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    LGA VOIDING Search Results

    LGA VOIDING Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    CSD87501L Texas Instruments 30V, N ch NexFET MOSFET™, dual common drain LGA, 5.5mOhm 10-PICOSTAR Visit Texas Instruments Buy
    CSD83325L Texas Instruments 12V, N ch NexFET MOSFET™, dual LGA, 5.9mOhm 6-PICOSTAR Visit Texas Instruments Buy
    CSD25480F3 Texas Instruments -20V, P ch NexFET MOSFET™, single LGA 0.6x0.7, 159mOhm 3-PICOSTAR -55 to 150 Visit Texas Instruments Buy
    CSD17381F4 Texas Instruments 30V, N ch NexFET MOSFET™, single LGA 1.0 x 0.6mm, 117mOhm 3-PICOSTAR -55 to 150 Visit Texas Instruments Buy
    CSD17381F4T Texas Instruments 30V, N ch NexFET MOSFET™, single LGA 1.0 x 0.6mm, 117mOhm 3-PICOSTAR -55 to 150 Visit Texas Instruments Buy
    CSD17382F4T Texas Instruments 30V, N ch NexFET MOSFET™, single LGA 1.0 x 0.6mm, 67mOhm 3-PICOSTAR -55 to 150 Visit Texas Instruments Buy

    LGA VOIDING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LGA voiding

    Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		PDF AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale

    AN3281

    Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		PDF AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate

    LGA voiding

    Abstract: AN1091 international rectifier application note AN-1091 AN-1028 AN-1029 AN10912 vias
    Text: Application Note AN-1091 Recommended PCB Via Design for International Rectifier’s BGA and LGA Packages By Kevin Hu, International Rectifier Table of Contents Page Introduction . 2


    Original     		PDF AN-1091 AN-1028. AN-1029. LGA voiding AN1091 international rectifier application note AN-1091 AN-1028 AN-1029 AN10912 vias

    LGA voiding

    Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
    Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print


    Original     		PDF LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325

    IPC-7527

    Abstract: IPC-7525 koki solder paste IPC7527
    Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527

    IPC-7527

    Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
    Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT

    LTM46XX

    Abstract: bga dye pry LTM4600 LGA voiding AN114 LGA rework LGA PACKAGE thermal resistance
    Text: Application Note 114 August 2007 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds


    Original     		PDF an114f AN114-8 LTM46XX bga dye pry LTM4600 LGA voiding AN114 LGA rework LGA PACKAGE thermal resistance

    TAIYO PSR 4000

    Abstract: TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600
    Text: Application Note 114 August 2007 Revised March 2009 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds


    Original     		PDF an114fa AN114-8 TAIYO PSR 4000 TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600

    LGA voiding

    Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux
    Text: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.


    Original     		PDF 101752C 01049A an100fc AN100-14 LGA voiding IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux

    LGA voiding

    Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D
    Text: Freescale Semiconductor Application Note Document Number: AN2920 Rev. 2, 12/2008 Manufacturing with the Land Grid Array Package by Networking & Multimedia Group Freescale Semiconductor, Inc. Austin, TX Freescale has introduced the High Coefficient of Thermal


    Original     		PDF AN2920 LGA voiding NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D

    Untitled

    Abstract: No abstract text available
    Text: January 2011 ENW89810K5CF Bluetooth QD ID:B014433 End Product Listing FCC ID: T7VEBMU IC ID: 216QEBMU PAN1311-SPP In f i n e o n’s BlueMoonUniversal Platform Wireless Modules User’s Manual Hardware Description Revision 1.1 November 2011 ENW89811xxxF


    Original     		PDF ENW89810K5CF B014433 216QEBMU PAN1311-SPP ENW89811xxxF PAN1321-SPP D-21337

    PAN1322-SPP

    Abstract: No abstract text available
    Text: August 2013 ENW89841A3KF Bluetooth QD ID:B021246 End Product Listing FCC ID: T7VEBMU IC ID: 216QEBMU PAN1322-SPP Intel’s BlueMoonUniversal Platform Wireless Modules User’s Manual Hardware Description Revision 1.3 Edition 2013-08-14 Published by Panasonic Industrial Devices Europe GmbH


    Original     		PDF ENW89841A3KF B021246 216QEBMU PAN1322-SPP D-21337 PAN1322 PAN1322-SPP

    PBA31308

    Abstract: T8753 Infineon Specific HCI Commands bluetooth CVSD in matlab PBA31308/2 T8753-2 INFINEON trace code label PBA 31308 INFINEON LOT NUMBER code label e5 user manual
    Text: January 2009 PBA 31308/2 V1.01 B l u e M o o n TM U n i v e r s a l P l a t f o r m eUniStone eUniStone PBA 31308/2 , Version 1.01 Preliminary User’s Manual Hardware Description Revision 1.0 Wireless Solutions PBA31308/2 User's Manual Hardware Description downloaded by Annakarin Ericson (Infineon Technologies Sweden) at 22 Jan 2009 11:02


    Original     		PDF PBA31308/2 PBA31308 T8753 Infineon Specific HCI Commands bluetooth CVSD in matlab T8753-2 INFINEON trace code label PBA 31308 INFINEON LOT NUMBER code label e5 user manual

