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    JESD22 A110 Search Results

    JESD22 A110 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ADPA1105ACGZN-R7 Analog Devices 1.2-1.4 GHz 35W GaN PA Visit Analog Devices Buy
    ADPA1105-EVALZ Analog Devices ADPA1105 Eval Board Visit Analog Devices Buy
    ADPA1107-EVALZ Analog Devices ADPA1107 Eval Board Visit Analog Devices Buy
    ADPA1107ACPZN Analog Devices 4.8 - 6.0 GHz 30W GaN PA Visit Analog Devices Buy
    ADPA1106ACGZN-R7 Analog Devices 2.7-3.5 GHZ,35W,GaN Radar PA Visit Analog Devices Buy

    JESD22 A110 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    JESD22-B105

    Abstract: JESD22-A110 JESD22-A108 PHYSICAL DIMENSIONS JESD22-B100 MIL-STD-883-2011 JESD22A110 JESD22A108 JESD22-B100 JESD22-A103 JESD22-A104
    Text: HOLT PLASTIC PACKAGE QUALIFICATION EXTERNAL VISUAL ENVIRONMENTAL TESTS ELECTRICAL TEST All Temperatures PRECONDITION STRESS JESD22-1A113 TEMP CYCLE (JESD22-A104) Sample size 45/0 HAST TEST (JESD22-A110) Sample size 45/0 HIGH TEMP OP LIFE (JESD22-A108) Sample size 45/0


    Original     		PDF JESD22-1A113) JESD22-A104) JESD22-A110) JESD22-A108) JESD22-A103) JESD22-B100) JESD22-B102) JESD22-B105) MIL-STD-883-2011) JESD22-B105 JESD22-A110 JESD22-A108 PHYSICAL DIMENSIONS JESD22-B100 MIL-STD-883-2011 JESD22A110 JESD22A108 JESD22-B100 JESD22-A103 JESD22-A104

    74AHC04PW

    Abstract: 74AHCU04 74AHCU04D 74AHCU04PW inverter astable Multivibrator 74
    Text: INTEGRATED CIRCUITS DATA SHEET 74AHCU04 Hex inverter Product specification Supersedes data of 1999 Feb 26 File under Integrated Circuits, IC06 1999 Sep 27 Philips Semiconductors Product specification Hex inverter 74AHCU04 FEATURES • ESD protection: HBM EIA/JESD22-A114-A


    Original     		PDF 74AHCU04 EIA/JESD22-A114-A EIA/JESD22-A115-A EIA/JESD22-C101 245002/02/pp16 74AHC04PW 74AHCU04 74AHCU04D 74AHCU04PW inverter astable Multivibrator 74

    JESD22-A10

    Abstract: JESD22-A11 JESD22A110 22-B102
    Text: RF F1633 Qualifica Q ation Rep port P Page 1 of 1 1633-PQ Q030[1], R Revision B Product Descriptio on Diffeerential DP3T SOI Switch Packa age Type Wiree-bonded QFN N, 2 x 2 x 0.5 m mm Proc cess Technollogy SOI Qualiffication # 11‐QU UAL‐1588


    Original     		PDF F1633 1633-PQ UAL1588 JESD22A1 JESD22A110, L-05-1049 JESD22-A10 JESD22-A11 JESD22A110 22-B102

    KSZ8895MQXCA

    Abstract: KSZ8895 mtbf
    Text: QUALIFICATION REPORT Date: 3/7/14 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ8895FQXCA/FQXIA KSZ8895MQXCA/MQXIA KSZ8895RQXCA/RQXIA Qual vehicle PACKAGE TYPE : ASSEMBLY FAB LOC PROCESS 128L QFP TICP DONGBU 0.11um KSZ8895MQXCA DONGBU 0.11 um : 15.7 FIT or MTBF= 6.37x10E7 device


    Original     		PDF KSZ8895FQXCA/FQXIA KSZ8895MQXCA/MQXIA KSZ8895RQXCA/RQXIA KSZ8895MQXCA 37x10E7 KSZ8895 M129V0511MNA JESD22-A108 JESD22 KSZ8895MQXCA KSZ8895 mtbf

    Untitled

    Abstract: No abstract text available
    Text: QUALIFICATION REPORT Date: 3/7/14 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ8864CNXCA/CNXIA/RMNU Qual vehicles KSZ8864RMNU rev B2 DONGBU 0.11 um : 15.7 FIT PACKAGE TYPE : ASSEMBLY FAB LOC PROCESS 64L MLF(QFN) TICP DONGBU 0.11um or MTBF= 6.37x10E7 device


    Original     		PDF KSZ8864CNXCA/CNXIA/RMNU KSZ8864RMNU 37x10E7 M129V051MNF JESD22-A108 JESD22 Delta65ï M1010

