XC3020A
Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Text: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA
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XC8100
XC3020A
XC3020L
XC3030A
XC3030L
XC3042A
XC3042L
XC3064A
XC3064L
XC3090A
XC3090L
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gold embrittlement
Abstract: ADXL278 application note ADXL278 ADXL78 AN-652 cte table LCC-8 LCC-8 land pattern ADXL193 IPC-SM-782
Text: AN-652 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/326-8703 • www.analog.com Considerations for Soldering Accelerometers in LCC-8 Packages onto Printed Circuit Boards By Hubert Geitner
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AN-652
ADXL78/ADXL278/ADXL193
E03707
gold embrittlement
ADXL278 application note
ADXL278
ADXL78
AN-652
cte table
LCC-8
LCC-8 land pattern
ADXL193
IPC-SM-782
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LT1124
Abstract: OP270 OP470 MSOP-9 op27
Text: RELIABILITY DATA LT1124 / 1125 / 1126 / 1127 / OP270 / OP470 12/8/2000 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE CERDIP FLATPAK/LCC PLASTIC DIP SOIC/SOT/MSOP 42 9101 80 9318 1,869 9207 228 9505 2,219 • HIGHLY ACCELERATED STRESS TEST AT +131°C/85%RH
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LT1124
OP270
OP470
00-03-6209B.
OP470
MSOP-9
op27
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LM119
Abstract: LM319 LT1123
Text: RELIABILITY DATA LM119 / LM319 / LT1123 12/8/2000 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE CERDIP FLATPAK/LCC HERMETIC PLASTIC DIP TO-92 1,058 8433 766 9109 1,934 8318 535 8411 630 8952 4,923 • HIGHLY ACCELERATED STRESS TEST AT +131°C/85%RH
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LM119
LM319
LT1123
00-03-6209B.
LT1123
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LM119
Abstract: LM319 LT1123 9121
Text: RELIABILITY DATA LM119 / LM319 / LT1123 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE CERDIP FLATPAK/LCC HERMETIC PLASTIC DIP TO-92 NEWEST DATE CODE 1,138 8433 926 9109 2,014 8318 535 8411 630 8952 5,243 • HIGHLY ACCELERATED STRESS TEST AT +131°C/85%RH
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LM119
LM319
LT1123
00-03-6209B.
LT1123
9121
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Untitled
Abstract: No abstract text available
Text: LCC, TLCC Vishay Thin Film Hermetic, 50 mil Pitch, Leadless Chip Resistor, Surface Mount Network FEATURES • High purity alumina substrate for high power dissipation • Leach resistant terminations with nickel barrier • 16, 20, 24 terminal gold plated wraparound
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2002/95/EC
11-Mar-11
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Untitled
Abstract: No abstract text available
Text: LCC, TLCC Vishay Thin Film Hermetic, 50 mil Pitch, Leadless Chip Resistor, Surface Mount Network FEATURES • High purity alumina substrate for high power dissipation • Leach resistant terminations with nickel barrier • 16, 20, 24 terminal gold plated wraparound
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2002/95/EC
18-Jul-08
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LT1124
Abstract: OP270 OP470
Text: RELIABILITY DATA LT1124 / 1125 / 1126 / 1127 / OP270 / OP470 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE CERDIP FLATPAK/LCC PLASTIC DIP SOIC/SOT/MSOP NEWEST DATE CODE 89 9101 80 9318 1,969 9207 459 9505 2,597 • HIGHLY ACCELERATED STRESS TEST AT +131°C/85%RH
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LT1124
OP270
OP470
00-03-6209B.
OP470
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67-31H-GBC-AZ0Z2EZ3-BT
Abstract: 67-31H/GBC-AZ0Z2EZ3/BT
Text: EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet Power Top View LEDs with Lens 67-31H/GBC-AZ0Z2EZ3/BT Features ․P-LCC-3 package. ․High flux output. ․High current capability. ․White package. ․Optical indicator. ․Colorless clear window. ․Ideal for backlight and light pipe application.
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67-31H/GBC-AZ0Z2EZ3/BT
67-31H
DSE-0001049
16-Mar
67-31H-GBC-AZ0Z2EZ3-BT
67-31H/GBC-AZ0Z2EZ3/BT
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c2003
Abstract: SAW filter marking code SF0869BA02618S marking code SAW
Text: 869 MHz SAW Filter 2 MHz Bandwidth Part Number: SF0869BA02618S DESCRIPTION • • • Miniature 869 MHz SAW IF Filter. 3 x 3 mm Ceramic LCC package. RoHS compliant TYPICAL PERFORMANCE SPECIFICATION Parameter Center Frequency FC Insertion Loss 868 – 870 MHz
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SF0869BA02618S
DSSF0869BA02618S
28-Sep-2007
SF0869BA02618S
c2003
SAW filter marking code
marking code SAW
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TLCC20AE1002BUF
Abstract: TLCC
Text: SURFACE MOUNT NETWORKS LCC, TLCC Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • Lead Pb -free available Pb-free • High purity alumina substrate for high power dissipation Available RoHS* • Leach resistant terminations with nickel barrier
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08-Apr-05
TLCC20AE1002BUF
TLCC
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Untitled
Abstract: No abstract text available
Text: EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet Power Top View LED with Lens. 67-31J/T2C-EZ01Z12MZ3/BT Features ˙P-LCC-3 package. ․High flux output. ․High current capability. ․White package. ․Optical indicator. ․Colorless clear window. ․Ideal for backlight and light pipe application.
