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    Murata Manufacturing Co Ltd LDB212G4010C-001

    MULTI-LAY HYBRID BALUNS 0805
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    DigiKey LDB212G4010C-001 Reel 4,000
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    LDB212G4010C-001 Cut Tape 1
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    LDB212G4010C-001 Digi-Reel 1
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    Bristol Electronics LDB212G4010C-001 7,880
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    LDB212G4010C-001 1,810 12
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    Quest Components LDB212G4010C-001 5,100
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    LDB212G4010C-001 1,448
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    TTI LDB212G4010C-001 Reel 4,000
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    Chip 1 Exchange LDB212G4010C-001 3,490
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    Others LDB212G4010C-001

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    Chip 1 Exchange LDB212G4010C-001 3,490
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    Murata Manufacturing Co Ltd LDB212G4010C001

    Chip Multilayer Hybrid Baluns 6-Pin (Alt: LDB212G4010C001)
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    Avnet Abacus LDB212G4010C001 143 Weeks 4,000
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    LDB212G4010C001 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    LDB212G4010C-001 muRata Original PDF

    LDB212G4010C001 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Ceramic Capacitors 104

    Abstract: mev-50a DXW21BN7511S SAYFP1G95AA0B00 ck 66 ul94v-0 lcd SAYFP897MCA0B00 SAFEB1G57KE0F00 SAWEN1G84 murata enc-03r MA300D1-1
    Text: MURATA PRODUCTS 2009-2010 2009-2010 MURATA PRODUCTS !Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice.


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    K99E-27 Ceramic Capacitors 104 mev-50a DXW21BN7511S SAYFP1G95AA0B00 ck 66 ul94v-0 lcd SAYFP897MCA0B00 SAFEB1G57KE0F00 SAWEN1G84 murata enc-03r MA300D1-1 PDF

    LDB182G5010G-120

    Abstract: LDB181G8115G-120 LDB21869M10C-001 LDB185G3710G-120 LDB182G4510G-120 LDB182g5010 LDB182G5005G-120 LDB21869M LDB181G9505C-110 LDB182G4510C-110
    Text: Microwave Components/Modules Chip Multilayer Hybrid Baluns 4 (5) (6) Directional Input Mark 0.2±0.1 +0.10 0.20 -0.15 LDB18 Series 0.3±0.1 0.50±0.05 (3) G Type (1) : Unbalance port (2)(5) : GND (3)(4) : Balance port (6) : NC 0.20±0.1 Microwave Components/Modules


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    LDB18 LDB21 LDB21942M20C-001 LDB182G5010G-120 LDB181G8115G-120 LDB21869M10C-001 LDB185G3710G-120 LDB182G4510G-120 LDB182g5010 LDB182G5005G-120 LDB21869M LDB181G9505C-110 LDB182G4510C-110 PDF

    CX3225SB40000H0WZK21

    Abstract: GRM1555C1H1R5C MAX2831 C45 round bar HP8648s GRM1555C1H330J GRM155R71H102K 2.4GHZ C51 C80 transmitter capacitor 33pF
    Text: 19-0816; Rev 0; 5/07 MAX2831 Evaluation Kit The MAX2831 evaluation kit EV kit simplifies testing of the MAX2831 receive and transmit performance in 802.11g/b applications operating in the 2.4GHz to 2.5GHz ISM band. The EV kit provides 50Ω SMA connectors for all RF and baseband inputs and outputs.


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    MAX2831 11g/b MAX2831EVKIT+ MAX2831 CX3225SB40000H0WZK21 GRM1555C1H1R5C C45 round bar HP8648s GRM1555C1H330J GRM155R71H102K 2.4GHZ C51 C80 transmitter capacitor 33pF PDF

    LDB182G4520C-110

    Abstract: ldb18 LDB211G9005C-001 LDB215G3710C-001 LDB181G8405C-110 LDB211G9020C-001 LDB212G4005C-001 LDB21924M05C-001 LDB181G8420C-110 LDB181G8820C-110
    Text: Microwave Components 05.11.18 Chip Multilayer Hybrid Baluns Chip Multilayer Hybrid Baluns 1.6±0.1 4 (5) (6) 0.20±0.1 0.2±0.1 +0.10 0.20 -0.15 (2) (1) 1.25±0.1 (1) (3) 0.8±0.1 (2) 0.15±0.10 (3) 0.95±0.1 2.00±0.1 0.6±0.1 Directional Input Mark 0.3±0.1