    PAN1321-SPP

    Abstract: Pan1321 PAN1311 ENW89811K4CF T8753-2 B014433 t8753 marking code maxim label PLL Synthesizer Modules, panasonic Infineon Specific HCI Commands bluetooth
    Text: January 2011 ENW89811K4CF Bluetooth QD ID:B014433 End Product Listing FCC ID: T7VEBMU IC ID: 216QEBMU PAN1321-SPP In f i n e o n’s BlueMoonUniversal Platform Wireless Modules User’s Manual Hardware Description Revision 3.1 Edition 2011-01-18 Published by


    Original     		PDF ENW89811K4CF B014433 216QEBMU PAN1321-SPP D-21337 PAN1321-SPP PAN1311; PAN1311 Pan1321 ENW89811K4CF T8753-2 B014433 t8753 marking code maxim label PLL Synthesizer Modules, panasonic Infineon Specific HCI Commands bluetooth

    LGA voiding

    Abstract: CCGA APD-SCC-201 IBM ccga 67F4333 ceramic rework 810E N100 cte table flip chip substrate cte table epoxy
    Text: CLASP CERAMIC COLUMN GRID ARRAY TECHNOLOGY FOR FLIP CHIP CARRIERS S. Ray, M. Interrante, L. Achard * , M. Cole, I. DeSousa(*), L. Jimarez, G. Martin, and C. Reynolds, IBM Microelectronics Division Hopewell Jct., NY (*) IBM Canada, Bromont, QUE Biography Sudipta Ray is a Senior Engineer in Interconnections


    Original     		PDF 67F4333, F52977, APD-SCC-201 LGA voiding CCGA IBM ccga 67F4333 ceramic rework 810E N100 cte table flip chip substrate cte table epoxy

    W3008

    Abstract: SMBJ5.0 kicad
    Text: LBM313 Datasheet Version 0.20 March 27, 2014 1 Introduction The LightBlueM Module is a full-featured Bluetooth 4.0 module with built in 8-bit SoC. It is based on Texas Instruments’ CC2540 system on chip. The LBM313 features a very small footprint size and is optimized for implementation in very


    Original     		PDF LBM313 CC2540 CC2540. lbm313 W3008 SMBJ5.0 kicad

    PCB design

    Abstract: thermal pcb guidelines SMT reflow profile LGA voiding
    Text: APPLICATION NOTE PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages REVISION HISTORY Revision Level Date Description A August 2001 Initial Release B January 17, 2002 Revise: Sections 2.1, 2.2, 2.3, 3.1, 3.2, 3.3, 3.5, 4.0, 4.1, 4.2, 4.4, 5.0, 5.1,


    Original     		PDF 101752G PCB design thermal pcb guidelines SMT reflow profile LGA voiding

    SMT reflow profile

    Abstract: PCB design pcb design of a radio PCB-Design guideline for mobile phone LGA voiding pcb warpage in ipc standard
    Text: APPLICATION NOTE PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages REVISION HISTORY Revision Level Date Description A August 2001 Initial Release B January 17, 2002 Revise: Sections 2.1, 2.2, 2.3, 3.1, 3.2, 3.3, 3.5, 4.0, 4.1, 4.2, 4.4, 5.0, 5.1,


    Original     		PDF 101752I SMT reflow profile PCB design pcb design of a radio PCB-Design guideline for mobile phone LGA voiding pcb warpage in ipc standard

    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


    Original     		PDF

    Solder Paste, Indium 5.8

    Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
    Text: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land


    Original     		PDF AN10343 Solder Paste, Indium 5.8 SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U

    CU-106A

    Abstract: 0.4mm pitch BGA IPC-6012A beagleboard 0.4mm pitch BGA routing IPC-6012 IPC-D-317 NAND FLASH LGA reflow profile CU-106A shelf life CBB Capacitor Selection Guide
    Text: Application Report SPRAAV1B – May 2009 PCB Design Guidelines for 0.4mm Package-On-Package PoP Packages, Part I Keith Gutierrez and Gerald Coley . ABSTRACT


    Original     		PDF

    zl70101 design

    Abstract: ZL70102
    Text: Datasheet, Revision 4 ZL70120 MICS-Band RF Base Station Module BSM Features Description 1 • Complete MICS-Band RF Telemetry Radio Solution • Generic RF Base Station Module Designed to Interact with Implantable Medical Devices Based on the ZL70102 and


    Original     		PDF ZL70120 ZL70102 ZL70101 ZL70120-DS/139283-4/02 zl70101 design

    TTL 7400

    Abstract: transistor SI 6822 application notes signetics 74LS00 gate fairchild dtl pj 939 diode 7410 IC pj 939 lv bq 8050 ac servo controller schematic
    Text: FAIRCHILD FAST' Applications Handbook A S chlum berger C om pany 1987 Fairchild Semiconductor Corporation, Digital Unit 333 Western Avenue, South Portland, Maine 04106 207/775-8700 TWX 710-221-1980 FAST Fairchild Advanced Schottky TTL is a registered trademark of


    OCR Scan     		PDF