P09N02
Abstract: No abstract text available
Text: v00.1106 QUALITY ASSURANCE Record Lot Number on List of Materials for Each Part Listed Inspect MMICs and ICs Clean Housing Install Feedthrus Clean Housing Epoxy Substrates Solder Components Clean Housing Epoxy Attach All Chip Components Wirebond 100% Visual Inspection
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W10N02,
W09N01,
W09N32
W09N03,
MIL-STD-883
P15N04,
P03N01,
P09N02,
P09N02
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Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0902 MS10 E – 10 LEAD PLASTIC MSOP PACKAGE PACKAGE OUTLINES MS10 (E) Package Outline Drawing
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MS10E
MS10G
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Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0902 S8 E – 8 LEAD PLASTIC SOIC PACKAGE PACKAGE OUTLINES S8 (E) Package Outline Drawing
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Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0902 QS16 E – 16 LEAD PLASTIC QSOP PACKAGE PACKAGE OUTLINES QS16 (E) Package Outline Drawing
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QS16E
QS16G
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MS8G (E) - 8 Lead Plastic MSOP package
Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0902 MS8 E – 8 LEAD PLASTIC MSOP PACKAGE PACKAGE OUTLINES MS8 (E) Package Outline Drawing
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hittite part marking
Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0902 LP4 E – 4 x 4 mm QUAD FLATPACK NO-LEAD (QFN) PLASTIC PACKAGE PACKAGE OUTLINES
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Untitled
Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0704 LP6 E – 6 x 6 mm QUAD FLATPACK NO-LEAD (QFN) PLASTIC PACKAGE PACKAGE OUTLINES
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Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK LP7D E – 7 x 7 mm QUAD FLATPACK NO-LEAD (QFN) PLASTIC PACKAGE TOP VIEW .280 .272 48
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02X45Â
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5007
Abstract: CLASS s
Text: Space Level Class S Product Screening Space Level (Class S) MMIC Die Screening & Qualifi cation Hittite Microwave offers Class S element evaluation in accordance with MIL-PRF-38534 on standard & custom product die. We are qualified by major spacecraft OEMs
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MIL-PRF-38534
MIL-STD883
5007
CLASS s
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HITTITE LOT CODE
Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK Product Change Notification PCN Number: 120020 PCN Date: 11/01/2013 Product Change Notification Form
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HMC654LP2
HMC655LP2
HMC656LP2
HMC657LP2
HMC658LP2
HMC667LP2
HMC788LP2
HMC946LP2
PCN120020
CP131214
HITTITE LOT CODE
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Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0809 C-19 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-19 Package Outline Drawing
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0609 C-15 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-15 Package Outline Drawing
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0909 C-20 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-20 Package Outline Drawing
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.1210 LP4B E – 4 x 4 mm QUAD FLATPACK NO-LEAD (QFN) PLASTIC PACKAGE PACKAGE OUTLINES
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK LP9 E – 9 x 9 mm QUAD FLATPACK NO-LEAD (QFN) PLASTIC PACKAGE PACKAGE OUTLINES LP9 (E) Package Outline Drawing
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Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0902 QS24 E – 24 LEAD PLASTIC QSOP PACKAGE PACKAGE OUTLINES QS24 (E) Package Outline Drawing
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QS24E
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0902 S14 E – 14 LEAD PLASTIC SOIC PACKAGE PACKAGE OUTLINES S14 (E) Package Outline Drawing
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v01.0109 ST89 E – 4 LEAD PLASTIC SOT89 PACKAGE PACKAGE OUTLINES ST89 (E) Package Outline Drawing
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MP-180S
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v01.0109 SOT26 E – 6 LEAD PLASTIC SOT26 PACKAGE PACKAGE OUTLINES SOT26 (E) Package Outline Drawing
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v01.0109 SC70 E – 6 LEAD 2x2 mm PLASTIC SC70 PACKAGE PACKAGE OUTLINES SC70 (E) Package Outline Drawing
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0506 LP2 E – 2 x 2 mm DUAL FLATPACK NO-LEAD (DFN) PLASTIC PACKAGE PACKAGE OUTLINES
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.1103 LP5 E – 5 x 5 mm QUAD FLATPACK NO-LEAD (QFN) PLASTIC PACKAGE PACKAGE OUTLINES
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0902 LP3 E – 3 x 3 mm QUAD FLATPACK NO-LEAD (QFN) PLASTIC PACKAGE PACKAGE OUTLINES
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Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0809 C-17 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-17 Package Outline Drawing
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