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    LDB18 LDB21 LDB184G5010C-110 LDB182G4520C-110 LDB211G9005C-001 LDB215G3710C-001 LDB181G8405C-110 LDB211G9020C-001 LDB212G4005C-001 LDB21924M05C-001 LDB181G8420C-110 LDB181G8820C-110 PDF

    LDB21869M10C-001

    Abstract: LDB21 LDB212G4010C001 LDB182G4510G LDB212G4010C-001 LDB21869M LDB182G4505C-110
    Text: Microwave Components/Modules Chip Multilayer Hybrid Baluns 4 (5) (6) Directional Input Mark 0.2±0.1 +0.10 0.20 -0.15 LDB18 Series 0.3±0.1 0.50±0.05 (3) G Type (1) : Unbalance port (2)(5) : GND (3)(4) : Balance port (6) : NC 0.20±0.1 Microwave Components/Modules


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    LDB18 LDB21 LDB21869M10C-001 LDB212G4010C001 LDB182G4510G LDB212G4010C-001 LDB21869M LDB182G4505C-110 PDF

    LDB212G4

    Abstract: LDB181G8405C-110
    Text: Microwave Components Microwave Components Chip Multilayer Hybrid Couplers Hybrid Dividers 2.00±0.10 2 0.95±0.10 (1) 1.25±0.10 (3) (5) (6) LDD211G6103A-095 0.30 -0.2 (4) 0.30±0.10 0.35±0.10 0.20 0.65±0.05 ±0.10 +0.1 Directional Input Mark (1) GND (2) IN


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    LDD211G6103A-095 100ohm LDD211G6103A-095 LDD211G6603A-096 LDD211G7503A-067 LDD212G1403A-075 LDD21718M03A-060 LDD21740M03A-077 LDD21967M03A-068 06005C-001 LDB212G4 LDB181G8405C-110 PDF

    LFD181G57DPFC087

    Abstract: MDR771F lfb215g42sg8a300 DBF81F107 DBF81F107-CSR LFB212G45BA1A220 dbf81f104 soshin LDB181G8110G-120 LFB212G45SG8A192
    Text: CROSS REFERENCE CUTTING-EDGE TECHNOLOGIES OF RF SOLUTIONS LTCC Mag. Layers Soshin Murata LTB-1608-2G4H6-B1 HMD952T LFB182G45SG9A246/293/289 DEA162450BT-1210A1/A2 LTB-1608-2G4H6-A2 LTB-1608-2G6H6-A1 LFB182G60SGHB972/C149 LTB-1608-3G5H6-A1 LFB183G60SGJC019 LTB-2012-1G9H6-A1


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    LTB-1608-2G4H6-B1 HMD952T LFB182G45SG9A246/293/289 DEA162450BT-1210A1/A2 LTB-1608-2G4H6-A2 LTB-1608-2G6H6-A1 LFB182G60SGHB972/C149 LTB-1608-3G5H6-A1 LFB183G60SGJC019 LTB-2012-1G9H6-A1 LFD181G57DPFC087 MDR771F lfb215g42sg8a300 DBF81F107 DBF81F107-CSR LFB212G45BA1A220 dbf81f104 soshin LDB181G8110G-120 LFB212G45SG8A192 PDF

    X24M000000S067

    Abstract: PTI 30 040 pa AEL 24MHz EM3581-RTR
    Text: EM358x High-Performance, Integrated ZigBee/802.15.4 System-on-Chip Family Complete System-on-Chip - 32-bit ARM Cortex -M3 processor - 2.4 GHz IEEE 802.15.4-2003 transceiver & lower MAC - 256 or 512 kB flash, with optional read protection - 32 or 64 kB RAM memory


