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    LAND PATTERN FOR Search Results

    LAND PATTERN FOR Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    LAND PATTERN FOR Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    lqw04

    Abstract: LQW21H T4 0506 LQW2UA LQP02T MURATA LQW15A
    Text: RF Inductor Soldering and Mounting 1. Standard Land Pattern Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip inductor chip coil electrode. Land Pattern + Solder Resist Land Pattern


    Original     		PDF LQG15H LQG18H LQP02T LQP03T LQP15M LQP15M lqw04 LQW21H T4 0506 LQW2UA MURATA LQW15A

    ABM7

    Abstract: ABM3
    Text: Recommended Land Pattern 0.075 1.9 0.075 1.9 0.055 Max. 1.4 0.236±0.008 6.0±0.2 0.094 2.4 0.102 2.6 0.138±0.008 3.5±0.2 Connection Land pattern compatibility between ABM3 and ABM7 0.12 3.0 ABM7 0.079 2.0 0.031 0.8 ABM7 Recommended Land Pattern ABM3 ABM3 Recommended


    Original     		PDF

    130D

    Abstract: nichrome
    Text: Reflow soldering standard conditions Example 220—230°C within 10sec. 200°C ∆T The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC


    Original     		PDF 10sec. 130D nichrome

    Resistor

    Abstract: resistor network soldering-iron
    Text: Resistors Example of land pattern design Example of land pattern design FRectangular chip resistors MCR ✽Ensure that areas other than the solder land on the printed circuit surface is covered with solder resist. FNetwork chip resistor (MNR) 1 Resistors


    Original     		PDF

    MCR100

    Abstract: MVR32 MNR14 MCR01 MCR03 MCR10 MCR18 MCR25 MCR50 MNR02
    Text: Example of land pattern design Resistors Example of land pattern design !Rectangular chip resistors MCR ∗ Ensure that areas other than the solder land on the printed circuit surface is covered with solder resist. (Units : mm) MCR01 MCR03 / MCR10 / MCR18 / MCR25 / MCR50 / MCR100


    Original     		PDF MCR01 MCR03 MCR10 MCR18 MCR25 MCR50 MCR100 MCR10 MCR18 MCR25 MCR100 MVR32 MNR14 MCR01 MNR02

    SOD-323 land pattern

    Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
    Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern

    tssop 16 exposed pad stencil

    Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 tssop 16 exposed pad stencil C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782

    land pattern for SSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for


    Original     		PDF OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100

    C1316C

    Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
    Text: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface


    Original     		PDF IPC-SM-782. SC-70 10/02A C1316C LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10

    Solder paste volume

    Abstract: No abstract text available
    Text: HSDL-2XXX Surface Mount Technology Assembly Application Note 1138 Solder Pad, Mask and Metal Solder Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCBA Figure 1. Stencil and PCBA Recommended Land Pattern for HSDL-2XXX


    Original     		PDF 5966-3027E Solder paste volume

    Untitled

    Abstract: No abstract text available
    Text: LAND PATTERN AND SIZE CHIP TYPE ALUMINUM ELECTROLYTIC CAPACITORS Recommended land pattern and size Vertical chip type Standard type (Unit : mm) X Land Size Y W 2.2 0.8 1.0 2.6 3.0 1.4 3.6 1.9 3.6 1.9 2.1 4.0 ＊3.5 ＊3.0 ＊4.0 ＊4.0 6.0 4.0 Case Size


    Original     		PDF 2010/2011E

    bga socket

    Abstract: socket
    Text: GHZ BGA Socket direct mount - epoxy Assembly Instructions 1. Remove the tape backing from the bottom of the socket base. 2. Place the socket base to the target PCB around the BGA land pattern. 3. Align the BGA land pattern with the socket base cavity. 4. Press socket base firmly onto target board, supporting target PCB directly under the BGA land pattern.


    Original     		PDF

    flux NF-3000

    Abstract: LQH3ER H60A H63A LQW18A
    Text: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. LQH31M/31C/31H, LQW18A/2BH/31H Land Pattern Solder Resist c d b c a 2.5min. Series LQH31M/31C/31H


    Original     		PDF LQH31M/31C/31H, LQW18A/2BH/31H LQW18A LQW31H LQH31M/31C/31H LQP03T/15M/18M LQG15H/18H. MR-8153RA NF-3000 UVS-50R-2 flux NF-3000 LQH3ER H60A H63A LQW18A