    MIL-STD-883 Method 3015.7

    Abstract: AN003 A112-A AN-003
    Text: Reliability Testing for LDMOS Devices used in Xemod QuikPAC Power Modules Standard Tests The LDMOS devices used in QuikPAC modules have successfully passed the tests listed below. DC Burn-In MIL-STD-750 Method 1042.3, Test Condition C. VDD = 26V; Tj = 175ºC; 1008 hours


    Original     		PDF MIL-STD-750 MIL-STD-883, EIA/JESD22 A11age MIL-STD-883 Method 3015.7 AN003 A112-A AN-003

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY REPORT DATE: 6/25/08 QUALITY ENG : PART NUMBER : MICREL QA/REL SY58609U QUAL VEHICLES: PACKAGE TYPE : SY58609U 16L MLF FAB ARRAY PROCESS MICREL GA SiGe ESD RATINGS LATCH-UP RATING FIT +/- 1500V HBM I/O Trigger @ 200 mA SiGe process: 1.1 FIT O/V @ ABS max Vcc or 1.5xVcc


    Original     		PDF SY58609U 25Gps 1000H 2000H 5A17128MEF 6A07615M02 0/77Pb-Free UL94V-0

    transistor 70603

    Abstract: 70603 a103 636 transistor 70603 scr JESD A114 A101 A102 A103 S/transistor 70603 JESD-22
    Text: SST Product Reliability Technical Paper 1.0 INTRODUCTION The SST quality policy is: To satisfy customer requirements by providing products and services that are cost effective, on schedule, and with zero nonconformances to specifications. SST is developing a quality system in accordance with


    Original     		PDF ISO-9001 29EE020/29LE020/29VE020 29EE010/29LE010/29VE010 29EE512/29LE512/29VE512 transistor 70603 70603 a103 636 transistor 70603 scr JESD A114 A101 A102 A103 S/transistor 70603 JESD-22

    JESD22-A117

    Abstract: TEP011 mar01 SCF384G APS3 SCM288G ISO7816 super harvard architecture block diagram flash "high temperature data retention" mechanism SST superflash
    Text: SCM288G Product Brief MAR014 - rev1 SCM288G ‐ Product Brief Trademark Starchip is a registered trademark of Starchip Company. This product uses SuperFlash® technology. Super Flash® is registered trademark of Silicon Storage Technology,


    Original     		PDF SCM288G MAR014 TEP009 SCF384G TEP011 SCM288G. SCF320G. JESD22-A117 mar01 APS3 SCM288G ISO7816 super harvard architecture block diagram flash "high temperature data retention" mechanism SST superflash

    JESD22-A117

    Abstract: SCM320G SCF384G super harvard architecture block diagram arc risc JESD47 ISO7816 iso7816 class c JESD-47 starchip
    Text: SCM320G Product Brief MAR014 - rev1 SCM320G ‐ Product Brief Trademark Starchip is a registered trademark of Starchip Company. This product uses SuperFlash® technology. Super Flash® is registered trademark of Silicon Storage Technology,


    Original     		PDF SCM320G MAR014 TEP001 SCF384G TEP010 SCM320G. SCF384G. JESD22-A117 SCM320G super harvard architecture block diagram arc risc JESD47 ISO7816 iso7816 class c JESD-47 starchip

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY REPORT DATE: 9/10/13 QUALITY ENG : PURPOSE: Micrel QA New Product Qual PART NUMBER NON-EEE VER PART NUMBER (EEE VER) PACKAGE TYPE KSZ8081RNDCA KSZ8081RNACA/IA KSZ8081MNXCA/IA KSZ8081RNBCA/IA KSZ8081MLXCA/IA KSZ8091RNDCA KSZ8091RNACA/IA KSZ8091MNXCA/IA


    Original     		PDF KSZ8081RNDCA KSZ8081RNACA/IA KSZ8081MNXCA/IA KSZ8081RNBCA/IA KSZ8081MLXCA/IA KSZ8091RNDCA KSZ8091RNACA/IA KSZ8091MNXCA/IA KSZ8091RNBCA/IA KSZ8091MLXCA/IA

    MICREL DATE CODE

    Abstract: No abstract text available
    Text: RELIABILITY REPORT DATE: 5/20/09 QUALITY ENG : PART NUMBER : MICREL QA/REL SY58018UMG QUAL VEHICLES: PACKAGE TYPE : SY58018UMG 16L MLF FAB ARRAY PROCESS MICREL GL SiGe ESD RATINGS LATCH-UP RATING FIT +/- 500V ESD-HBM I/O Trigger @ 200 mA SiGe process: 1.0 FIT


