TB-2082
Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
Text: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02
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TB-2082
28mil
TB-2082
TB208
470-2075-100
reballing
programming smt machine
470-1075-100
470-3105-100
programming for smt machine
C-471-1025-500
Amphenol MIL CIRCULAR CONNECTORS
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JEP95 MS-028
Abstract: No abstract text available
Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5146XZ
10dBm
SMM5146XZ
JEP95 MS-028
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Untitled
Abstract: No abstract text available
Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5139XZ
SMM5139XZ
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HT 1200-4
Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher
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March/98
intern844-347360
HT 1200-4
IC51-2084-1052-11
IC51-0242-1341
YAMAICHI ic234
transistor fpq 630
IC51-0404-1511
fpq-144-0.5-03
648-0482211-A01
IC189 Series Open Top SOP, SSOP, TSOP Type I a
HLQFP 176 Package drawing
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JESD51-2
Abstract: exposed QFP 144 100L JESD51-7 Techpoint
Text: MQFP-ed Exposed Drop-in Heat Slug Metric Quad Flat Pack • 14 x 20mm to 32 x 32mm • 100 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 20mm to 32 x 32mm STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad
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RND02ZGE
Abstract: RNS02ZG RNS03ZE
Text: RN SERIES Jan, 2001 48Vinput Various outputs 10W Low Profile SMD DC-DC Converter Wide input voltage range 36-75V DC Single and dual output voltages 1500 V DC I/O electric strength test LGA • • • • • Remote control input Short circuit and overload protection
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48Vinput
6-75V
availa30
RND02ZGE
RNS02ZG
RNS03ZE
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Untitled
Abstract: No abstract text available
Text: date 03/13/2014 page 1 of 30 SERIES: NEB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS GENERAL CHARACTERISTICS FEATURES • • • • • • • industry standard eighth-brick 58.4 x 22.7 x 10.2 mm 2.299 x 0.894 x 0.402 in • industry-leading power density for
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75Vin
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E94661
Abstract: GBPC35 GBPC3506
Text: SPICE MODEL: GBPC3506 GBPC35005/W - GBPC3510/W 35A GLASS PASSIVATED BRIDGE RECTIFIER Features • · · · · · · · Glass Passivated Die Construction · Lead Free Finish, RoHS Compliant Note 4 GBPC Diffused Junction H Low Reverse Leakage Current B Low Power Loss, High Efficiency
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GBPC3506
GBPC35005/W
GBPC3510/W
HPC35005/W
GBPC35005
100/Tray
GBPC3501
GBPC3502
E94661
GBPC35
GBPC3506
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Untitled
Abstract: No abstract text available
Text: Atmel SAM D20J / SAM D20G / SAM D20E ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel SAM D20 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and
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32-bit
64-pins
256KB
48MHz
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MXO45HS
Abstract: mxo45 application notes MXO45 PEAK tray drawing
Text: MXO45/MXO45HS METAL DIP CLOCK OSCILLATOR FEATURES • • • • • • • • • Standard 14 Pin or 8 Pin DIP Footprint HCMOS/TTL Compatible Fundamental and 3RD Overtone Crystals Frequency Range 1.0 – 105.561 MHz Frequency Stability, ±50 ppm Standard
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MXO45/MXO45HS
MXO45/MXO45HS
2x10-8
J-STD-020.
