land pattern for TSOP 2-44
Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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TSOP-48 pcb LAYOUT
Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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28F160
Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than
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BGA reflow guide
Abstract: Senju Sn3.0Ag0.5Cu land pattern for TSOP 2 86 PIN 52-pin TSOP ED-7404A senju solder paste vapor phase printer component wiring diagram for float switch with pressure tank TSOP 66 Package thermal resistance land pattern for TSOP 2 54 pin
Text: Renesas Surface Mount Package Rev.2.00 2003.12.1 Renesas Surface Mount Package User's Manual REJ11K0001-0200Z Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is
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REJ11K0001-0200Z
BGA reflow guide
Senju Sn3.0Ag0.5Cu
land pattern for TSOP 2 86 PIN
52-pin TSOP
ED-7404A
senju solder paste vapor phase
printer component
wiring diagram for float switch with pressure tank
TSOP 66 Package thermal resistance
land pattern for TSOP 2 54 pin
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
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BFG95
Abstract: No abstract text available
Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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UG112
UG072,
UG075,
XAPP427,
BFG95
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A5625-01
Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which
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PCB footprint cqfp 132
Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Text: Packages and Thermal Characteristics August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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XC7236A
XC7272A
XC7318
XC7336
XC7336Q
XC7354
XC7372
XC73108
XC73144
XC9536
PCB footprint cqfp 132
schematic impulse sealer
xc4010e-pq208
footprint pga 84
TSOP 54 PIN footprint 14mm x 20 mm
.65mm bga land pattern
QFP PACKAGE thermal resistance die down
XC4013E-PQ240
XC7272A
XC7318
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TK12A10K3
Abstract: tk12a10k TK33A60V TPCA*8065 TK40E10K3 SSM6K407TU TPCA*8064 tk6a65d equivalent TPCA*8036 TK100G10N1
Text: Semiconductor Catalog 2012-3 MOSFETs SEMICONDUCTOR & STORAGE PRODUCTS http://www.semicon.toshiba.co.jp/eng C O N T E N T S 1 Features and Structures . 3 2 Toshiba’s MOSFET Product Lines and Part Numbering Schemes. 4
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W29GL064C
Abstract: No abstract text available
Text: W29GL064C 64M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE Publication Release Date: June 7, 2013 Revision G BLANK W29GL064C Table of Contents 1 2 3 4 5 6 7 GENERAL DESCRIPTION . 1
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W29GL064C
64M-BIT
W29GL064C
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Untitled
Abstract: No abstract text available
Text: W29GL064C 64M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE Publication Release Date: August 2, 2013 Revision H BLANK W29GL064C Table of Contents 1 2 3 4 5 6 7 GENERAL DESCRIPTION . 1
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W29GL064C
64M-BIT
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Untitled
Abstract: No abstract text available
Text: W29GL064C 64M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE Publication Release Date: August 3, 2012 Revision F BLANK W29GL064C Table of Contents 1 2 3 4 5 6 7 GENERAL DESCRIPTION . 1
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W29GL064C
64M-BIT
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hdlc
Abstract: 0X00 CRC-32 PM5342
Text: PM5342 PRELIMINARY APPLICATION NOTE PMC-971133 ISSUE 1 PACKET OVER SONET Implementation of a Packet Over SONET/SDH Transmission System using the SPECTRA-155. Preliminary Issue 1 PMC-Sierra, Inc. 105 - 8555 Baxter Place Burnaby, BC Canada V5A 4V7 604 .415.6000
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PM5342
PMC-971133
SPECTRA-155.