    Original     		PDF SY58018UMG 1000H 2000H 3A44764MED 6A11218M12 UL94V-0 MICREL DATE CODE

    Reliability

    Abstract: No abstract text available
    Text: Quality/Reliability Certifications ANSI/ESD S.20.20 As an industry leader, Skyworks has demonstrated its quality leadership and strengthened its commitment to customer satisfaction through formal, third-party registration to ISO 9001, ISO/TS 16949 and ANSI/ESD S.20.20.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: High-Performance/High-Reliability Semiconductor Discrete Devices Proven Performance and Leadership As a world-class supplier of RF microwave components for today’s wireless communication systems, Skyworks continues to deliver the highest performance Silicon and GaAs discrete products. Building


    Original     		PDF BRO383-11B

    EIA/JEDEC JESD22-A110-B

    Abstract: JESD22-A117 JESD22 JESD22a117
    Text: Reliability Study AMD MirrorBit RELIABILITY STUDY White Paper OVERVIEW The MirrorBit™ cell is a breakthrough in NOR Flash memory cell architecture that enables a Flash memory product to hold twice as much data as standard Flash, without compromising device endurance, performance


    Original     		PDF 5M-11/02-0 6203A EIA/JEDEC JESD22-A110-B JESD22-A117 JESD22 JESD22a117

    tsmc cmos 0.13 um sram

    Abstract: TSMC 90nm sram ford ppap EMMI microscope TSMC 0.13um process specification PPAP MANUAL for automotive industry Kyocera mold compound semiconductors cross index ISO 9001 Sony foundry metals quality MANUALS
    Text: Integrated Silicon Solution Inc 2012 Q Quality y and Reliability Manual Contents Content Page Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2008 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning


    Original     		PDF

    PRF38534

    Abstract: MIL-PRF-38534 d452 TRANSISTOR equivalent d331 TRANSISTOR equivalent EQUIVALENT transistor D446 d472 TRANSISTOR equivalent D471 TRANSISTOR equivalent EQUIVALENT transistor D446 SMD transistor D613 equivalent transistor D331 circuit diagram application
    Text: INCH-POUND This document and process conversion measures necessary to comply with this revision shall be completed by 13 March 2011 MIL-PRF-38534H 13 September 2010 SUPERSEDING MIL-PRF-38534G 9 March 2009 PERFORMANCE SPECIFICATION HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR


    Original     		PDF MIL-PRF-38534H MIL-PRF-38534G 38534H PRF38534 MIL-PRF-38534 d452 TRANSISTOR equivalent d331 TRANSISTOR equivalent EQUIVALENT transistor D446 d472 TRANSISTOR equivalent D471 TRANSISTOR equivalent EQUIVALENT transistor D446 SMD transistor D613 equivalent transistor D331 circuit diagram application

    ecu bosch 7.4.4

    Abstract: tle 4417 ecu bosch 7.4.5 smd transistor wk3 tle4417 sen 1327 gas sensor ecu bosch 7.4.6 bosch ecu schematic ecu bosch 7.4.3 bosch ecu pinout
    Text: D a t a B o o k, R e v . 1 . 0, J a n . 20 0 4 Supply & Communications V o l t a g e R eg u l a t o r , L E D - D r i v e r , DC/DC-Converter, Bus-Transceiver Automotive Power N e v e r s t o p t h i n k i n g . Edition 2004-01-01 Published by Infineon Technologies AG,


    Original     		PDF non-100% ecu bosch 7.4.4 tle 4417 ecu bosch 7.4.5 smd transistor wk3 tle4417 sen 1327 gas sensor ecu bosch 7.4.6 bosch ecu schematic ecu bosch 7.4.3 bosch ecu pinout

    MICROWAVE ASSOCIATES ISOLATOR

    Abstract: AS218 transistor
    Text: Semiconductor Discretes for RF-Microwave Applications Skyworks Solutions Skyworks Solutions, Inc. is an innovator of high-performance analog and mixed-signal semiconductors enabling mobile connectivity. The company’s power amplifiers, front-end modules and


    Original     		PDF CAT501-09A MICROWAVE ASSOCIATES ISOLATOR AS218 transistor

    X0838

    Abstract: X0910 MICRO CHIP X0848 Oscillator CQE 3RW29 08D0 WQ epson tx 121 circuit diagram vl15p 16K4 infiniband PHY
    Text: IBM PCI-X to InfiniBand Host Channel Adapter Datasheet Product Level 3.0 October 14, 2002  Copyright and Disclaimer  Copyright International Business Machines Corporation 2002 All Rights Reserved Printed in the United0l States of America October 2002.


    Original     		PDF 64-byte 32-bits X0838 X0910 MICRO CHIP X0848 Oscillator CQE 3RW29 08D0 WQ epson tx 121 circuit diagram vl15p 16K4 infiniband PHY