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    LEADLESS PACKAGE Search Results

    LEADLESS PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TLC32044MFK/B Rochester Electronics LLC Rochester Manufactured TLC32044, VB Interface, 28 LCC Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    26LS32/B2A Rochester Electronics LLC Rochester Manufactured 26LS32, Line Driver, 20 LCC Package, SMD spec. Visit Rochester Electronics LLC Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    LEADLESS PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


    Original     		PDF IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: MIL-STD-1835 leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79
    Text: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13 3 Package Diagram


    Original     		PDF 32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A CERAMIC LEADLESS CHIP CARRIER leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79

    ntlms4504n

    Abstract: No abstract text available
    Text: NTLMS4504N Advance Information Power MOSFET 28 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic


    Original     		PDF NTLMS4504N r14525 NTLMS4504N/D ntlms4504n

    NTLMS4403N

    Abstract: MOSfet 4392
    Text: NTLMS4403N Advance Information Power MOSFET 22 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic


    Original     		PDF NTLMS4403N r14525 NTLMS4403N/D NTLMS4403N MOSfet 4392

    NTLMS4505N

    Abstract: 4392 MOSFET
    Text: NTLMS4505N Advance Information Power MOSFET 31 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic


    Original     		PDF NTLMS4505N r14525 NTLMS4505N/D NTLMS4505N 4392 MOSFET

    LFB01

    Abstract: LFB01L
    Text: Ordering number:EN1885C LFB01, 01L Silicon Planar Leadless Type Ultrahigh-Speed Switching Diode Features Package Dimensions • Highly reliable leadless glass sleeve structure. · Very small size. · Capable of being suface-mounted. · Forward voltage : VF max=1.2V.


    Original     		PDF EN1885C LFB01, LFB01L LFB01 LFB01 LFB01L

    SOD-323 land pattern

    Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
    Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782

    sharp side emit LED

    Abstract: ultrasonic movement sensor GM4EG80200A
    Text: Leadless Chip LED GM4EG80200A 2713 Size, 0.8mm Thickness, Side Emitting Leadless Chip LED GM4EG80200A Under development • Outline Dimensions (Unit : mm) , , 1.3 1 2 , , , (0.675) LED Lamp 0.8 2.7 , , , (0.675) ,


    Original     		PDF GM4EG80200A sharp side emit LED ultrasonic movement sensor GM4EG80200A

    LCC1

    Abstract: vco PART NO
    Text: Leadless VCO Package MAVCML Series V 1.00 Features n n n n n n n Extremely Linear Tuning High Tuning Speed Low Phase Noise Leadless Package Hermetically Sealed Suitable for High Reliability Applications Custom Designs Available Primary Applications n n n n


    Original     		PDF MAVCML0043 MAVCML0044 110mA 125mA LCC1 vco PART NO

    846C

    Abstract: NTLTS3107P NTLTS3107PR2G
    Text: NTLTS3107P Power MOSFET −20 V, −8.3 A, Single P−Channel, Micro8 Leadless Package Features • • • • • Low RDS on for Extended Battery Life Surface Mount Micro8 Leadless for Improved Thermal Performance Low Profile (<1.0 mm) Optimal for Portable Designs


    Original     		PDF NTLTS3107P NTLTS3107P/D 846C NTLTS3107P NTLTS3107PR2G

    C144* transistor

    Abstract: C144 C144* datasheet Pcl 722 144PIN
    Text: PRINTED CIRCUITBOARD LEADLESS PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC To Top / Package Lineup / Package Index PCL-144P-M01 144-pin plastic PCLP Lead pitch 0.50 mm Lead shape Leadless type Sealing method Resin seal PCL-144P-M01 144-pin plastic PCLP


    Original     		PDF PCL-144P-M01 144-pin PCL-144P-M01) 144PIN C144001SC-2-2 C144* transistor C144 C144* datasheet Pcl 722 144PIN