PM-971133
hdlc
0X00
CRC-32
PM5342
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Untitled
Abstract: No abstract text available
Text: W29GL032C 32M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE Publication Release Date: August 2, 2013 Revision H BLANK W29GL032C Table of Contents 1 2 3 4 5 6 7 GENERAL DESCRIPTION . 1
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W29GL032C
32M-BIT
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smd transistor mark E13
Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue
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SSYZ015B
smd transistor mark E13
Modified Coffin-Manson Equation Calculations
senju solder paste m10 f12
A10D10
P6K6
BGA reflow guide
Senju metal flux T5
k5m6
K793
T4V4
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land pattern for TSOP 2 54 pin
Abstract: land pattern for TSOP 56 pin TSOP 54 land pattern 40013A land pattern for TSOP
Text: n H igh p e rfo rm a n c e 1 M X 8 /5 1 2 K X 1 6 2.2V CMOS Flash EEPROM AS29LL8ÜÖ II 1 M X 8 / 5 1 2 K X 1 6 CMOS Flash EPROM Advance information Features •O rganization: 1M x 8/512K x 16 • Sector architecture - • Low power consumption - 8 mA typical read current
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AS29LL8Ü
8/512K
48-pin
land pattern for TSOP 2 54 pin
land pattern for TSOP 56 pin
TSOP 54 land pattern
40013A
land pattern for TSOP
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Untitled
Abstract: No abstract text available
Text: H ig h P e rfo rm a n c e lMx4 CMOS DRAM A S4C 14400 h II , 1 1M x 4 CMOS DRAM fast page m ode Prelim inary inform ation Features • 1 0 2 4 r e f r e s h c y c le s , 1 6 m s r e f r e s h in te r v a l • O r g a n iz a t io n : 1 , 0 4 8 ,5 7 6 w o r d s x 4 b its
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o00oo
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Untitled
Abstract: No abstract text available
Text: H igh perform ance 128KX8 5 V CMOS Flash EEPROM H A S29F010 II 1 2 8 K X 8 CMOS Flash EEPROM Features • O r g a n iz a t io n : 12 8 K x 8 b its • JEDEC s ta n d a r d w r i t e c y c le c o m m a n d s - p ro te c ts da ta fro m accidental changes • S e c to r E rase a r c h ite c tu r e
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128KX8
S29F010
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Untitled
Abstract: No abstract text available
Text: H igh Perform ance lMx4 CMOS DRAM |B AS4C14405 A ! M x 4 CMOS EDO DRAM Preliminary information Features • O r g a n iz a t io n : 1 , 0 4 8 , 5 7 6 w o r d s x 4 b its • 1 0 2 4 r e f r e s h c y c le s , 1 6 m s r e f r e s h in t e r v a l • H ig h sp e ed
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AS4C14405
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ansi y14.5m-1982 decimal
Abstract: CD 4039 AE ansi y14.5m-1982 decimal .xxxx SSC 9500 MAA 723 pj 299 IC 4033 pin configuration IC CD 4033 pin configuration IC CD 4033 pin diagram tsop 48 PIN
Text: PACKAGE s o ie DIAGRAM O U T L IN E S PACKAGE SOIC DIAGRAM O U T L IN E S C o n tin u ed REVISIONS DWG § NOM N MAX T E S 0 18- -1 DWG § JEDEC VARIATION □ AA MIN DWG § S016- JEDEC VARIATION □ AB MIN NOM MAX S020- 2 JEDEC VARIATION T E NOM MAX T E
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s016-1
s018-1
s020-2
s024-2
s028-2
MO-153,
PSC-4056
ansi y14.5m-1982 decimal
CD 4039 AE
ansi y14.5m-1982 decimal .xxxx
SSC 9500
MAA 723
pj 299
IC 4033 pin configuration
IC CD 4033 pin configuration
IC CD 4033 pin diagram
tsop 48 PIN
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Untitled
Abstract: No abstract text available
Text: H ig h P e r fo r m a n c e 1M X 16 CM OS DRAM A S4C 1M 16F5 h I II l M x 1 6 C M O S D R A M fa st paae m od e Preliminary information Features • Organization: 1,048,576 words x 16 bits • High speed • 1024 refresh cycles, 16 ms refresh interval - RA S-only o r CAS-before-RAS re fresh
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Untitled
Abstract: No abstract text available
Text: II High p e rfo rm an c e 6 4 K x 52 » A S7CÌ643 2 CM O S SRAM A 6 4 K x 3 2 Synchronous burst S R A M Features • F low -th rou gh op tion • Fast clo ckin g sp e ed : 1 0 0 / 8 3 / 6 6 M H z • Fast clock to d ata access: 5 / 6 / 7 ns • Self-tim ed w rite cycle
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oki c510
Abstract: C2001 MSM64153L-011GS-BK monster game land pattern tsop 66
Text: O K I Semiconductor MSM64153L-011 LCD Games IC GENERAL DESCRIPTION The MSM64153L-011 is a low power 4-bit microcontroller fabricated in silicon gate CMOS technology. It uses an nX-4s high performance core CPU that has OKI original architecture and integrated peripheral circuits.
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MSM64153L-011
MSM64153L-011
80-PIN
QFP80-P-1420-K
QFP84-P-1420-BK
oki c510
C2001
MSM64153L-011GS-BK
monster
game
land pattern tsop 66
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Untitled
Abstract: No abstract text available
Text: H igh P erfo rm a n ce •■ A S 7 C 1024 H 128Kx8 CMOS SRAM A S7C 31024 1 2 8 K X 8 C M O S SRAM C o m m o n I / O • O r g a n iz a tio n : 1 3 1 ,0 7 2 w o r d s x 8 b its • T T L /L V T T L -c o m p a tib le , th r e e - s ta te I / O • H ig h sp ee d
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o00oo
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