mutoh ip-220
Abstract: No abstract text available
Text: Database for Properties of Lead-Free Solder Alloys DATABASE FOR PROPERTIES OF LEAD-FREE SOLDER ALLOYS Version 1.0 This database is a joint project of ELFNET and COST 531 Action. COST 531 ACTION ON LEAD-FREE SOLDER ALLOYS EURPEAN LEAD-FREE SOLDERING NETWORK
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kskimm12
RC22717
W0302-019)
mutoh ip-220
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CU-106A
Abstract: entek plus cu 106a anova general cross references TI Cross Reference Search HC373 Au Sn eutectic gold embrittlement
Text: Pb-Free Solder Joint Evaluation Contact Us Buy About TI TI Worldwide my.TI Advanced Search Keyword Part Number >> Semiconductor Home > Products > Digital Logic > Digital Logic Overview > Texas Instruments Palladium Lead Finish Pb-Free Solder Joint Evaluation
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28September
CU-106A
entek plus cu 106a
anova
general cross references
TI Cross Reference Search
HC373
Au Sn eutectic
gold embrittlement
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Solderability Tests
Abstract: AN2036 AN-2036 an2036 st joint interfacial JESD22-B102 J-STD-002
Text: AN2036 APPLICATION NOTE Solderability Tests Lead-free devices, from STMicroelectronics, are warranted to pass the solderability tests, and to form a reliable solder joint with the base material of the circuit board, using Leaded Sn-Pb solder or Lead-free
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AN2036
2002/95/EU,
Solderability Tests
AN2036
AN-2036
an2036 st
joint interfacial
JESD22-B102
J-STD-002
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solder joint
Abstract: joint TA65
Text: LEAD FREE SOLDER JOINT RELIABILITY QUALITY ENG : REPORT DATE: Herb Grimm 3/4/2004 PACKAGE TYPE: TEST DESCRIPTION: SOLDER PASTE SAMPLE SIZE: RESULT: INSPECTION METHOD: 20L TSSOP Temperature Cycle Sn,Ag.Cu 5 samples board mounted using +260C peak reflow PASS
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Lead Free reflow soldering profile BGA
Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
Text: Freescale Semiconductor Engineering Bulletin EB635 Rev. 2, 4/2005 Lead-Free BGA Solder Joint Assembly Evaluation To support a cleaner environment, meet market demands, and comply with international commercial standards and requirements, many integrated circuit devices are migrating to ball-grid array
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EB635
Lead Free reflow soldering profile BGA
Solder Paste, Indium, Type 3
reflow soldering profile BGA
"BGA Rework Practices",
5SN3
BGA PROFILING
EB635
Soldering guidelines
Indalloy 181
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Untitled
Abstract: No abstract text available
Text: 3mm Infrared LED,T-1 HIR204C/H0 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=850nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode HIR204C/H0 is a
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HIR204C/H0
850nm
HIR204C/H0)
DIR-0000714
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Untitled
Abstract: No abstract text available
Text: 3mm Infrared LED,T-1 HIR234C Features ․High reliability ․High radiant intensity ․Peak wavelength λp=850nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode HIR234C is a
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HIR234C
850nm
HIR234C)
DIR-0000892
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Untitled
Abstract: No abstract text available
Text: 3mm Infrared LED,T-1 IR204C/H16/L10 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=940nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode IR204C/H16/L10 is a
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IR204C/H16/L10
940nm
IR204C/H16/L10)
20duct,
DIR-0000231
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3MM LED
Abstract: No abstract text available
Text: 3mm Infrared LED,T-1 HIR204C Features ․High reliability ․High radiant intensity ․Peak wavelength λp=850nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode HIR204C is a
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HIR204C
850nm
HIR204C)
DIR-0000512
3MM LED
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Untitled
Abstract: No abstract text available
Text: 3mm Infrared LED,T-1 HIR204 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=850nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode HIR204 is a
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HIR204
850nm
HIR204)
DIR-0000939
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Untitled
Abstract: No abstract text available
Text: 3mm Infrared LED,T-1 IR204/H60 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=940nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode IR204/H60 is a
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IR204/H60
940nm
IR204/H60)
DIR-0000090
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Untitled
Abstract: No abstract text available
Text: 5mm Infrared LED,T-1 3/4 HIR333C/H0 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=850nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode HIR333C/H0 is a
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HIR333C/H0
850nm
HIR333C/H0)
DIR-0000944
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Untitled
Abstract: No abstract text available
Text: 3mm Infrared LED,T-1 IR204/H16/L10 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=940nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode IR204/H16/L10 is a
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IR204/H16/L10
940nm
IR204/H16/L10)
DIR-0000090
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SnPb36Ag2
Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100
Text: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation
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2002/95/E
SnPb36Ag2
Lead Free reflow soldering profile BGA
Infineon diffusion solder
semiconductors cross reference
philips pb-free products
FeNi42
BGA Ball Crack
VSO56
BGA and QFP Package freescale
HTQFP100
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Untitled
Abstract: No abstract text available
Text: 5mm Infrared LED ,T-1 SIR323-5 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=875nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free Description ․EVERLIGHT’s Infrared Emitting Diode SIR323-5 is a high intensity diode , molded in a blue transparent plastic package.