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67-31J/T2C-EZ01Z12MZ3/BT
67-31F
DSE-67J-001
25-Apr-2008
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Untitled
Abstract: No abstract text available
Text: EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet Power Top View LED With Lens. 67-31F/T7C-PZ01Z11MZ3/CT Features ․P-LCC-3 package. ․High flux output. ․High current capability. ․White package. ․Optical indicator. ․Colorless clear window. ․Ideal for backlight and light pipe application.
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67-31F/T7C-PZ01Z11MZ3/CT
67-31F
DSE-0000188
07-Oct-2008
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hp6263
Abstract: HP3314A AD842 EIA-481A HA2542 R-16 P6201
Text: APPLICATIONS Line Drivers DAC and ADC Buffers Video and Pulse Amplifiers Available in Plastic DIP, Hermetic Metal Can, Hermetic Cerdip, SOIC and LCC Packages and in Chip Form MIL-STD-883B Parts Available Available in Tape and Reel in Accordance with EIA-481A Standard
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MIL-STD-883B
EIA-481A
AD842
20-Terminal
E-20A)
16-Lead
C1195c
14-Lead
hp6263
HP3314A
HA2542
R-16
P6201
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Untitled
Abstract: No abstract text available
Text: APPLICATIONS Line Drivers DAC and ADC Buffers Video and Pulse Amplifiers Available in Plastic DIP, Hermetic Metal Can, Hermetic Cerdip, SOIC and LCC Packages and in Chip Form MIL-STD-883B Parts Available Available in Tape and Reel in Accordance with EIA-481A Standard
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MIL-STD-883B
EIA-481A
AD842
20-Terminal
E-20A)
16-Lead
C1195câ
14-Lead
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Untitled
Abstract: No abstract text available
Text: LCC, TLCC www.vishay.com Vishay Dale Thin Film Hermetic, 50 mil Pitch, Leadless Thin Film Chip Resistor, Surface Mount Network FEATURES • High purity alumina substrate for high power dissipation • Leach resistant terminations with nickel barrier • 16, 20, 24 terminal gold plated wraparound
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2002/95/EC
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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VSM85
Abstract: No abstract text available
Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product
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VSM85,
VSM86,
VSM87,
VSM88
VSM89
18-Jul-08
VSM85
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VS838
Abstract: 2S81 AD2S80A DB10 8 way dip switch AD2S80AUD osc1758
Text: GENERAL DESCRIPTION The AD2S80A is a monolithic 10-, 12-, 14-, or 16-bit tracking resolver-to-digital converter contained in a 40-lead DIP or 44terminal LCC ceramic package. It is manufactured on a BiMOS II process that combines the advantages of CMOS logic and
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AD2S80A
16-bit
40-lead
44terminal
10-bit
VS838
2S81
DB10
8 way dip switch
AD2S80AUD
osc1758
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Untitled
Abstract: No abstract text available
Text: LCC, TLCC www.vishay.com Vishay Dale Thin Film Hermetic, 50 mil Pitch, Leadless Thin Film Chip Resistor, Surface Mount Network FEATURES • High purity alumina substrate for high power dissipation • Leach resistant terminations with nickel barrier • 16, 20, 24 terminal gold plated wraparound
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2002/95/EC
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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VSM85
Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32 socket
Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product
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VSM85,
VSM86,
VSM87,
VSM88
VSM89
08-Apr-05
VSM85
CERAMIC LEADLESS CHIP CARRIER LCC 32 socket
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cmos not
Abstract: cross reference cmos 4000 7120 D 1163 A
Text: HYBRID CRYSTAL OSCILLATOR SUBMINIATURE HYBRID CRYSTAL OSCILLATORS LEADLESS CHIP CARRIER LCC FEATURES: SERIES: 7110 TTL/ 4110 CMOS 7119 TTL7 4119 CMOS *7120 TTL/ 4120 CMOS • High Reliability • Minimum Size • Surface Mountable • Hermetically Sealed
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00G00Ã
MIL-0-55310
MIL-STD-883
M55310/19
cmos not
cross reference cmos 4000
7120
D 1163 A
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11ax
Abstract: 80486 microprocessor pin out diagram
Text: PRELIMINARY CYPRESS SEMICONDUCTOR Features 32K x 9 Synchronous Cache R/W RAM • D irect interface with the processor and external cache controller Supports 66-M Hz Pentium " CPU cache systems • TWo complementary synchronous chip enables Available in standard PLCC/LCC
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CY7B173A
CY7B174A
i486/Pentium
7B173A)
7B174A)
44-pin
44-Square
--10JC
--14LMB
11ax
80486 microprocessor pin out diagram
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MPY100L
Abstract: No abstract text available
Text: BURR-BROldN CORP 0 3 E D | 17313LS BURR-BROW N •B B T -73-27 00130L>b b | MPY100L É LCC MULTIPLIER-DIVIDER APPLICATIONS FEATURES MULTIPLICATION LOW COST DIFFERENTIAL INPUT DIVISION ACCURACY 100% TESTED AND GUARANTEED SQUARING NO EXTERNAL TRIMMING REQUIRED
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17313LS
00130bb
T-73-27
MPY100L
90/iV,
10kHz
T0-100
20VDC
500mW
40VDC
MPY100L
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DAC80P
Abstract: No abstract text available
Text: BURR-BROW N |B DAC80 DAC80P j| AVAILABLE IN DIE FORM • • • • • INDUSTRY STANDARD PINOUT LOW POWER DISSIPATION: 345mW FULL ±10V SWING WITH \lcc = ±12VDC DIGITAL INPUTS ARE TTL- AND CMOS-COMPATIBLE 6UARANTEE0 SPECIFICATIONS WITH ±\ZV AND ±15V SUPPLIES
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DAC80
DAC80P
345mW
12VDC
DAC80
DAC80.
DAC80P
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