1190E
Abstract: IPC-SM-782 MS-016 23-12J
Text: All Package Diagrams 3DFNDJH GLDJUDPV 3ODVWLF GXDO LQOLQH SDFNDJH 3',3 20-pin 300 mil Min Max A 0.175 A1 0.010 B 0.046 0.054 b 0.018 0.024 c 0.008 0.014 D 0.980 E 0.290 0.310 E1 0.263 0.293 e 0.100 BSC eA 0.310 0.350 L 0.110 0.130 α 0° 15° S 0.040
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20-pin
28-pin
32-pin
1190E
IPC-SM-782
MS-016
23-12J
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land pattern for TSOP 2-44
Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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R50-E2Y2-24
Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.
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PC-ZIP/DIP20-01
PC-ZIP/DIP28-01
PC-ZIP/DIP28-02
PC-ZIP20/DIP18-01
R50-E2Y2-24
sk 8085
84 pin plcc ic base
Aromat TQ2E-24V
UT1553BCRTM
INTEL 486 dx2
soic40
plcc44 pinout numbers
XE4006E
68hc001
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TSOP-48 pcb LAYOUT
Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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PAL 007 pioneer
Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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pioneer PAL 007 A
Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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land pattern for TSOP 2 86 PIN
Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS
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44-pin plcc pcb mount footprint
Abstract: PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X
Text: 7 Logic Analyzers and Accessories 7 Logic Analyzers and Accessories Logic Analyzers and Accessories Logic Analyzers and Accessories DS00104F-page 7-1 2001 Microchip Technology Inc. Logic Analyzers and Accessories Section 7 Logic Analyzers and Accessories
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DS00104F-page
PIC12CXXX,
PIC14C000,
PIC16CXXX
PIC17CXXX
28C64ASO
28C64AK
PIC16C55SW
W9711
44-pin plcc pcb mount footprint
PIC16C71SO
pic16c57 PCB Circuit
27C64SO
PIC16C74P
adaptor 32 pin dil to 32 pin plcc
pic16c57 codes
data programmers DIP PLCC
Enplas
PIC17C76X
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
MIL-M-38510
MIL-STD-883
LGA 1156 PIN OUT diagram
QSJ-44403
LGA 1150 Socket PIN diagram
LGA 1155 Socket PIN diagram
IC107-26035-20-G
LGA 1151 PIN diagram
REFLOW lga socket 1155
IC107-3204-G
TB 2929 H alternative
LGA 1155 pin diagram
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ic 6116 datasheet from texas instruments
Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
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Untitled
Abstract: No abstract text available
Text: J d t 3.3V CMOS STATIC RAM 4 MEG 512K X 8-BIT) ADVANCE r o V424S IDT71V424L I n t e g r a t e d D e i/ ic e T e c h n o l o g y , I n c . FEATURES: DESCRIPTION: • 512K x 8 advanced high-speed CMOS Static RAM • JEDEC Center Power / GND pinout for reduced noise
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V424S
IDT71V424L
10/12/15ns
36-pin,
44-pin,
IDT71V424
304-bit
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Untitled
Abstract: No abstract text available
Text: jdt 3.3V CMOS STATIC RAM 4 MEG 256K x 16-BIT) PRELIMINARY I n t e g r a t e d D e v i c e T e c h n o lo g y , In c . FEATURES: • 256K x 16 advanced high-speed CMOS Static RAM • JEDEC Center P ow er/G N D pinout for reduced noise. • Equal access and cycle times
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16-BIT)
10/12/15ns
44-pin,
IDT71V416
194304-bit
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Untitled
Abstract: No abstract text available
Text: jdt Integrated Device Technology, Inc. 3.3V C M O S STATIC RAM 1 MEG 128K x 8) CENTER POWER & GROUND PINOUT PRELIMINARY IDT71V124SA FEATURES: DESCRIPTION: • 128K x 8 advanced high-speed C M O S static RAM • JED EC revolutionary pinout (center power/GND) for
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IDT71V124SA
10/12/15/20ns
32-pin
400-mil
32pin
IDT71V124
576-bit
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DD27D
Abstract: land pattern for TSOP 2 50 MB257 TM 1828
Text: 3.3V CMOS STATIC RAM 32Kx 16-BIT PRELIMINARY IDT71V008 Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • 32K x 16 advanced high-speed CMOS Static RAM • Equal access and cycle times — 10/12/15/20ns • One Chip Select plus one Output Enable pin
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16-BIT
IDT71V008
10/12/15/20ns
44-pin
IDT71V008
288-bit
910-338-207Q
DD27D
land pattern for TSOP 2 50
MB257
TM 1828
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land pattern for TSOP 2 44 PIN
Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin psop 44 land pattern PQFP 208
Text: High perform ance 512KX32 CMOS SGRAM 16 Megabit CMOS synchronous graphic RAM Advance information • Organization - 131,072 words x 32 bits x 4 banks • Fully synchronous - All signals referenced to positive edge of dock • Four internal banks controlled by BA0/BA1 bank select
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512KX32