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SIR323-5
875nm
SIR323-5)
DIR-0000993
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Untitled
Abstract: No abstract text available
Text: 3mm Infrared LED ,T-1 SIR234 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=875nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free Description ․EVERLIGHT’s Infrared Emitting Diode SIR234 is a high intensity diode , molded in a blue transparent plastic package.
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SIR234
875nm
SIR234)
DIR-0000974
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Untitled
Abstract: No abstract text available
Text: 5mm Infrared LED,T-1 3/4 IR333C/H0/L10 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=940nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description
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IR333C/H0/L10
940nm
IR333C/H0/L10)
DIR-0000721
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hot air gun
Abstract: stencil tension LPCC stencil
Text: LPCC 3 x 3 Package Application Note 5073 Introduction The Avago Technologies LPCC 3 x 3 package platform has 16 I/O pins as shown in Figure 1. The LPCC 3 x 3 is lead free, halogen free and has a dimension of 3.0 mm L x 3.0 mm (W) x 0.90 mm (H). The following
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5989-1225EN
hot air gun
stencil tension
LPCC
stencil
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Untitled
Abstract: No abstract text available
Text: 5mm Infrared LED IR323 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=940nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode IR323 is a
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IR323
940nm
IR323)
DIR-0000934
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Untitled
Abstract: No abstract text available
Text: 5mm Infrared LED,T-1 3/4 IR333C/H2 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=940nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode IR333C/H2 is a
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940nm
IR333C/H2)
DIR-0000933
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sot89 stencil
Abstract: sot89 land pattern Loctite 218 RG200 substrate 5989-0810EN LOCTITE-96sc Getek LOCTITE 384 RG200 laser gun
Text: SOT89 Package Application Note 5051 Introduction PCB Land Pattern and Stencil Design Avago Technologies SOT89 is a 3 I/O pins Figure 1 package platform designed to offer excellent heat dissipation and wide RF frequency response. The SOT89 package itself is lead free with a dimension of 4.1 mm
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5989-0810EN
sot89 stencil
sot89 land pattern
Loctite 218
RG200 substrate
LOCTITE-96sc
Getek
LOCTITE 384
RG200
laser gun
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Untitled
Abstract: No abstract text available
Text: 5mm Infrared LED,T-1 3/4 IR383 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=940nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode IR383 is a
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IR383
940nm
IR383)
DIR-0000988
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Untitled
Abstract: No abstract text available
Text: 5mm Infrared LED,T-1 3/4 IR333/H0 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=940nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode IR333/H0 is a
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IR333/H0
940nm
IR333/H0)
DIR-0000122
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Untitled
Abstract: No abstract text available
Text: 3mm Infrared LED ,T-1 SIR204-A Features ․High reliability ․High radiant intensity ․Peak wavelength λp=875nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free Description ․EVERLIGHT’s Infrared Emitting Diode SIR204-A is a high intensity diode , molded in a blue transparent plastic package.
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875nm
SIR204-A)
DIR-0000987
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