tray bga
Abstract: BGA22 JEDEC TRAY DIMENSIONS FBGA 60 JEDEC FBGA tray datasheet bga nec 2222 FBGA 320
Text: TRAY CONTAINER UNIT : mm NEC 7 135°C MAX. 22.35 26.30 105.2 BGA22x22ESP A' 15.35 22.35 25.80 283.8 15.60 315.0 322.6 Section A – A' 22.35 (5.52) (6.35) 22.00 7.62 135.9 5×12=60 PPE A Applied Package Quantity (pcs) Tray BGA 22×22 ESP 320-pin Plastic BGA (22×22)
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BGA22
22ESP
320-pin
345-pin
385-pin
389-pin
429-pin
SSD-A-H6973-4
tray bga
JEDEC TRAY DIMENSIONS FBGA 60
JEDEC FBGA
tray datasheet bga
nec 2222
FBGA 320
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K9F2G08U0C
Abstract: K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0
Text: Product Selection Guide Samsung Semiconductor, Inc. Memory & Storage 2H 2010 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM
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BR-10-ALL-001
K9F2G08U0C
K9K8G08U0D
K9ABG08U0A
K4X2G323PC
K9F4G08U0B-PCB0
K9F1G08U0C
K9F2G08U0B
K9F2G08U0B-PCB0
K9F1G08U0D-SCB0
K9WBG08U1M-PIB0
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daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
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CSP JEDEC tray
Abstract: JEDEC TRAY DIMENSIONS FBGA 60
Text: HEAT PROOF 7 A' 11.95 8.20 11x16=176 135°C MAX PPE 119.5 A NEC CSP 7.8×14.8×0.8 135.9 UNIT : mm 7.98 14.91 19.40 291.0 12.00 315.0 322.6 SECTION A-A' 6.57 (6.35) 7.62 14.91 Applied Package Quantity (pcs) 60-pin • Plastic FBGA (7.83×14.76) MAX. 176
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60-pin
CSP JEDEC tray
JEDEC TRAY DIMENSIONS FBGA 60
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K9HDG08U1A
Abstract: K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe
Text: Product Selection Guide LCD, Memory and Storage - 1H 2011 Samsung Semiconductor, Inc Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks
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BR-11-ALL-001
K9HDG08U1A
K9LCG08U0A
k4g10325fe-hc04
KLM2G1DEHE-B101
K9WAG08U1B-PIB0
k9gag08u0e
Ltn140at
SAMSUNG HD502HJ
hd204ui
klm2g1dehe
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samsung ddr3 ram MTBF
Abstract: KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd
Text: PRODUCT SELECTION GUIDE LCD, Memory and Storage | 1H 2012 + Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks
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BR-12-ALL-001
samsung ddr3 ram MTBF
KLM2G1HE3F-B001
KLM4G1FE3B-B001
KLMAG2GE4A-A001
k4B2G1646
KLMAG
KLM8G2FE3B-B001
K4B2G0446
klm8g
k4x2g323pd
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K4X2G323PD8GD8
Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
Text: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from
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BR-12-ALL-001
K4X2G323PD8GD8
K9HFGY8S5A-HCK0
K4H511638JLCCC
samsung eMMC 5.0
KLMBG4GE2A-A001
K9K8G08U0D-SIB0
K4X51163PK-FGD8
KLMAG2GE4A
k4h561638n-lccc
K4G10325FG-HC03
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IC 50061
Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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K9F2G08U0B
Abstract: K9HCG08U1M-PCB0 K9NCG08U5M-PCB0 K9F1G08U0C K9F4G08U0B-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M K9F1G08U0C-PCB0 K9G4G08U0B
Text: Samsung Semiconductor, Inc. Product Selection Guide Memory and Storage January 2009 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM
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BR-09-ALL-001
K9F2G08U0B
K9HCG08U1M-PCB0
K9NCG08U5M-PCB0
K9F1G08U0C
K9F4G08U0B-PCB0
K9F2G08U0B-PCB0
K9F4G08U0B
K9WBG08U1M
K9F1G08U0C-PCB0
K9G4G08U0B
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LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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Untitled
Abstract: No abstract text available
Text: MR4A08B FEATURES 2M x 8 MRAM Memory • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP2 packages
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MR4A08B
20-years
AEC-Q100
MR4A08B
216-bit
EST00356
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MR4A08BMYS35
Abstract: No abstract text available
Text: MR4A08B FEATURES 2M x 8 MRAM Memory • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP2 packages
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MR4A08B
20-years
AEC-Q100
MR4A08B
216-bit
EST00356
MR4A08BMYS35
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Untitled
Abstract: No abstract text available
Text: MR4A08B FEATURES 2M x 8 MRAM Memory • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP2 packages
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MR4A08B
20-years
MR4A08B
216-bit
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DS90CF365
Abstract: DS90C385MTD DS90CF365MTD DS90C385 DS90C385SLCX
Text: DS90C385/DS90C365 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link-85 MHz, +3.3V Programmable LVDS Transmitter 18-Bit Flat Panel Display (FPD) Link-85 MHz General Description The DS90C385 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.
