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    LFBGA Search Results

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    HPA00032DGKER Texas Instruments 25-Bit Configurable Registered Buffer With SSTL_18 Inputs and Outputs 96-LFBGA 0 to 70 Visit Texas Instruments
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    LFBGA Price and Stock

    NXP Semiconductors

    NXP Semiconductors LFBGADAQA

    DEVELOPMENT 1.0MM SKT 208-BGA
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    DigiKey LFBGADAQA Box 1
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    NXP Semiconductors LFBGAMH1A

    100 PIN 1.0MM PGA SOCKET SPACER
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    NXP Semiconductors LFBGAMS1A

    256 PIN 1.0MM PGA SOCKET SPACER
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    • 1 $180
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    NXP Semiconductors LFBGADAU1A

    DEVELOPMENT 1.0MM SKT 324-BGA
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    NXP Semiconductors LFBGADAU1A
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    NXP Semiconductors LFBGARBZAO

    SOCKET MINI GRID 516-BGA
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    DigiKey LFBGARBZAO Box 1
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    LFBGA Datasheets (9)

    Part
    ECAD Model
    Manufacturer
    Description
    Curated
    Datasheet Type
    PDF
    LFBGA114 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA144 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA40 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA48 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA56 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA64 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA84 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA96 NXP Semiconductors Footprint for reflow soldering Original PDF
    LFBGA-H STATS ChipPAC Fine Pitch Ball Grid Array Original PDF

    LFBGA Datasheets Context Search

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    PDF

    Untitled

    Abstract: No abstract text available
    Text: 3.3V CMOS 32-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS AND BUS-HOLD FE A T U R E S : - 0.5 MICRON CMOS Technology Typical tSK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.8mm pitch LFBGA package, 96 balls


    OCR Scan     		32-BIT 250ps MIL-STD-883, 200pF, ALVCH32374: IDT74ALVCH32374 32-bit F96-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: 3.3V CMOS 36-BIT UNIVERSAL BUS TRANS­ CEIVER WITH 3-STATE OUTPUTS AND BUS-HOLD FEATURES: - 0.5 MICRON CMOS Technology Typical tSK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.8mm pitch LFBGA package, 114 balls


    OCR Scan     		36-BIT 250ps MIL-STD-883, 200pF, ALVCH32501: IDT74ALVCH32501 PDF

    STA2500D

    Abstract: 3DH-5 sta2500 bluetooth test mode sta2500d bt Coexistence wire STLC2500D uart 16750 baud rate 2500D7 bluetooth transmitter receiver parallel chip E1500
    Text: STA2500D Bluetooth V2.1 + EDR "Lisbon" for automotive applications Features • Based on Ericsson technology licensing baseband core (EBC) LFBGA48 (6x6x1.4mm; 0.8mm Pitch) ■ Bluetooth™ specification compliance: V2.1 + EDR (“Lisbon”) – Point-to-point, point-to-multipoint (up to 7


    Original     		STA2500D LFBGA48 STA2500D 3DH-5 sta2500 bluetooth test mode sta2500d bt Coexistence wire STLC2500D uart 16750 baud rate 2500D7 bluetooth transmitter receiver parallel chip E1500 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		LFBGA208 OT631-2 OT631-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm B D SOT966-1 A ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A ball A1 index area


    Original     		LFBGA208: OT966-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA169 package SOT1024-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		LFBGA169 OT1024-2 OT1024-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10


    Original     		MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316 PDF

    AD5532-2

    Abstract: AD5532 AD5532-1 AD5532-3 AD5532-5 AD5532ABC-1 AD5532ABC-2 AD780 diagram of dac interfacing with 8051 SSPcon
    Text: a 32-Channel, 14-Bit Voltage-Output DAC AD5532* GENERAL DESCRIPTION FEATURES High Integration: 32-Channel DAC in 12 mm ؋ 12 mm LFBGA Adjustable Voltage Output Range Guaranteed Monotonic Read-Back Capability DSP/Microcontroller Compatible Serial Interface


    Original     		32-Channel, 14-Bit AD5532* 32-Channel AD5532-1, AD5532-2) AD5532-3) AD5532-5) AD5532-3, AD5532-2 AD5532 AD5532-1 AD5532-3 AD5532-5 AD5532ABC-1 AD5532ABC-2 AD780 diagram of dac interfacing with 8051 SSPcon PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA141: plastic low profile fine-pitch ball grid array package; 141 balls A B D SOT1079-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b M M C C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11


    Original     		LFBGA141: OT1079-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA169: plastic low profile fine-pitch ball grid array package; 169 balls B D SOT1024-1 A ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13