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    EM358x ZigBee/802 32-bit AES128 X24M000000S067 PTI 30 040 pa AEL 24MHz EM3581-RTR PDF

    LDB212G4005

    Abstract: No abstract text available
    Text: Microwave Components 04.07.01 Chip Multilayer Hybrid Baluns Chip Multilayer Hybrid Baluns 1.6±0.1 4 (5) (6) 0.20±0.1 0.2±0.1 0.3±0.1 0.50±0.05 +0.10 0.20 -0.15 (2) (1) 1.25±0.1 (1) (3) 0.8±0.1 (2) 0.15±0.10 (3) 0.95±0.1 2.00±0.1 0.6±0.1 Directional


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    LDB18 LDB21 LDB212G4005 PDF

    LDB211G8020C-001

    Abstract: LDB211G9005C-001 LDB18 LDB181G8405C-110 LDB181G8420C-110 LDB181G8820C-110 LDB181G9505C-110 LDB181G9510C-110 LDB182G4505C-110 LDB182G4510C-110
    Text: Microwave Components Chip Multilayer Hybrid Baluns Chip Multilayer Hybrid Baluns 1.6±0.1 4 (5) (6) 0.20±0.1 0.2±0.1 +0.10 0.20 -0.15 (2) (1) 1.25±0.1 (1) (3) 0.8±0.1 (2) 0.15±0.10 (3) 0.95±0.1 2.00±0.1 0.6±0.1 Directional Input Mark 0.3±0.1 0.50±0.05


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    LDB18 LDB21 LDB21942M20C-001 LDB211G6005C-001 LDB211G8020C-001 LDB211G9005C-001 LDB181G8405C-110 LDB181G8420C-110 LDB181G8820C-110 LDB181G9505C-110 LDB181G9510C-110 LDB182G4505C-110 LDB182G4510C-110 PDF

    LDB18

    Abstract: LDB181G8405C-110 LDB181G8420C-110 LDB181G8820C-110 LDB181G9505C-110 LDB181G9510C-110 LDB182G4505C-110 LDB182G4510C-110 LDB182G4520C-110 LDB211G8010C-001
    Text: Microwave Components 03.02.28 Chip Multilayer Hybrid Baluns Chip Multilayer Hybrid Baluns 1.6±0.1 4 (5) (6) 0.20±0.1 0.2±0.1 0.3±0.1 0.50±0.05 +0.10 0.20 -0.15 (2) (1) 1.25±0.1 (1) (3) 0.8±0.1 (2) 0.15±0.10 (3) 0.95±0.1 2.00±0.1 0.6±0.1 Directional


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    LDB18 LDB21 100MHz LDB181G8405C-110 LDB181G8420C-110 LDB181G8820C-110 LDB181G9505C-110 LDB181G9510C-110 LDB182G4505C-110 LDB182G4510C-110 LDB182G4520C-110 LDB211G8010C-001 PDF

    LDB21942M20C

    Abstract: No abstract text available
    Text: Microwave Components 04.10.20 Chip Multilayer Hybrid Baluns Chip Multilayer Hybrid Baluns 1.6±0.1 4 (5) (6) 0.20±0.1 0.2±0.1 +0.10 0.20 -0.15 (2) (1) 1.25±0.1 (1) (3) 0.8±0.1 (2) 0.15±0.10 (3) 0.95±0.1 2.00±0.1 0.6±0.1 Directional Input Mark 0.3±0.1


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    LDB18 LDB21 lan40~ LDB21942M20C PDF

    LDB182G5010G-120

    Abstract: LDB182G5005G-120
    Text: Microwave Components/Modules Chip Multilayer Hybrid Baluns 4 (5) (6) Directional Input Mark 0.2±0.1 +0.10 0.20 -0.15 LDB18 Series 0.3±0.1 0.50±0.05 (3) G Type (1) : Unbalance port (2)(5) : GND (3)(4) : Balance port (6) : NC 0.20±0.1 Microwave Components/Modules


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    LDB18 LDB21 LDB182G5010G-120 LDB182G5005G-120 PDF