MXO45HS
mxo45 application notes
MXO45
PEAK tray drawing
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MSOP-14
Abstract: No abstract text available
Text: EPH2R0030 [ 1] Electrical Specification Output Side Ta − 40 ~ 85 °C Vi 36 ~75 V Characteristics Vo Io Output Conditions Vi = 48 V Typ. Max. 1.9 2.0 2.1 V Output Voltage Initial Setting Ta = 25°C Io = 0~3 A Line Regulation Io = 3 A Vi = 36~75 V 10
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EPH2R0030
MSOP-14
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jedec MS-026 ABA
Abstract: ICS83210AYT MS-026 CY2HH8110 ICS83210 ICS83210AY ICS83210AYLF idt cross TQFP JEDEC tray JEDEC tray standard TQFP
Text: ICS83210 LOW SKEW, 1-TO-10 HSTL FANOUT BUFFER GENERAL DESCRIPTION FEATURES The ICS83210 is a low skew, 1-to-10 HSTL Fanout ICS Buffer and a member of the HiPerClockS Family HiPerClockS™ of High Performance Clock Solutions from IDT. The class II HSTL outputs are balanced push-pull
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ICS83210
1-TO-10
ICS83210
150MHz
110ps
199707558G
jedec MS-026 ABA
ICS83210AYT
MS-026
CY2HH8110
ICS83210AY
ICS83210AYLF
idt cross
TQFP JEDEC tray
JEDEC tray standard TQFP
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Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: NYLON 66 MAX TEMPERATURE: 220°C 10 S COLOR: WHITE CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: TIN QUALITY CLASS: 25 MATING CYCLES PITCH: 4.20MM A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 105°C
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UL94-V2
E323964
649-1R
31-AUG-10
31-OCT-07
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tray lqfp
Abstract: JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
Text: ARM-based Flash MCU SAM4S Series SUMMARY DATASHEET Description The Atmel SAM4S series is a member of a family of Flash microcontrollers based on the high-performance 32-bit ARM Cortex ® -M4 RISC processor. It operates at a maximum speed of 120 MHz and features up to 2048 Kbytes of Flash, with optional
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32-bit
tray lqfp
JEDEC qfn tray
QFn Package tray
JEDEC TRAY DIMENSIONS QFN
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J020D-STD
Abstract: JEDEC tray dimension JEDEC TRAY 10 X 10 21 x 14 tray
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: NYLON 46 COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: GOLD QUALITY CLASS: 3 AS PER CECC 75 301-802 PITCH: 2.54MM A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 125°C
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UL94-V0
23-NOV-07
12-DEC-06
06-NOV-06
610-SMT
E323964
J020D-STD
JEDEC tray dimension
JEDEC TRAY 10 X 10
21 x 14 tray
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Untitled
Abstract: No abstract text available
Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • 10dB Conversion Gain • 2.5dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3
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SMM5139XZ
SMM5139XZ
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Untitled
Abstract: No abstract text available
Text: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • 10dB Conversion Gain • 2.6dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3
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SMM5142XZ
SMM5142XZ
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0853.12
Abstract: J-STD-020-C JEDEC J-STD-020c J-STD-020C TRAY JEDEC j-std-033c
Text: OGN-SMD Fuseholder Blocks & Clips www.schurter.com/pg02b Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1 250 VAC • 4 W / 10 A VDE · 500 VAC/DC · 10 A (UL/CSA) Description Applications - For appliances in unattended use
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com/pg02b
W/10A
500VAC/DC
E39328
0853.12
J-STD-020-C
JEDEC J-STD-020c
J-STD-020C
TRAY JEDEC j-std-033c
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Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: NYLON 66 FLAMABILITY RATING: UL94-V0 MAX TEMPERATURE: 220°C 10 S COLOR: WHITE CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: TIN QUALITY CLASS: 25 MATING CYCLES PITCH: 4.20MM A
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UL94-V0
23-AVR-09
31-MAR-09
12-NOV-08
22-FEB-07
30-JUN-06
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JEDEC tray standard dimension
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: PBT FLAMABILITY RATING: UL94-V0 COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: GOLD QUALITY CLASS: 3 AS PER CECC 75 301-802 PITCH: 2.54MM A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 125°C
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UL94-V0
E323964
612-212-R
15-MAR-
612-R
JEDEC tray standard dimension
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LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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Abstract: No abstract text available
Text: SUPPLEM ENT Am29F200A Known Good Die AMD3 2 Megabit 256 K x 8-Bit/128 K x 16-Bit CMOS 5.0 Volt-only, Sectored Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS • 5.0 V ± 10% for read and write operations — Minimizes system level power requirements
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Am29F200A
8-Bit/128
16-Bit)
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CS19AFDS
Abstract: No abstract text available
Text: SU PPLEM ENT Am29F100 Known Good Die 1 Megabit 128 K x 8-Bit/64 K x 16-Bit CMOS 5.0 Volt-only, Boot Sector Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS • Single power supply operation — 5.0 V ± 10% for read, erase, and program operations
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Am29F100
8-Bit/64
16-Bit)
CS19AFDS
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known good die AMD
Abstract: No abstract text available
Text: SU PPLEM EN T Am29F200B Known Good Die AMDH 2 Megabit 256 K x 8-Bit/128 K x 16-Bit CMOS 5.0 Volt-only, Sectored Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS • 5.0 V ± 10% fo r read and w rite o perations — Minimizes system level power requirements
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OCR Scan
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Am29F200B
8-Bit/128
16-Bit)
Am29F200A
CS39S
known good die AMD
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