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    G9230-01

    Abstract: KIRD1055E02 SE-171
    Text: PHOTODIODE InGaAs PIN photodiode G9230-01 Uses small package with no wire Features Applications l Easy to handle since there are no wires on chip AnSn eutectic bonding Optical fibers can be brought closer to the chip l Miniature package: 2 x 2 × 1 mm l High sensitivity: 0.95 A/W Typ. (λ=1.55 µm)


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    PDF G9230-01 SE-171 KIRD1055E02 G9230-01 KIRD1055E02

    InGaas PIN photodiode chip back illuminated

    Abstract: G9230-01 KIRD1055E02 SE-171
    Text: PHOTODIODE InGaAs PIN photodiode G9230-01 Back-illuminated type, uses package with no wire Features Applications l Back-illuminated type l Easy to handle since there are no wires on chip AnSn eutectic bonding Optical fibers can be brought closer to the chip


    Original
    PDF G9230-01 SE-171 KIRD1055E02 InGaas PIN photodiode chip back illuminated G9230-01 KIRD1055E02

    Untitled

    Abstract: No abstract text available
    Text: PHOTODIODE InGaAs PIN photodiode G9230-01 Back-illuminated type, uses package with no wire Features Applications l Back-illuminated type l Easy to handle since there are no wires on chip AnSn eutectic bonding Optical fibers can be brought closer to the chip


    Original
    PDF G9230-01 Spectr8152-3750, SE-171 KIRD1055E02

    Untitled

    Abstract: No abstract text available
    Text: PHOTODIODE InGaAs PIN photodiode G9230-01 Back-illuminated type, uses package with no wire Features Applications l Back-illuminated type l Easy to handle since there are no wires on chip AnSn eutectic bonding Optical fibers can be brought closer to the chip


    Original
    PDF G9230-01 Spectr8152-3750, SE-171 KIRD1055E02

    Untitled

    Abstract: No abstract text available
    Text: PHOTODIODE InGaAs PIN photodiode G9230-01 Back-illuminated type, uses package with no wire Features Applications l Back-illuminated type l Easy to handle since there are no wires on chip AnSn eutectic bonding Optical fibers can be brought closer to the chip


    Original
    PDF G9230-01 SE-171 KIRD1055E02