LFBGA64
Abstract: sot744
Text: PDF: 2001 Dec 12 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm D SOT744-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E
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LFBGA64:
OT744-1
LFBGA64
sot744
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LFBGA64
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm D SOT534-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B y y1 C ∅w M b e v M A H e G F E e1 D C
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LFBGA64:
OT534-1
LFBGA64
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LFBGA64
Abstract: No abstract text available
Text: PDF: 2003 Feb 05 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm D SOT534-1 A B ball A1 index area A A2 E A1 detail X C e1 ∅v M C A B b 1/2 e y1 C y ∅w M C e H e G F
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LFBGA64:
OT534-1
LFBGA64
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LFBGA64
Abstract: sot686
Text: PDF: 2002 Mar 11 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 6 x 6 x 1.05 mm D SOT686-1 A B ball A1 index area A A2 E A1 detail X e1 C e 1/2 e y y1 C ∅v M C A B b ∅w M C K J e H
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LFBGA64:
OT686-1
LFBGA64
sot686
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sot534
Abstract: No abstract text available
Text: PDF: 1999 Jun 07 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm SOT534-1 D ball A1 index area A2 A E A1 detail X A ∅w M b y v A ZD e ZE H G F e E D C B A 1 2 3 4 5 6
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LFBGA64:
OT534-1
sot534
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm D SOT744-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11
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LFBGA64:
OT744-1
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 6 x 6 x 1.05 mm D SOT686-1 A B ball A1 index area A A2 E A1 detail X e1 C e 1/2 e y y1 C ∅v M C A B b ∅w M C K J e H G F e2 E D 1/2 e C B A ball A1 index area
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LFBGA64:
OT686-1
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Untitled
Abstract: No abstract text available
Text: JEITA Package Code P-LFBGA64-7x7-0.80 RENESAS Code PLBG0064GA-A w S B D Previous Code 64FHE w S A MASS[Typ.] 0.1g A b A1 S AB ZD e A e H G F B E E D C A ZE y S B 1 x4 v 2 3 4 5 6 7 8 Index mark Laser mark S Index mark Reference Symbol D E v w A A1 e b x
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P-LFBGA64-7x7-0
PLBG0064GA-A
64FHE
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circuit of smart hearing aid
Abstract: ir photodiode amplifier rs232 RCore DSP Architecture highpass rf filter WOLA reference wola 0X4010
Text: BELASIGNA 250 High-Performance Programmable Audio Processing System Introduction BELASIGNA 250 is a complete programmable audio processing system, designed specifically for ultra−low−power embedded and portable digital audio systems. This high−performance chip builds on
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16-bit
B250/D
circuit of smart hearing aid
ir photodiode amplifier rs232
RCore DSP Architecture
highpass rf filter
WOLA reference
wola
0X4010
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ST70150
Abstract: LBGA288 LFBGA64 ST70136 TQFP64 T1.413 ADSL WT-062
Text: prom2 9-09-2002 12:40 Pagina 1 PROMETHEUS ADSL Residential Gateway Complete reference design bridges from ADSL to residential LANs ST70150 l Support digital signal processing equipments for one ADSL CPE channel ITU-R l Compliant with ITU 992.1 (ADSL full rate) annex A (ADSL
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ST70150
LBGA288
ST70136
FLPROME/0602
ST70150
LBGA288
LFBGA64
ST70136
TQFP64
T1.413 ADSL
WT-062
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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W29GL256P
Abstract: W29GL256
Text: W29GL256P 256M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE W29GL256P Table of Contents 1 2 3 4 5 6 7 GENERAL DESCRIPTION . 1 FEATURES . 1
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W29GL256P
256M-BIT
W29GL256P
W29GL256
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Untitled
Abstract: No abstract text available
Text: Ordering number : ENA1539A LC70310KBG CMOS LSI Noise Canseller IC http://onsemi.com Overview The LC70310KBG is a noise-cancellation IC that uses an original digital signal processor DSP designed for audio applications as the core and integrates the serial PCM interface and host CPU interface on a single chip. In addition,
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ENA1539A
LC70310KBG
LC70310KBG
A1539-48/48
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xr20m1172il32-f
Abstract: HVQFN32 Sc2698 SC16C654BIBM,128 SCC2681AC1A44 SC16C752B SCC2691AC1A28 SC28L198
Text: High-speed UARTs and Bridge ICs Advanced serial-interface solutions NXP UART applications Fastest baud rate: 20 Mbps SC16C85xS } General Interface U ART controller is part of the serial data communication of a system. A UART is used to convert parallel data to serial data, and from serial
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SC16C85xS