AS4LC512K32SG0
100-pin
land pattern for TSOP 2 44 PIN
land pattern for TSOP 2 54 pin
land pattern for TSOP 56 pin
psop 44
land pattern PQFP 208
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land pattern for TSOP 2 44 PIN
Abstract: com 6116 e2 CHN 920
Text: 3.3V CMOS STATIC RAM 1 MEG 128K X 8 CENTER POWER & GROUND PINOUT PRELIMINARY IDT71V124SA FEATURES: DESCRIPTION: • 128K x 8 advanced high-speed CM O S static RAM • JED E C revolutionary pinout (center power/GND) for reduced noise • Equal access and cycle tim es
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9/10/12/15/20ns
32-pin
400-m
32pin
IDT71V124SA
T71V124
576-bit
land pattern for TSOP 2 44 PIN
com 6116 e2
CHN 920
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ln 3624
Abstract: ansi y14.5m-1982 decimal .xxxx 71V416S15
Text: PRELIMINARY IDT71V416 3.3V CMOS STATIC RAM 4 MEG 256Kx 16-BIT I n t e g r a t e d D e v iz e T e c h n o lo g y , l i e . FEATURES: • 256K x 16 advanced high-speed CMOS Static RAM • JEDEC Center Power /GND pinout for reduced noise. • Equal access and cycle times
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256Kx
16-BIT)
IDT71V416
8/10/12/15ns
44-pin,
IDT71V416
194304-bit
high-reliabil005
MS-027,
ln 3624
ansi y14.5m-1982 decimal .xxxx
71V416S15
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land pattern for TSOP 2 54 pin
Abstract: TSOP 54 land pattern AS7C1024 AS7C31024 land pattern for TSOP 2 44 PIN
Text: H igh P erfo rm an ce •■ 128Kx8 A S7C 1024 A S7C 31024 H CMOS SRAM 1 2 8 K X 8 CM O S SRAM C o m m o n I / O Features • O rg a n iz a tio n : 1 3 1 ,0 7 2 w o rd s x 8 b its • H ig h sp e ed - 3 0 0 m il PDIP a n d SOJ - 1 0 / 1 2 / 1 5 / 2 0 n s ad d ress access tim e
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AS7C1024
128Kx8
AS7C31024
32-pin
7C512
64Kx8)
2S6/272
1-10007-A.
T00344C]
land pattern for TSOP 2 54 pin
TSOP 54 land pattern
land pattern for TSOP 2 44 PIN
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Untitled
Abstract: No abstract text available
Text: H ig h P e rfo rm a n c e lMx4 CMOS DRAM A S4C 14400 h II , 1 1M x 4 CMOS DRAM fast page m ode Prelim inary inform ation Features • 1 0 2 4 r e f r e s h c y c le s , 1 6 m s r e f r e s h in te r v a l • O r g a n iz a t io n : 1 , 0 4 8 ,5 7 6 w o r d s x 4 b its
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o00oo
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Untitled
Abstract: No abstract text available
Text: CMOS STATIC RAM 1 MEG 128K x 8-BIT REVOLUTIONARY PINOUT PRELIMINARY IDT71124 In te g ra te d De v ic e T e ch n o lo g y, Inc. FEATURES: DESCRIPTION: • 128K x 8 advanced high-speed CMOS static RAM • JED E C revolutionary pinout (center power/G ND) for
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IDT71124
12/15/20ns
32-pin
IDT71124
576-bit
MO-061,
S5771
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s0324
Abstract: land pattern for TSOP idt IDT land pattern tsop 6
Text: CMOS STATIC RAM 1 MEG 128K x 8-BIT REVOLUTIONARY PINOUT PRELIMINARY IDT71124 In te g ra te d De v ic e T e ch n o lo g y, Inc. FEATURES: DESCRIPTION: • 128K x 8 advanced high-speed CMOS static RAM • JED E C revolutionary pinout (center power/G ND) for
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IDT71124
12/15/20ns
32-pin
576-bit
MO-061,
PSC-4033
s0324
land pattern for TSOP idt
IDT land pattern tsop 6
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Untitled
Abstract: No abstract text available
Text: H igh perform ance 128KX8 5 V CMOS Flash EEPROM H A S29F010 II 1 2 8 K X 8 CMOS Flash EEPROM Features • O r g a n iz a t io n : 12 8 K x 8 b its • JEDEC s ta n d a r d w r i t e c y c le c o m m a n d s - p ro te c ts da ta fro m accidental changes • S e c to r E rase a r c h ite c tu r e
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128KX8
S29F010
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woy transistor
Abstract: No abstract text available
Text: LOW POWER 2V CMOS SRAM 1 MEG 128KX 8-BIT ADVANCE INFORMATION IDT71T024L Integrated D e v ic e T e ch n o lo g y, Inc. FEATURES: DESCRIPTION: • • • • • • • The IDT71T024L is a 1,048,576-bit very low-pow er Static RAM organized as 1 2 8 K x 8 . It is fabricated using ID T’s highreliability CMOS technology. This state-of-the-art technology,
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128KX
IDT71T024L
150ns,
200ns
32-pin
IDT71T024L
576-bit
10-338-207Q
woy transistor
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Untitled
Abstract: No abstract text available
Text: LOW POWER 3V CMOS SRAM 1 MEG 128Kx 8-BIT ADVANCE INFORMATION IDT71V024L Integrated D e v ic e T e ch n o lo g y, Inc. FEATURES: DESCRIPTION: • • • • • • • The ID T71V024L is a 1,048,576-bit very low-pow er Static RAM organized as 1 2 8 K x 8 . It is fabricated using ID T’s highreliability CMOS technology. This state-of-the-art technology,
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128Kx
IDT71V024L
T71V024L
576-bit
10-338-207Q
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