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    JEDEC TRAY 10 X 10 Search Results

    JEDEC TRAY 10 X 10 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    TMP139AIYAHR Texas Instruments JEDEC DDR5 temperature sensor with 0.5 °C accuracy 6-DSBGA -40 to 125 Visit Texas Instruments Buy
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation

    JEDEC TRAY 10 X 10 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TB-2082

    Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
    Text: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02


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    PDF TB-2082 28mil TB-2082 TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS

    JEP95 MS-028

    Abstract: No abstract text available
    Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm


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    PDF SMM5146XZ 10dBm SMM5146XZ JEP95 MS-028

    Untitled

    Abstract: No abstract text available
    Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm


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    PDF SMM5139XZ SMM5139XZ

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


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    PDF March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing

    JESD51-2

    Abstract: exposed QFP 144 100L JESD51-7 Techpoint
    Text: MQFP-ed Exposed Drop-in Heat Slug Metric Quad Flat Pack • 14 x 20mm to 32 x 32mm • 100 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 20mm to 32 x 32mm STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad


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    PDF

    RND02ZGE

    Abstract: RNS02ZG RNS03ZE
    Text: RN SERIES Jan, 2001 48Vinput Various outputs 10W Low Profile SMD DC-DC Converter Wide input voltage range 36-75V DC Single and dual output voltages 1500 V DC I/O electric strength test LGA • • • • • Remote control input Short circuit and overload protection


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    PDF 48Vinput 6-75V availa30 RND02ZGE RNS02ZG RNS03ZE

    Untitled

    Abstract: No abstract text available
    Text: date 03/13/2014 page 1 of 30 SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS GENERAL CHARACTERISTICS FEATURES • • • • • • • industry standard eighth-brick 58.4 x 22.7 x 10.2 mm 2.299 x 0.894 x 0.402 in • industry-leading power density for


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    PDF 75Vin

    E94661

    Abstract: GBPC35 GBPC3506
    Text: SPICE MODEL: GBPC3506 GBPC35005/W - GBPC3510/W 35A GLASS PASSIVATED BRIDGE RECTIFIER Features • · · · · · · · Glass Passivated Die Construction · Lead Free Finish, RoHS Compliant Note 4 GBPC Diffused Junction H Low Reverse Leakage Current B Low Power Loss, High Efficiency


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    PDF GBPC3506 GBPC35005/W GBPC3510/W HPC35005/W GBPC35005 100/Tray GBPC3501 GBPC3502 E94661 GBPC35 GBPC3506

    Untitled

    Abstract: No abstract text available
    Text: Atmel SAM D20J / SAM D20G / SAM D20E ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel SAM D20 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and


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    PDF 32-bit 64-pins 256KB 48MHz

    MXO45HS

    Abstract: mxo45 application notes MXO45 PEAK tray drawing
    Text: MXO45/MXO45HS METAL DIP CLOCK OSCILLATOR FEATURES • • • • • • • • • Standard 14 Pin or 8 Pin DIP Footprint HCMOS/TTL Compatible Fundamental and 3RD Overtone Crystals Frequency Range 1.0 – 105.561 MHz Frequency Stability, ±50 ppm Standard


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    PDF MXO45/MXO45HS MXO45/MXO45HS 2x10-8 J-STD-020. MXO45HS mxo45 application notes MXO45 PEAK tray drawing

    MSOP-14

    Abstract: No abstract text available
    Text: EPH2R0030 [ 1] Electrical Specification Output Side Ta − 40 ~ 85 °C Vi 36 ~75 V Characteristics Vo Io Output Conditions Vi = 48 V Typ. Max. 1.9 2.0 2.1 V Output Voltage Initial Setting Ta = 25°C Io = 0~3 A Line Regulation Io = 3 A Vi = 36~75 V  10 


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    PDF EPH2R0030 MSOP-14

    jedec MS-026 ABA

    Abstract: ICS83210AYT MS-026 CY2HH8110 ICS83210 ICS83210AY ICS83210AYLF idt cross TQFP JEDEC tray JEDEC tray standard TQFP
    Text: ICS83210 LOW SKEW, 1-TO-10 HSTL FANOUT BUFFER GENERAL DESCRIPTION FEATURES The ICS83210 is a low skew, 1-to-10 HSTL Fanout ICS Buffer and a member of the HiPerClockS Family HiPerClockS™ of High Performance Clock Solutions from IDT. The class II HSTL outputs are balanced push-pull