    LGA land pattern

    Abstract: cases lga components
    Text: LGA LAND PATTERN DIMENSIONS b2 e b2 e P-FLGA Unit:mm Pin pitch Land Pattern Dimensions Remark e Land dimeter φ b 2 0.80 0.65 0.45 0.35 0.50 0.24 to 0.30 (The reference value) Only representative dimensions are inscribed above. As there are cases where the dimensions


    Original     		PDF

    LQH3ER

    Abstract: flux NF-3000 H60A H63A LQW18A H63A FLOW SOLDER
    Text: 2.0 LQH32Mxx11 LQH3ER 5.5 1.0 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. 1.0 1.0 1.0 5.5 1.0 2.0 LQH32Mxx21/32Cxx21 LQH3KS 1.0 1.3 1.0 Land Pattern


    Original     		PDF LQH32Mxx11 LQH32Mxx21/32Cxx21 LQP03T/15M/18M, LQG15H MR-8153RA NF-3000 UVS-50R-2 LQM18N LQM21N/21D/21F LQM31F LQH3ER flux NF-3000 H60A H63A LQW18A H63A FLOW SOLDER

    flux NF-3000

    Abstract: LQH3ER MURATA LQW18A transistor tip 31c LQW18A LQM31F 025030
    Text: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. a Land Pattern Solder Resist c b Series LQG15H LQG18H a b c 0.5-0.6 1.4-1.5 0.4 0.6-0.8 1.8-2.2


    Original     		PDF LQG18H LQG15H LQM18N LQM21N/21D/21F LQM31F LQP03T LQP15M LQP18M LQP03T/15M/18M LQG15H/18H. flux NF-3000 LQH3ER MURATA LQW18A transistor tip 31c LQW18A LQM31F 025030

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


    Original     		PDF IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern

    H60A

    Abstract: H63A
    Text: for reflow soldering Land Solder Resist NFE61P/61H Chip mounting side Back side Small diameter thru hole φ0.4— φ0.6 3.0 Connect to ground pattern of mounting side 1.6 2.6 3.0 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFp


    Original     		PDF NFE61P/61H H60A H63A

    land pattern for TSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,


    Original     		PDF OT-23 O-263 MA05A land pattern for TSOP TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100

    LQH3ER

    Abstract: MURATA LQW18A H60A H63A LQH43C LQH43M LQH43N LQW18A jis magnetic
    Text: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. LQH43M LQH43N LQH43C 1.5 3.0 7.5 1.5 1.5 1.5 Land Pattern Solder Resist in mm Solder : Use H60A,H63A JIS Z 3282 or equivalent.


    Original     		PDF LQH43M LQH43N LQH43C LQP03T/15M/18M LQG15H/18H. MR-8153RA NF-3000 LQH3ER MURATA LQW18A H60A H63A LQH43C LQH43M LQH43N LQW18A jis magnetic

    Untitled

    Abstract: No abstract text available
    Text: FAX# 408 944-0970 Recommended Land Pattern for MLF 2.5x2.8 17 Lead LP # MLF2528Q-17LD-LP-1 All units are in mm Tolerance ± 0.05 if not noted Disclaimer: This is only a recommendation based on information available to Micrel from its suppliers. Actual land pattern


    Original     		PDF MLF2528Q-17LD-LP-1 031306HC03

    land pattern for TSOP

    Abstract: land pattern for TSOP 2 land pattern for TSOP 2 50 TSOP 50 Package land pattern for tsop package
    Text: Recommended Land Pattern for SST TSOP Devices Recommended Land Pattern for SST TSOP Devices Application Note October 2001 INTRODUCTION Designing in the 8mm x 14mm TSOP Package SST offers an 8mm x 14mm TSOP package for our bulk erase, Byte-Program SuperFlash MTP products and the


    Original     		PDF S72015-02-000 land pattern for TSOP land pattern for TSOP 2 land pattern for TSOP 2 50 TSOP 50 Package land pattern for tsop package

    LPCC-16

    Abstract: recommended land pattern for soic qfn 32 land pattern LPCC16 ipc-SM-782 narrow body SOIC 8 pcb pattern Discrete Semiconductors qfn32 land pattern SOIC 8 pcb pattern SOIC 8 narrow body pcb pattern
    Text: GaAs RFICs and Modules Footprints Surface Mount Land Patterns Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface mount design and land pattern standard: IPC-SM-782.


    OCR Scan     		PDF IPC-SM-782. QFN-32 LPCC-16 recommended land pattern for soic qfn 32 land pattern LPCC16 ipc-SM-782 narrow body SOIC 8 pcb pattern Discrete Semiconductors qfn32 land pattern SOIC 8 pcb pattern SOIC 8 narrow body pcb pattern