    0118 transistor

    Abstract: No abstract text available
    Text: PRINTED CIRCUITBOARD LEADLESS PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index PCL-100P-M01 100-pin plastic PCLP Lead pitch 0.50 mm Lead shape Leadless type Sealing method Resin seal PCL-100P-M01 100-pin plastic PCLP


    Original     		PDF PCL-100P-M01 100-pin PCL-100P-M01) 100PIN C100001SC-2-2 0118 transistor

    0118 transistor

    Abstract: No abstract text available
    Text: PRINTED CIRCUITBOARD LEADLESS PACKAGE 100 PIN PLASTIC PCL-100P-M01 100-pin plastic PCLP Lead pitch 0.50mm Lead shape Leadless type Sealing method Resin seal PCL-100P-M01 100-pin plastic PCLP (PCL-100P-M01) 16.00±0.20SQ (.630±.008) PRELIMINARY 1.50(.059)MAX


    Original     		PDF PCL-100P-M01 100-pin PCL-100P-M01) 100PIN C100001SC-2-2 0118 transistor

    Untitled

    Abstract: No abstract text available
    Text: ATF-551M4 Low Noise Enhancement Mode ­Pseudomorphic HEMT in a ­Miniature Leadless Package Data Sheet Description Features Avago Technologies’ ATF-551M4 is a high dynamic range, super low noise, single supply E‑pHEMT GaAs FET housed in a thin miniature leadless package.


    Original     		PDF ATF-551M4 ATF-551M4 5989-4217EN AV02-0924EN

    cds 7163

    Abstract: marking 683 choke ATF-331M4 ATF-331M4-BLK ATF-331M4-TR1 ATF-331M4-TR2 ATF-34143 diplexer 0.5-2 GHz l0147 Alpha 1000 GaAsFET
    Text: Agilent ATF-331M4 Low Noise Pseudomorphic HEMT in a Miniature Leadless Package Data Sheet Features • Low noise figure • Excellent uniformity in product specifications • 1600 micron gate width • Miniature leadless package 1.4 mm x 1.2 mm x 0.7 mm Description


    Original     		PDF ATF-331M4 5988-4993EN cds 7163 marking 683 choke ATF-331M4-BLK ATF-331M4-TR1 ATF-331M4-TR2 ATF-34143 diplexer 0.5-2 GHz l0147 Alpha 1000 GaAsFET

    BCN31

    Abstract: No abstract text available
    Text: MODEL BCN31 BCN31 Series • R/2R Ladder Network · 8 Bit, 2512 Size · Thick Film · Leadless Chip Packages Features 8 bit ladder network in a 10 terminal leadless chip package Convex termination with square edges and corners Topside marking for easy identification


    Original     		PDF BCN31 BCN31 10K/20K 25K/50K 50K/100K 100K/200K 16K/Reel

    48-PIN

    Abstract: PCL 27 48 pin 48PIN
    Text: PRINTED CIRCUITBOARD LEADLESS PACKAGE 48 PIN PLASTIC PCL-48P-M01 48-pin plastic PCLP Lead pitch 0.65mm Lead shape Leadless type Sealing method Resin seal PCL-48P-M01 48-pin plastic PCLP (PCL-48P-M01) 11.00±0.20 SQ (.433±.008) PRELIMINARY 1.40(.055)MAX.


    Original     		PDF PCL-48P-M01 48-pin PCL-48P-M01) 48PIN C48002SC-1-2 PCL 27 48 pin 48PIN

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: leadless chip carrier 28-pin 20 PIN LEADLESS CHIP CARRIER MIL-STD-1835 Q1 Package SFE10.7MS2G-A
    Text: Package Diagram Quarter Size Outline Packages 16-Lead Quarter Size Outline Q1 20-Lead Quarter Size Outline Q5 1 Package Diagram 24-Lead Quarter Size Outline Q13 Ceramic Windowed Leadless Chip Carriers 32-Pin Windowed Rectangular Leadless Chip Carrier Q55 MIL–STD–1835 C–12