    ABLS-24

    Abstract: EM3581-RTR
    Text: Ember EM358x High-Performance, Integrated ZigBee/802.15.4 System-on-Chip Family Exceptional RF Performance Complete System-on-Chip - ® 32-bit ARM Cortex-M3 processor 2.4 GHz IEEE 802.15.4-2003 transceiver & lower MAC 256 or 512 kB flash, with optional read protection


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    EM358x ZigBee/802 32-bit AES128 ABLS-24 EM3581-RTR PDF

    LDB212G4

    Abstract: No abstract text available
    Text: 高频元件 05.01.28 片状多层混合均衡器 片状多层混合均衡器 1.6±0.1 4 (5) (6) 0.20±0.1 0.2±0.1 +0.10 0.20 -0.15 (2) (1) 1.25±0.1 (1) (3) 0.8±0.1 (2) 0.15±0.10 (3) 0.95±0.1 2.00±0.1 0.6±0.1 Directional Input Mark 0.3±0.1 0.50±0.05


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    LDB18 LDB21 LDB212G4 PDF

    chip multilayer hybrid baluns

    Abstract: LDB182G5010G-120 LDB182G5005G-120 LDM182G4510CC001 LDM181G9310CC001 LDM181G9610TA007 LDB18869M15G-120 LDB181G9505C-110 LDB181G9510C-110 LDB182G4510C-110
    Text: Microwave Components Chip Multilayer Hybrid Baluns 4 (5) (6) Directional Input Mark 0.2±0.1 +0.10 0.20 -0.15 LDB18 Series 0.3±0.1 0.50±0.05 0.95±0.1 2.00±0.1 0.6±0.1 (3) (2) (1) 1.25±0.1 (1) 0.15±0.10 (2) 0.8±0.1 1.6±0.1 (3) G Type (1) : Unbalance port


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    LDB18 LDB21 LDM185G4210CC001 525MHz LDM181G9610TA007 chip multilayer hybrid baluns LDB182G5010G-120 LDB182G5005G-120 LDM182G4510CC001 LDM181G9310CC001 LDM181G9610TA007 LDB18869M15G-120 LDB181G9505C-110 LDB181G9510C-110 LDB182G4510C-110 PDF

    Untitled

    Abstract: No abstract text available
    Text: Microwave Components Chip Multilayer Hybrid Baluns Chip Multilayer Hybrid Baluns 1.6±0.1 4 (5) (6) 0.20±0.1 0.2±0.1 +0.10 0.20 -0.15 (2) (1) 1.25±0.1 (1) (3) 0.8±0.1 (2) 0.15±0.10 (3) 0.95±0.1 2.00±0.1 0.6±0.1 Directional Input Mark 0.3±0.1 0.50±0.05


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    LDB18 LDB21 PDF

    LDB215G5105C-001

    Abstract: LDB215G3710C-001 ldb18 LDB211g902 LDB211G8010C-001 LDB211G9005C-001 LDB181G8405C-110 LDB181G8420C-110 LDB181G8820C-110 LDB181G9510C-110
    Text: Microwave Components 05.05.30 Chip Multilayer Hybrid Baluns Chip Multilayer Hybrid Baluns 1.6±0.1 4 (5) (6) 0.20±0.1 0.2±0.1 +0.10 0.20 -0.15 (2) (1) 1.25±0.1 (1) (3) 0.8±0.1 (2) 0.15±0.10 (3) 0.95±0.1 2.00±0.1 0.6±0.1 Directional Input Mark 0.3±0.1


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    LDB18 LDB21 LDB21942M20C-001 LDB215G5105C-001 LDB215G3710C-001 LDB211g902 LDB211G8010C-001 LDB211G9005C-001 LDB181G8405C-110 LDB181G8420C-110 LDB181G8820C-110 LDB181G9510C-110 PDF

    0201 land pattern

    Abstract: LDB212G4020C-001 LDB311G9020C
    Text: Microwave Components 03.06.12 Chip Multilayer Hybrid Baluns Chip Multilayer Hybrid Baluns 1.6±0.1 4 (5) (6) 0.20±0.1 0.2±0.1 0.3±0.1 0.50±0.05 +0.10 0.20 -0.15 (2) (1) 1.25±0.1 (1) (3) 0.8±0.1 (2) 0.15±0.10 (3) 0.95±0.1 2.00±0.1 0.6±0.1 Directional


