LQFP Package tray
Abstract: 128-PIN ST-TQ142014TJ-1 NEC 87 tray dimensions
Text: TRAY CONTAINER A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A-A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 128-pin Plastic LQFP (1.4mm thick) 5.62 6.35 7.62 19.87 Quantity (pcs)
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ST-TQ142014TJ-1
100-pin
128-pin
SSD-A-H5941-1
LQFP Package tray
ST-TQ142014TJ-1
NEC 87
tray dimensions
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LQFP Package tray
Abstract: TQFP14X14X1 LQFP "100 pin" PACKAGE LQFP Package 128-pin 128-PIN tray container dimensions TRAY CONTAINER LQFP14 100-PIN PLASTIC LQFP NEC tqfp14x14x1.4
Text: TRAY CONTAINER 7 15.45 16.7 6x15=90 21.00 A' A 150°C MAX. PPE 105.0 TQFP14X14X1.4 15.40 16.7 20.30 284.2 315.0 322.6 Section A – A' 16.7 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 80-pin Plastic LQFP (1.4mm thick) 100-pin Plastic LQFP (1.4mm thick)
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TQFP14X14X1
LQFP14
80-pin
100-pin
128-pin
SSD-A-H6285-2
-A-H6285-2
LQFP Package tray
LQFP "100 pin" PACKAGE
LQFP Package 128-pin
tray container dimensions
TRAY CONTAINER
100-PIN PLASTIC LQFP NEC
tqfp14x14x1.4
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LQFP Package tray
Abstract: TQFP 1414 1.4mm JEDEC tray standard TQFP 1414
Text: HEAT PROOF 16.7 15.45 21.00 A' 6x15=90 A 150°CMAXPPE 7 105.0 TQFP 14×14×1.4 135.9 UNIT : mm 15.40 16.7 20.30 284.2 315.0 322.6 < SECTION A – A' > 16.7 5.62 6.35 7.62 13.85 Applied Package Quantity (pcs) 100-pin Plastic LQFP (1.4mm thick) MAX. 90 Tray
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100-pin
TQFP14
LQFP Package tray
TQFP 1414 1.4mm
JEDEC tray standard TQFP 1414
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ST-TQ142014TJ-1
Abstract: LQFP Package tray
Text: A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A – A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 5.62 6.35 7.62 19.87 Quantity (pcs) MAX. 72 Tray Material Heat Proof Temp.
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ST-TQ142014TJ-1
100-pin
ST-TQ142014TJ-1
LQFP Package tray
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Untitled
Abstract: No abstract text available
Text: Packing Instruction Page:1/1 Tube and Tray Unit Quantity Update: June 3,2015 Description SRAM Product / Package 28 SOJ 25 ea / Tube 2,500 ea / 100 Tube / Box 10,000 ea / 4 Box / CTN 32 SOJ 22 ea / Tube 2,200 ea / 100 Tube / Box 8,800 ea / 4 Box / CTN 28 SOP
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9B/18B
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mp 9141 es
Abstract: MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L
Text: Automotive Quarter 4, 2010 SG187Q42010 Rev 40 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad range of
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SG187Q42010
mp 9141 es
MC33662
MPXY8600
MPC5673F
MPC56xx
fet e300
MPC5606B
MC33905
mpxy8500
MPC5643L
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MPXY8600
Abstract: MPC5674 MPC5603 MPC56xx MPC5668G MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E
Text: Automotive Quarter 4, 2009 SG187Q42009 Rev 37 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: i.MX and MPC5668G product families; S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 and MPC5553 products in 208 MAPBGA packages.
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SG187Q42009
MPC5668G
S12XE,
MPC551x,
MPC560xS,
MPC563xM,
MPC560xB,
MPC5533,
MPC5534
MPC5553
MPXY8600
MPC5674
MPC5603
MPC56xx
MPC55XX JTAG
MPXY8600A
MC33730
MPC5516E
MPC5517E
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MC908LJ24
Abstract: MC908mr16 mc908mr32 xc912dg128 MC908Lk24 mc9s08dz32 reference manual MC9S08SH4 MC3PHAC MC9S08AW32 dsp56f803bu80e
Text: 8/16/32 Bit Microcontrollers Quarter 1, 2008 SG1006Q12008 Rev 0 FREESCALE’S 8-BIT PRODUCTS SUMMARY For complete part number information and temperature definitions, refer to Product Numbering System on page SG1006-9. General Purpose Products Product Flash
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SG1006Q12008
SG1006-9.