    Original     		PDF 16-Lead 20-Lead 24-Lead 32-Pin 20-Pin 28-Pin 44-Pin CERAMIC LEADLESS CHIP CARRIER leadless chip carrier 20 PIN LEADLESS CHIP CARRIER MIL-STD-1835 Q1 Package SFE10.7MS2G-A

    SOT115

    Abstract: BGS67A rogers 4003 SOT56 sot-115
    Text: H Leadless Reverse Amplifier BGS67A 1 H Introduction Philips Semiconductors introduced its first leadless CATV reverse amplifier in 1999. The product, BGY66BL, was intended as a demonstrator for package outline and product performance. However, because of dissipation issue (product dissipates 3W) and some necessary changes to improve


    Original     		PDF BGS67A) BGY66BL, BGS67A, OT567A, SOT115 BGS67A rogers 4003 SOT56 sot-115

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY M IC R O N I 4 MEG X SfcMCONOUCTORMC MT12D436 36, 8 MEG x 18 DRAM MODULE 4 MEG X 36, 8 MEG x 18 DRAM MODULE FAST PAGE MODE FEATURES OPTIONS MARKING • Tim ing 60ns access 70ns access • Packages Leadless 7 2 -pin Leadless 7 2 -pin Leadless 7 2 -pin


    OCR Scan     		PDF MT12D436 T12D436 bill54 A0-A10 MT120436 C1994,

    MLL34

    Abstract: MLL5243B mll5232bt1 1N5221 MLL41 MLL5221B MLL5222B MLL5223B MLL5224B MLL-34
    Text: Leadless Zener Diodes Leadless Diodes — MLL34 8mm tape and MLL41 (12mm tape) • S m all, convenient leadless package. A full range of i watt and 1 w att z e n e r diodes a re av ailab le using the sam e die as products presently offered in DO-35 (1N5221 S eries) and DO-41 (N4728 S eries) zeners.


    OCR Scan     		PDF MLL34 MLL41 DO-35 1N5221 DO-41 N4728 DO-35 DO-41 MLL5268B, MLL34 MLL5243B mll5232bt1 MLL41 MLL5221B MLL5222B MLL5223B MLL5224B MLL-34

    block diagram of 74LS138 3 to 8 decoder

    Abstract: 1k ohm micro potentiometer 74LS138 3 to 8 decoder notes 74LS138 decoder fsr temperature MN3660 MN3660E MN3660H MICRO NETWORKS CO 8 bit
    Text: MN3660 LEADLESS PACKAGE 12-BIT LATCHED D/A CONVERTER • 24 Pin Hermetically Sealed Leadless Package • High Speed Input Register {40nsec Setup • ± Vz LSB Linearity and Monotonicity Guaranteed Over Temperature • ±0.1% FS R Unadjusted Accuracy • 10/*sec Maximum


    OCR Scan     		PDF MN3660 12-BIT 40nsec 10/tsec MIL-STD-883 CX090 MN3660 12-bit, 10/xsec AN203 block diagram of 74LS138 3 to 8 decoder 1k ohm micro potentiometer 74LS138 3 to 8 decoder notes 74LS138 decoder fsr temperature MN3660E MN3660H MICRO NETWORKS CO 8 bit

    Untitled

    Abstract: No abstract text available
    Text: MN3660 LEADLESS PACKAGE 12-BIT LATCHED D/A CONVERTER • 24 Pin Hermetically Sealed Leadless Package • High Speed Input Register 40nsec Setup • ± Vz LSB Linearity and Monotonicity Guaranteed Over Temperature • ± 0.1 %FSR Unadjusted Accuracy • 10/tsec Maximum


    OCR Scan     		PDF MN3660 12-BIT 40nsec 10/tsec MIL-STD-883 N3660 12-bit, 10/xsec AN203