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    JEDEC TRAY 10 X 10 Search Results

    JEDEC TRAY 10 X 10 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TMP139AIYAHR Texas Instruments JEDEC DDR5 temperature sensor with 0.5 °C accuracy 6-DSBGA -40 to 125 Visit Texas Instruments Buy
    SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments
    SN74SSQEB32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQEC32882ZALR Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    CAB4AZNRR Texas Instruments DDR4RCD01 JEDEC compliant DDR4 Register for RDIMM and LRDIMM operation up to DDR4-2400 253-NFBGA 0 to 0 Visit Texas Instruments Buy

    JEDEC TRAY 10 X 10 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PGA weight

    Abstract: NEC 1169
    Text: Packing Name NEC Tray LA-A76 JEDEC Tray PGA 20x20 447 pin Ceramic PGA Metal Slug A V W2 (Bottom View) X D P W1 Q 2-10-32UNF 2-M3 R S I J Index mark H G N E K L φM M F X447RP-50A NOTE Each lead centerline is located within φ 0.254 mm ( φ 0.010 inch) of its true position (T.P.) at


    Original     		PDF LA-A76 2-10-32UNF X447RP-50A PGA weight NEC 1169

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


    Original     		PDF

    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


    Original     		PDF CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray

    Untitled

    Abstract: No abstract text available
    Text: OGN-SMD Fuseholder Blocks & Clips www.schurter.com/pg02b Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1 250 VAC • 4 W / 10 A VDE · 500 VAC/DC · 10 A (UL/CSA) Description Applications - For appliances in unattended use - Glow wire tests acc. to IEC 60695-2-12 and -13


    Original     		PDF com/pg02b

    TB-2082

    Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
    Text: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02


    Original     		PDF TB-2082 28mil TB-2082 TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS

    2N6284G

    Abstract: 2N6287G 2N6284 2N6286 2N6286G 2N6287 JEDEC tray dimension
    Text: 2N6284 NPN ; 2N6286, 2N6287 (PNP) Preferred Device Darlington Complementary Silicon Power Transistors These packages are designed for general−purpose amplifier and low−frequency switching applications. Features • High DC Current Gain @ IC = 10 Adc −


    Original     		PDF 2N6284 2N6286, 2N6287 2N6286 2N6284/87 O-204AA 2N6284G 2N6287G 2N6284 2N6286 2N6286G 2N6287 JEDEC tray dimension

    Teradyne connector

    Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
    Text: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight


    Original     		PDF TB-2082 Teradyne connector 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne

    Miralloy

    Abstract: C08T311ST rotary coded switch 10 positions SMT rotary coded switch 16 positions SMT smt rotary switch JEDEC SMT reflow profile C08T121ST
    Text: Coded Switch Type C08 16 positions gray coding Excellent indexing feel with 2.5 Ncm switching torque remains consistent over life 9 x 9 x 10 mm body size Lowest profile PCB to shaft center line: 4.65 mm SMT reflow version available 20,000 switching cycles


    Original     		PDF C08RINGTL Miralloy C08T311ST rotary coded switch 10 positions SMT rotary coded switch 16 positions SMT smt rotary switch JEDEC SMT reflow profile C08T121ST

    Miralloy

    Abstract: No abstract text available
    Text: Coded Switch Type C08 16 positions gray coding Excellent indexing feel with 2.5 Ncm switching torque remains consistent over life 9 x 9 x 10 mm body size Lowest profile PCB to shaft center line: 4.65 mm SMT reflow version available 20,000 switching cycles


    Original     		PDF C08RINGTL Miralloy

    JEP95 MS-028

    Abstract: No abstract text available
    Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm


    Original     		PDF SMM5146XZ 10dBm SMM5146XZ JEP95 MS-028

    Untitled

    Abstract: No abstract text available
    Text: Coded Switch Type C08 16 positions gray coding Excellent indexing feel with 2.5 Ncm switching torque remains consistent over life 9 x 9 x 10 mm body size Lowest profile PCB to shaft center line: 4.65 mm SMT reflow version available 20,000 switching cycles


    Original     		PDF C08RINGTL

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL
    Text: 39.57 135°C MAX 77.46 29.22 135.9 OT-007TM-01 UNIT : mm A 50.56 31.10 A' 39.57 252.8 315 322.6 <SECTION A - A'> 4.12 6.35 7.62 39.57 48.8 Tray OT-007TM-01 (JEDEC Tray) Material Carbon PPO Heat Proof Temp. Surface resistance 135°C 12 less than 1 x 10 Ω /


    Original     		PDF OT-007TM-01 JEDEC TRAY DIMENSIONS JEDEC tray standard OT-007TM-01 JEDEC tray QFP JEDEC tray JEDEC tray standard 10 TRAY MATERIAL

    Untitled

    Abstract: No abstract text available
    Text: www.we-online.com PLCC Socket WR-PLCC 10 09/08 10-1 www.we-online.com PLCC Socket WR-PLCC In the past IC socket were normally mounted on a PCB but upgrade and replacements were not so easy to make, that’s why PLCC socket became so popular. PLCC sockets are soldered to the plated through holes or to the SMT layout on a PCB,


