19575
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LBGA324 package SOT728-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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LBGA324
OT728-1
OT728-1
19575
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LBGA324 package SOT728-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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LBGA324
OT728-2
OT728-2
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LBGA324
Abstract: MO-192 sot728
Text: PDF: 2001 Nov 02 Philips Semiconductors Package outline LBGA324: plastic low profile ball grid array package; 324 balls; body 19 x 19 x 1.05 mm A B D SOT728-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y y1 C ∅w M C V U T e R P N M
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LBGA324:
OT728-1
25SOT728-1
MO-192
LBGA324
MO-192
sot728
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Untitled
Abstract: No abstract text available
Text: Package outline LBGA324: plastic low profile ball grid array package; 324 balls; body 19 x 19 x 1 mm D B SOT728-2 A ball A1 index area A E A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M C A B C y y1 C V U T e R P N M L K J H G F E D C B A ball A1 index area e2
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LBGA324:
OT728-2
MO-192
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MO-192
Abstract: LBGA324 sot728
Text: Package outline Philips Semiconductors LBGA324: plastic low profile ball grid array package; 324 balls; body 19 x 19 x 1 mm D B SOT728-2 A ball A1 index area A2 A E A1 detail X C e1 e ∅v ∅w b 1/2 e M M C A B C y y1 C V U T e R P N M L K J H G F E D C B
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LBGA324:
OT728-2
MO-192
MO-192
LBGA324
sot728
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