    Original     		LFBGA169: OT1024-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 1.05 mm D B SOT856-1 A ball A1 index area E A2 A A1 C e1 e ∅v ∅w b L K J H G F E D C B A M M y y1 C C A B C e e2 ball A1 index area 1 2 3 4 5 6 7 8 9 10 11


    Original     		LFBGA72: OT856-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA487: plastic low profile fine-pitch ball grid array package; 487 balls A B D SOT1077-1 ball A1 index area E A A2 A1 detail X e1 e AG AD 1/2 e ∅v ∅w b M M C C A B C y y1 C AH AF AC AA V R M J Y U P L H F C E B AE AB e W T e2 N 1/2 e


    Original     		LFBGA487: OT1077-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA228: plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm D B SOT821-1 A ball A1 index area A E A2 A1 detail X C e1 e AB AA Y W V U T R P N M L K J H G F E D C B A ball A1 index area ∅v ∅w b 1/2 e


    Original     		LFBGA228: OT821-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA216: plastic low profile fine-pitch ball grid array package; 216 balls; body 16 x 16 x 1.05 mm SOT715-1 A B D ball A1 index area A A2 A1 E detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C V e U T R P N M L K e2 J H 1/2 e G F E D C


    Original     		LFBGA216: OT715-1 MO-205 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls B D SOT1019-1 A ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C T R P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 3


    Original     		LFBGA208: OT1019-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: 32-Channel 14-Bit DAC with High-Speed 3-Wire Serial Interface AD5532HS a FEATURES High Integration: 32-Channel DAC in 12 ؋ 12 mm2 LFBGA Guaranteed Monotonic DSP-/Microcontroller-Compatible Serial Interface Channel Update Rate 1.1 MHz Output Impedance 0.5 ⍀


    Original     		32-Channel 14-Bit AD5532HS AD5532HS 74-Ball BC-74) PDF

    C3744

    Abstract: No abstract text available
    Text: a 32-Channel, 14-Bit Voltage-Output DAC AD5532* GENERAL DESCRIPTION FEATURES High Integration: 32-Channel DAC in 12 ؋ 12 mm2 LFBGA Adjustable Voltage Output Range Guaranteed Monotonic Readback Capability DSP-/Microcontroller-Compatible Serial Interface Output Impedance


    Original     		32-Channel AD5532-1, AD5532-2) AD5532-3) AD5532-5) AD5532-3, 32-Channel, C3744 PDF

    sot751

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J


    Original     		LFBGA80: OT751-1 sot751 PDF

    Untitled

    Abstract: No abstract text available
    Text: MAS 3587F Short Information MAS 3587F MPEG 1/2 Layer 3 Encoder/Decoder PLQFP64 or LFBGA81 Package The MAS 3587F is a single-chip MPEG layer 3 audio encoder/decoder designed for use in portable memory-based recording/playback applications. The MAS 3587F contains the DSP engine with embedded


    Original     		3587F PLQFP64 LFBGA81 3587F encoder/de61-517-0 6251-542-1SI Oct/2000 PDF

    AD5517

    Abstract: AD5517-1 AD5517-2 AD5517-3
    Text: PRELIMINARY TECHNICAL DATA a 16-Channel 14-Bit Voltage-Output DAC AD5517-1/AD5517-2/AD5517-3* Preliminary Technical Data FEATURES High Integration: 16-channel DAC in 12x12 mm 2 LFBGA Guaranteed Monotonic Low Power, SPI TM, MICROWIRETM and DSP-Compatible 3-Wire Serial Interface


    Original     		16-Channel 14-Bit AD5517-1/AD5517-2/AD5517-3* 12x12 AD5517-1) AD5517-2) AD5517-3) -40oC AD5517 AD5517-1 AD5517-2 AD5517-3 PDF

    sot894

    Abstract: No abstract text available
    Text: Package outline Philips Semiconductors LFBGA280: plastic low profile fine-pitch ball grid array package; 280 balls; body 11 x 11 x 1 mm B D SOT894-1 A ball A1 index area A E A2 A1 detail X e1 e C 1/2 e ∅v ∅w b M M y1 C C A B C y Y W V e U T R P N M L e2


    Original     		LFBGA280: OT894-1 sot894 PDF

    sot862

    Abstract: No abstract text available
    Text: Package outline Philips Semiconductors LFBGA336: plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm D SOT862-1 B A ball A1 index area A E A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D


    Original     		LFBGA336: OT862-1 sot862 PDF

    LFBGA324

    Abstract: MO-205
    Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls; body 16 x 16 x 1.2 mm A B D SOT571-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y1 C y ∅w M C V U


    Original     		LFBGA324: OT571-1 MO-205 LFBGA324 MO-205 PDF

    MO-205

    Abstract: LFBGA180
    Text: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C V U


    Original     		LFBGA180: OT697-1 MO-205 MO-205 LFBGA180 PDF