    Original     		PDF UL94-V0

    Untitled

    Abstract: No abstract text available
    Text: Coded Switch Type C08 16 positions gray coding Excellent indexing feel with 2.5 Ncm switching torque remains consistent over life 9 x 9 x 10 mm body size Lowest profile PCB to shaft center line: 4.65 mm SMT reflow version available 20,000 switching cycles


    Original     		PDF C08RINGTL

    tray datasheet bga

    Abstract: jedec tray BGA
    Text: TRAY CONTAINER UNIT : mm A' 7 150° C MAX. 41.45 BGA50 x 50A 50.15 53.00 51.50 50.15 NEC 53.00 135.9 2 × 5=10 PPE A 212.0 315.0 322.6 SECTION A-A' 8.10 8.50 11.50 50.15 Applied Package Quantity (pcs) 2209-pin Plastic BGA (50×50) (FLIP CHIP TYPE) 10 MAX.


    Original     		PDF BGA50 2209-pin BGA50 SSD-A-H7711 tray datasheet bga jedec tray BGA

    Untitled

    Abstract: No abstract text available
    Text: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Balｌ • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm


    Original     		PDF SMM5142XZ SMM5142XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm


    Original     		PDF SMM5139XZ SMM5139XZ

    1152 BGA tray

    Abstract: tray datasheet bga jedec bga tray tray bga 117-pin JEDEC tray standard JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER 135° C MAX. A 10.5 12.80 10.35 FBGA14 x 10 ESP NEC 115.2 135.9 PPE 10 × 18=180 UNIT : mm A' 14.5 17.10 12.15 290.7 315.0 322.6 SECTION A-A' 14.50 (5.97) (5.62) 7.62 14.00 Applied Package 117-pin Plastic BGA (14×10) Quantity (pcs) 180 MAX.


    Original     		PDF FBGA14 117-pin FBGA14 SSD-A-H7531 1152 BGA tray tray datasheet bga jedec bga tray tray bga JEDEC tray standard JEDEC TRAY DIMENSIONS

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET CODED SWITCH TYPE C08 MAIN FEATURES MINIATURE DESIGN, COST EFFECTIVE › Gray coding 16 positions › Switching mode: Shorting › Excellent indexing feel with 2.5 Ncm switching torque remains consistent over life › Body size 9 x 9 x 10 mm › Lowest profile PCB to shaft center line: 4.65 mm


    Original     		PDF C08RINGTL

    tqfp 7x7 tray

    Abstract: DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10
    Text: 12_ I_ y _ I_ 10_ I_9_ I_ 8_ I_7_ I_ 6_ I_ 5_ I_4_ I_ 3_ I_2_ I_1


    OCR Scan     		PDF A40553. A40626. tqfp 7x7 tray DAEWON tray drawing DAEWON JEDEC TRAY tray drawing tqfp 7x7 daewon 7x7 DAEWON JEDEC TRAY 10 X 10 TQFP Shipping Trays shipping tray daewon 7x7 1.0T JEDEC TRAY 10 X 10

    DAEWON JEDEC TRAY 10 X 10

    Abstract: DAEWON JEDEC TRAY DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing DAEWON drawing daewon tray 41AL daewon JEDEC TRAY 10 X 10
    Text: M IE APPROVED 06/85/99 SB KVMC — 6.35 rx l /“ SEE DETAIL 'D' 10.20 0 a zq O.gQWlAlXj — 7.62 in 311.15- • +0.25 -0.13 - 132.08- -I +0.25 -0.13 +0.25 -0.13 311.66 -■ +0.25 -0.13 - 132.59- - 0.20(H lA|xq <IH0.20 (R) 1A1Z (R) 92.1 SECTIDN 'X-X*


    OCR Scan     		PDF 30\MH 0X45\M DAEWON JEDEC TRAY 10 X 10 DAEWON JEDEC TRAY DAEWON JEDEC TRAY CABGA 7 X 7 DAEWON tray drawing DAEWON drawing daewon tray 41AL daewon JEDEC TRAY 10 X 10

    DAEWON tray drawing

    Abstract: daewon 7x7 DAEWON JEDEC TRAY IA7 B DAEWON JEDEC TRAY 10 X 10 KY 717 atmel 717 daewon tray 7x7 atmel 367 daewon CABGA
    Text: MIE APPROVAL 02/24/98 KY KW SEE DETAIL 'D' — 6.35 ►0.20 0 A Xd •0.20(0) A ZQ — 7.62 - 311.15-+0.25 -0.13 -132.08- +0.25 -0.13 +0.25 -0.13 - 311.66 - - +0.25 -0.13 - 132.59 - - ^10.20(0)1 A| X(R)| •0-10.20(0)1A|Z(0)| 135.9 92.1 SECTIDN


    OCR Scan     		PDF 12C-0707 JCL-0707-1 DAEWON tray drawing daewon 7x7 DAEWON JEDEC TRAY IA7 B DAEWON JEDEC TRAY 10 X 10 KY 717 atmel 717 daewon tray 7x7 atmel 367 daewon CABGA