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DS90C385/DS90C365
24-Bit
Link-85
18-Bit
DS90CF365
DS90C385MTD
DS90CF365MTD
DS90C385
DS90C385SLCX
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Untitled
Abstract: No abstract text available
Text: DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—85 MHz General Description The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/
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DS90CF386/DS90CF366
24-Bit-Color
Link--85
18-Bit-Color
24-Bit
18-Bit
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Untitled
Abstract: No abstract text available
Text: DS90CF384A/DS90CF364A +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—65 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—65 MHz General Description The DS90CF384A receiver converts the four LVDS data streams (Up to 1.8 Gbps throughput or 227 Megabytes/sec
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DS90CF384A/DS90CF364A
24-Bit-Color
Link--65
18-Bit-Color
24-Bit
18-Bit
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90CF386
Abstract: No abstract text available
Text: DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—85 MHz General Description The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/
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DS90CF386/DS90CF366
24-Bit-Color
Link--85
18-Bit-Color
24-Bit
18-Bit
90CF386
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2dp3
Abstract: CBTV4010 ICS3840BLF ICS83840B ICS83840BH ICS83840BHLF ICS83840BHLFT ICS83840BHT 4318C tsa11
Text: ICS83840B Integrated Circuit Systems, Inc. DDR SDRAM MUX GENERAL DESCRIPTION FEATURES The ICS83840B is a DDR SDRAM MUX and is ICS a member of the HiPerClockS family of High HiPerClockS™ Performance Clock Solutions from ICS. The device has 10 Host Lines and each host line can
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ICS83840B
ICS83840B
83840BH
2dp3
CBTV4010
ICS3840BLF
ICS83840BH
ICS83840BHLF
ICS83840BHLFT
ICS83840BHT
4318C
tsa11
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90CF364
Abstract: No abstract text available
Text: DS90CF384A/DS90CF364A +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—65 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—65 MHz General Description The DS90CF384A receiver converts the four LVDS data streams (Up to 1.8 Gbps throughput or 227 Megabytes/sec
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DS90CF384A/DS90CF364A
24-Bit-Color
Link--65
18-Bit-Color
24-Bit
18-Bit
90CF364
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
MIL-M-38510
MIL-STD-883
LGA 1156 PIN OUT diagram
QSJ-44403
LGA 1150 Socket PIN diagram
LGA 1155 Socket PIN diagram
IC107-26035-20-G
LGA 1151 PIN diagram
REFLOW lga socket 1155
IC107-3204-G
TB 2929 H alternative
LGA 1155 pin diagram
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smd transistor M7A
Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages
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PD41265L-12-E1
PD41256L
PD23C32000AGX-$
PD23C32000A
smd transistor M7A
ED-7304-1
smd m7a
uPD4011BG
ED730
EIA and EIAJ tape standards
ED-7417
EIA and EIAJ standards
ED-7409
IEC-Publication-747
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