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    LDB18 LDB21 0201 land pattern LDB212G4020C-001 LDB311G9020C PDF

    Untitled

    Abstract: No abstract text available
    Text: 高周波コンポーネンツ 05.05.30 チップ多層ハイブリッドバラン チップ多層ハイブリッドバラン 1.6±0.1 4 (5) (6) 0.20±0.1 0.2±0.1 +0.10 0.20 -0.15 (2) (1) 1.25±0.1 (1) (3) 0.8±0.1 (2) 0.15±0.10 (3) 0.95±0.1 2.00±0.1


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    LDB18 LDB21 LDB21836M20C-001 LDB21881M05C-001 LDB21881M20C-001 LDB21897M05C-001 LDB21906M05C-001 LDB21906M20C-001 LDB21924M05C-001 LDB21924M20C-001 PDF

    MM5829-2700

    Abstract: MM8030-2600 ANCL11G57SAA165 ANCL11G57 CSR BC5MM MICROCHIP 2012 SMD MARKING AS-M15SA-R CA0TB MEDIATEK z5v cap
    Text: MURATA PRODUCTS 2010-2011 2010-2011 MURATA PRODUCTS !Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice.


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    K99E-28 MM5829-2700 MM8030-2600 ANCL11G57SAA165 ANCL11G57 CSR BC5MM MICROCHIP 2012 SMD MARKING AS-M15SA-R CA0TB MEDIATEK z5v cap PDF

    MAX2830

    Abstract: CX3225SB40000H0WZK21 MAX2830ETM SN74LVTH244ADB CX3225SB40000H0 LDB212G4010C-001 MAX8882EUTJJ GRM21BR60J106K C54-C59 R3280
    Text: 19-0926; Rev 0; 8/07 MAX2830 Evaluation Kit The MAX2830 evaluation kit EV kit simplifies testing of the MAX2830 receive and transmit performance in 802.11g/b applications operating in the 2.4GHz to 2.5GHz ISM band. The EV kit provides 50Ω SMA connectors for all RF and baseband inputs and outputs.


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    MAX2830 11g/b MAX2830EVKIT+ MAX2830 CX3225SB40000H0WZK21 MAX2830ETM SN74LVTH244ADB CX3225SB40000H0 LDB212G4010C-001 MAX8882EUTJJ GRM21BR60J106K C54-C59 R3280 PDF

    LDB185G3710G-120

    Abstract: LDB182G5010G-120 LDB182G5010G LDB215G3710C-001 LDB211G8120C LDB182G4510G LDB181G9510C-110 LDB182G4505C-110 LDB182G4510C-110 LDB182G4520C-110
    Text: Microwave Components Chip Multilayer Hybrid Baluns 4 (5) (6) Directional Input Mark 0.2±0.1 +0.10 0.20 -0.15 LDB18 Series 0.3±0.1 0.50±0.05 (3) G Type (1) : Unbalance port (2)(5) : GND (3)(4) : Balance port (6) : NC 0.20±0.1 Microwave Components (2)


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    LDB18 LDB21 LDM182G5005CC001 200MHz LDB185G3710G-120 LDB182G5010G-120 LDB182G5010G LDB215G3710C-001 LDB211G8120C LDB182G4510G LDB181G9510C-110 LDB182G4505C-110 LDB182G4510C-110 LDB182G4520C-110 PDF

    LDB212G1020C-001

    Abstract: No abstract text available
    Text: Microwave Components Chip Multilayer Hybrid Baluns Chip Multilayer Hybrid Baluns 1.6±0.1 4 (5) (6) 0.20±0.1 0.2±0.1 +0.10 0.20 -0.15 (2) (1) 1.25±0.1 (1) (3) 0.8±0.1 (2) 0.15±0.10 (3) 0.95±0.1 2.00±0.1 0.6±0.1 Directional Input Mark 0.3±0.1 0.50±0.05


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    LDB18 LDB21 LDB212G1020C-001 PDF