10-Bit
HCS08
MC9S08AW60
MC9S08AW32
MC908LJ24
MC908mr16
mc908mr32
xc912dg128
MC908Lk24
mc9s08dz32 reference manual
MC9S08SH4
MC3PHAC
MC9S08AW32
dsp56f803bu80e
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MC908LJ24
Abstract: MC908Lk24 MC908MR16 mc908mr32 MC3PHAC xc912bc32 MC68376 bdm programming MC9S08SH4 xc912dg128 USBMULTILINKBDME
Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56852VFE, DSP56F807VF80, DSP56F807VF80E, MC56F8357VVFE, MC56F8367VVFE
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DSP56852VFE,
DSP56F807VF80,
DSP56F807VF80E,
MC56F8357VVFE,
MC56F8367VVFE
SG1006Q12008
MC908LJ24
MC908Lk24
MC908MR16
mc908mr32
MC3PHAC
xc912bc32
MC68376 bdm programming
MC9S08SH4
xc912dg128
USBMULTILINKBDME
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9s08dz32
Abstract: 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882
Text: Automotive Quarter 4, 2007 SG187Q42007 Rev 29 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad
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SG187Q42007
9s08dz32
9s12xeq384 144 QFP
908QY1
9S12XDT256 manual
9S12XHZ256
9s08sg32
9S08DZ128
NEXUS iso
MC33810
MC33882
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 10, 11/2012 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)
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MPC5604BC
MPC5604B/C
QFN12
OT-343R
32-bit
e200z0)
16-bit
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tray 20 x 14
Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type
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E04102
tray 20 x 14
BGA 31 x 31 tray
bga trays
tray bga 17
bga tray
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antistatic epe foam
Abstract: mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220
Text: The Operation Instruction of Packing Materials PURPOSE Warehouse and Subcontractors according to the instruction for purchaseing and incoming inspection, formulate the Operation Instruction of Packing Materials. SCOPE Related all packing materials in warehouse.
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200mm
150mm
118MIL
150MIL
300MIL
antistatic epe foam
mark JS sot-25
V7100
sot89 MARK JB
150MIL
300MIL
600MIL
SOT-25 JB
QFP Shipping Trays
TTO-220
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MS-026 lqfp 80
Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Text: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging
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mpc5604
Abstract: mpc5604 reference design MPC5604B MPC5603B sPC560 MPC5604 spi example
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 11, 12/2012 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet Features • • • •
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MPC5604BC
MPC5604B/C
QFN12
MPC5604B/C
OT-343R
32-bit
e200z0)
16-bit
mpc5604
mpc5604 reference design
MPC5604B
MPC5603B
sPC560
MPC5604 spi example
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mpc5604
Abstract: MPC5603B Errata Sheet mpc5604 reference design MPC5604B LQFP-64 footprint MPC5604 FlexCAN mpc560xB reference manual SPC560B MPC560* reference manual
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 10, 11/2012 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm Microcontroller Data Sheet
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MPC5604BC
MPC5604B/C
QFN12
OT-343R
32-bit
e200z0)
16-bit
mpc5604
MPC5603B
Errata Sheet
mpc5604 reference design
MPC5604B
LQFP-64 footprint
MPC5604 FlexCAN
mpc560xB reference manual
SPC560B
MPC560* reference manual
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 11.1, 10/2013 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet Features • • •
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MPC5604BC
MPC5604B/C
QFN12
OT-343R
32-bit
e200z0)
16-bit
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Untitled
Abstract: No abstract text available
Text: ARM-based Flash MCU SAM4N Series SUMMARY DATASHEET SAM4N8/16 Description The Atmel SAM4N series is a member of a family of Flash microcontrollers based on the high performance 32-bit ARM Cortex®-M4 RISC processor. It operates at a maximum speed of 100 MHz and features up to 1024 Kbytes of Flash and up to 80
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SAM4N8/16
32-bit
16-bit
10-bit
12-bit
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mpc5605
Abstract: MPC5605B MPC5606B CC 4093 N MPC5607 MPC5607B pj 88 LV IC 4093 pin configuration ic lm 4704 sdc 7500 pwm control
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5607B Rev. 5, 08/2010 MPC5607B 100 LQFP 14 mm x 14 mm MPC5607B Microcontroller Data Sheet • Single issue, 32-bit CPU core complex e200z0h – Compliant with the Power Architecture technology
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MPC5607B
MPC5607B
32-bit
e200z0h)
16-bit
32-bit
mpc5605
MPC5605B
MPC5606B
CC 4093 N
MPC5607
pj 88 LV
IC 4093 pin configuration
ic lm 4704
sdc 7500 pwm control
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 12, 04/2014 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)
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MPC5604BC
MPC5604B/C
QFN12
OT-343R
32-bit
e200z0)
16-bit
32-bit
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LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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TQFP 100 pin ic
Abstract: 208ld
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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MPC5604B
Abstract: mpc5604 MPC5603 MPC5602B MPC5607 trace MPC56 MPC560 ic lm 4704 MPC5603B ordering MPC56
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 8, 11/2010 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 15 MAPBGA mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet SOT-343R ##_mm_x_##mm 100 LQFP
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MPC5604BC
MPC5604B/C
QFN12
OT-343R
32-bit
e200z0)
MPC5604B
mpc5604
MPC5603
MPC5602B
MPC5607
trace MPC56
MPC560
ic lm 4704
MPC5603B ordering
MPC56
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MS-026
Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128
Text: LEADFRAME data sheet LQFP PowerQuad 4 Features: LQFP PowerQuad® 4 Packages: LQFP PowerQuad® 4 PQ4 is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is
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