LAND PATTERN QFP 208 Search Results
LAND PATTERN QFP 208 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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8501002YC |
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Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 | |||
8501001YA |
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Microprocessor, 16-Bit, 8MHz, CMOS, CQFP68, CERAMIC, QFP-68 | |||
NG82370-16 |
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Multifunction Peripheral, CMOS, PQFP100, PLASTIC, QFP-100 | |||
MQ80C196KB-12 |
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Microcontroller, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 | |||
TMC2081KBC |
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Consumer Circuit, PQFP128, METRIC, PLASTIC, QFP-128 |
LAND PATTERN QFP 208 Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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SF-QFE208SB-L-01
Abstract: No abstract text available
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SF-QFE208SB-L-01 | |
R50-E2Y2-24
Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
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PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001 | |
1.27mm pitch zif socket 3M 21X21
Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
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SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432 | |
FP-X4KPG223-01
Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
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XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01 | |
land pattern QFP 208
Abstract: CA-QFE208SC-L-S-01 1130b
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FR4/G10 SF-QFE208SC-L-01 CA-QFE208SC-L-S-01 land pattern QFP 208 1130b | |
land pattern QFP 208
Abstract: CA-QFE208SA1-L-Z-T-02
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Fr4/G10 CA-QFE208SA1-L-Z-T-02 land pattern QFP 208 | |
land pattern QFP 208
Abstract: CA-QFE208SB-L-S-01 SF-QFE208SB-L-01
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SF-QFE208SB-L-01 FR4/G10 CA-QFE208SB-L-S-01 land pattern QFP 208 SF-QFE208SB-L-01 | |
land pattern QFP 208
Abstract: CA-QFE208SA-L-S-01 SF-QFE208SA-L-01
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SF-QFE208SA-L-01 FR4/G10 CA-QFE208SA-L-S-01 CA-QFE208Sx-L-S-01 land pattern QFP 208 SF-QFE208SA-L-01 | |
FBGA-484
Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
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FBGA484 SI-SX32-ACQ256SFG484 SI-SX72-ACQ256SFG484) SI-SX72-ACQ256SFG484 CQ256 FG484 SI-SX72ACQ256SFG484) FBGA-484 A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 | |
land pattern for TSOP 2 86 PIN
Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
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PA-PGA181-02W
Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
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12X12mm. FR4/G10 PA-PGA181-02W PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01 | |
land pattern QFP 208
Abstract: PA-QFE208S-A-S-01
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FR4/G10 SB-PGA28/208A-01 PA-QFE208S-A-S-01 land pattern QFP 208 | |
land pattern QFP 208
Abstract: PA-QFE208SB-P-S-01
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FR4/G10 SB-PGA21/208A-01W. PA-QFE208SB-P-S-01 land pattern QFP 208 | |
footprint jedec MS-026 TQFP
Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
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PCB footprint cqfp 132
Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
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XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 | |
xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
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UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G | |
BFG95
Abstract: No abstract text available
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UG112 UG072, UG075, XAPP427, BFG95 | |
xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
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UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance | |
XILINX/part marking Hot
Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
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UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 | |
qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
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UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga | |
MO-83-AF
Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
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XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128 | |
marking code SMD Transistor 2ak
Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
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C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste | |
J-STD-001C
Abstract: IPC-SM-782 land pattern QFP 208 guidelines J-STD001C
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OCR Scan |
208-LEAD 012x0. J-STD-001C IPC-SM-782 land pattern QFP 208 guidelines J-STD001C | |
land pattern QFP 208
Abstract: No abstract text available
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OCR Scan |
208-LEAD 012x0 U-STD-001C land pattern QFP 208 |