WLAN/802
SC28L202
xr20m1172il32-f
HVQFN32
Sc2698
SC16C654BIBM,128
SCC2681AC1A44
SC16C752B
SCC2691AC1A28
SC28L198
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64-pin BGA thermal resistance
Abstract: arm Str711f TQFP144 TQFP64 ISO7816-3 LFBGA144 LFBGA64 STR710F AN1781 diode p115
Text: STR71xF ARM7TDMI 16/32-BIT MCU WITH FLASH, USB, CAN 5 TIMERS, ADC, 10 COMMUNICATIONS INTERFACES PRELIMINARY DATA • ■ ■ ■ ■ Memories – Up to 256+16 Kbytes Flash memory 100,000 cycles endurance, 20 yrs retention – Up to 64 Kbytes RAM – External Memory Interface (EMI) for up to 4
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STR71xF
16/32-BIT
64-pin BGA thermal resistance
arm Str711f
TQFP144
TQFP64
ISO7816-3
LFBGA144
LFBGA64
STR710F
AN1781
diode p115
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dla001
Abstract: STA013B FC12 B2H18
Text: STA013 STA013B STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequencies syntax extension,
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STA013
STA013B
STA013T
dla001
FC12
B2H18
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V18 marking
Abstract: 106 16K 736 STR710 0x64FF
Text: STR71xF ARM7TDMI 32-bit MCU with Flash, USB, CAN 5 timers, ADC, 10 communications interfaces • Core – ARM7TDMI 32-bit RISC CPU – 59 MIPS @ 66 MHz from SRAM – 45 MIPS @ 50 MHz from Flash ■ Memories – Up to 256Kbytes Flash program memory 10 kcycles endurance, 20 yrs retention @
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STR71xF
32-bit
256Kbytes
V18 marking
106 16K 736
STR710
0x64FF
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W29GL064C
Abstract: No abstract text available
Text: W29GL064C 64M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE Publication Release Date: October 18, 2011 Preliminary - Revision E BLANK W29GL064C Table of Contents 1 2 3 4 5 6 7 GENERAL DESCRIPTION . 1
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W29GL064C
64M-BIT
W29GL064C
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LFBGA64
Abstract: STA015 STA015B STA015T TQFP44
Text: STA015 STA015B STA015T MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY • SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: – All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio TQFP44 SO28 – All features specified for Layer III in ISO/IEC
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STA015
STA015B
STA015T
TQFP44
LFBGA64
STA015
STA015T
TQFP44
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dla001
Abstract: LFBGA64 STA015 STA015B STA015T TQFP44 STA013 AN-1250 D98AU904
Text: STA015 STA015B STA015T MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY PRODUCT PREVIEW SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC
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STA015
STA015B
STA015T
dla001
LFBGA64
STA015T
TQFP44
STA013
AN-1250
D98AU904
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TSB41AB2E
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS PDI1394P23 2-port/1-port 400 Mbps physical layer interface Preliminary data Philips Semiconductors 2001 Jul 18 Philips Semiconductors Preliminary data 2-port/1-port 400 Mbps physical layer interface 1.0 FEATURES • Fully supports provisions of IEEE 1394–1995 Standard for high
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PDI1394P23
P1394a
TSB41AB2E
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W25R128FV
Abstract: W25Q128JV W25R128F W25Q128FV W25Q128F USON-8 W25Q80DL W978H6KB W25Q80BVSSIG
Text: 2014 PRODUCT SELECTION GUIDE Mobile DRAM Specialty DRAM Code Storage Flash Memory Winbond Electronics Corporation is a worldwide leading supplier of specialty memory IC’s. The company provides memory solution backed by the expert capabilities of design, manufacturing
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mlt 22
Abstract: star delta starter single line drawing LQFP144 "7 segment display" 3102 STR712FR2H6 ISO7816-3 LFBGA144 LFBGA64 LQFP64 STR710
Text: STR71xF ARM7TDMI 32-bit MCU with Flash, USB, CAN 5 timers, ADC, 10 communications interfaces Features • ■ ■ ■ Core – ARM7TDMI 32-bit RISC CPU – 59 MIPS @ 66 MHz from SRAM – 45 MIPS @ 50 MHz from Flash LQFP64 10 x 10 Memories – Up to 256 Kbytes Flash program memory
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STR71xF
32-bit
LQFP64
LFBGA64
LQFP144
LFBGA144
mlt 22
star delta starter single line drawing
LQFP144
"7 segment display" 3102
STR712FR2H6
ISO7816-3
LQFP64
STR710
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simple srs wow schematic
Abstract: schematic diagram DVI to rca DB25 LPT dvi dual link schematic AN1250 G723 LFBGA64 STA015 TQFP44 STA013
Text: AN1250 APPLICATION NOTE STA014/STA015 MPEG LAYER III DECODER AND ADPCM CODEC by Marco Veneri 1. INTRODUCTION The STA015 device is an MPEG Layer III audio decoder with ADPCM compression / decompression capabilities and BYPASS mode for auxiliary audio sources post-processing
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AN1250
STA014/STA015
STA015
STA015
D00AU1190
simple srs wow schematic
schematic diagram DVI to rca
DB25 LPT
dvi dual link schematic
AN1250
G723
LFBGA64
TQFP44
STA013
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