRP-3900
CBO260AT
EPF10K100A
EPF10K100E
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Untitled
Abstract: No abstract text available
Text: Product Number: 599-10-064-04-000429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel 064-04-000 8 X 8 # Of Pins Mill-Max Part Number 64 599-10-064-04-000429 RoHS Compliant LOOSE PIN:
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C36000)
C/885
2002/95Annex
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Abstract: No abstract text available
Text: Product Number: 582-11-256-08-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 256-08-005
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