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    PDF ICS83210 1-TO-10 ICS83210 150MHz 110ps 199707558G jedec MS-026 ABA ICS83210AYT MS-026 CY2HH8110 ICS83210AY ICS83210AYLF idt cross TQFP JEDEC tray JEDEC tray standard TQFP

    Untitled

    Abstract: No abstract text available
    Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: NYLON 66 MAX TEMPERATURE: 220°C 10 S COLOR: WHITE CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: TIN QUALITY CLASS: 25 MATING CYCLES PITCH: 4.20MM A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 105°C


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    PDF UL94-V2 E323964 649-1R 31-AUG-10 31-OCT-07

    tray lqfp

    Abstract: JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
    Text: ARM-based Flash MCU SAM4S Series SUMMARY DATASHEET Description The Atmel SAM4S series is a member of a family of Flash microcontrollers based on the high-performance 32-bit ARM Cortex ® -M4 RISC processor. It operates at a maximum speed of 120 MHz and features up to 2048 Kbytes of Flash, with optional


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    PDF 32-bit tray lqfp JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN

    J020D-STD

    Abstract: JEDEC tray dimension JEDEC TRAY 10 X 10 21 x 14 tray
    Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: NYLON 46 COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: GOLD QUALITY CLASS: 3 AS PER CECC 75 301-802 PITCH: 2.54MM A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 125°C


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    PDF UL94-V0 23-NOV-07 12-DEC-06 06-NOV-06 610-SMT E323964 J020D-STD JEDEC tray dimension JEDEC TRAY 10 X 10 21 x 14 tray

    Untitled

    Abstract: No abstract text available
    Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • 10dB Conversion Gain • 2.5dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3


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    PDF SMM5139XZ SMM5139XZ

    Untitled

    Abstract: No abstract text available
    Text: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • 10dB Conversion Gain • 2.6dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3


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    PDF SMM5142XZ SMM5142XZ

    0853.12

    Abstract: J-STD-020-C JEDEC J-STD-020c J-STD-020C TRAY JEDEC j-std-033c
    Text: OGN-SMD Fuseholder Blocks & Clips www.schurter.com/pg02b Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1 250 VAC • 4 W / 10 A VDE · 500 VAC/DC · 10 A (UL/CSA) Description Applications - For appliances in unattended use


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    PDF com/pg02b W/10A 500VAC/DC E39328 0853.12 J-STD-020-C JEDEC J-STD-020c J-STD-020C TRAY JEDEC j-std-033c

    Untitled

    Abstract: No abstract text available
    Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: NYLON 66 FLAMABILITY RATING: UL94-V0 MAX TEMPERATURE: 220°C 10 S COLOR: WHITE CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: TIN QUALITY CLASS: 25 MATING CYCLES PITCH: 4.20MM A


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    PDF UL94-V0 23-AVR-09 31-MAR-09 12-NOV-08 22-FEB-07 30-JUN-06

    JEDEC tray standard dimension

    Abstract: No abstract text available
    Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: PBT FLAMABILITY RATING: UL94-V0 COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: GOLD QUALITY CLASS: 3 AS PER CECC 75 301-802 PITCH: 2.54MM A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 125°C


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    PDF UL94-V0 E323964 612-212-R 15-MAR- 612-R JEDEC tray standard dimension

    LQFP-48 thermal pad

    Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
    Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /


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    Untitled

    Abstract: No abstract text available
    Text: SUPPLEM ENT Am29F200A Known Good Die AMD3 2 Megabit 256 K x 8-Bit/128 K x 16-Bit CMOS 5.0 Volt-only, Sectored Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS • 5.0 V ± 10% for read and write operations — Minimizes system level power requirements


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    PDF Am29F200A 8-Bit/128 16-Bit)

    CS19AFDS

    Abstract: No abstract text available
    Text: SU PPLEM ENT Am29F100 Known Good Die 1 Megabit 128 K x 8-Bit/64 K x 16-Bit CMOS 5.0 Volt-only, Boot Sector Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS • Single power supply operation — 5.0 V ± 10% for read, erase, and program operations


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    PDF Am29F100 8-Bit/64 16-Bit) CS19AFDS

    known good die AMD

    Abstract: No abstract text available
    Text: SU PPLEM EN T Am29F200B Known Good Die AMDH 2 Megabit 256 K x 8-Bit/128 K x 16-Bit CMOS 5.0 Volt-only, Sectored Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS • 5.0 V ± 10% fo r read and w rite o perations — Minimizes system level power requirements


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    PDF Am29F200B 8-Bit/128 16-Bit) Am29F200A CS39S known good die AMD