TQFP JEDEC tray
Abstract: No abstract text available
Text: HEAT PROOF 105.0 7 135°C MAX PPE 17.5 A' 15.45 21.00 A TQFP 14x20×1.0 6×12=72 135.9 UNIT : mm 23.5 25.40 17.80 279.4 315.0 322.6 SECTION A – A' Applied Package 100-pin Plastic TQFP (1.0mm thick) 5.62 6.35 7.62 23.5 Quantity (pcs) MAX. 72 Tray Material
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100-pin
TQFP JEDEC tray
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atmel 0328
Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
Text: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat
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120C1
32-lead,
44-lead,
48-lead,
0555H
08/00/xM
atmel 0328
jedec mo-142 footprint
footprint jedec MS-026 LQFP
100RQ
footprint jedec MS-026 TQFP 144
47 16s 8p3
footprint jedec MS-026 LQFP 64 pin
footprint jedec MS-026 TQFP AEB
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ep600i
Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Text: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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JEDEC TQFP 10*10 1.0 MM
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A73B-1 TQFP 10x10 1.0T 64 pin TQFP 10 × 10 Terminal Spacing Linear = 0.5 A B 48 33 32 49 F 64 R Q S D C detail of lead end 17 16 1 G H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3A73B-1
S64GB-50-9EU-1
JEDEC TQFP 10*10 1.0 MM
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I. C. OSCILLATOR, CLOCK 154 MHz- Qual
Abstract: ICS843S06 A0905-01 G700 JESD22-A118 TQFP-48 JESD22-A104 IN4144 obsolete ic cross reference 155.52MH
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 96138 PCN #: A0905-01 Product Affected: PRODUCT/PROCESS CHANGE NOTICE PCN DATE: May 15, 2009 7 mm x 7 mm x 1.4 mm TQFP-48 (Green) Date Effective: Contact: Title: Phone #: Fax #:
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A0905-01
TQFP-48
Equipm84-8200
I. C. OSCILLATOR, CLOCK 154 MHz- Qual
ICS843S06
A0905-01
G700
JESD22-A118
TQFP-48
JESD22-A104
IN4144
obsolete ic cross reference
155.52MH
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bd248
Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)
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ep600i
Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)
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208 pin rqfp drawing
Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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240 pin rqfp drawing
Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)
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7000B,
7000AE,
240 pin rqfp drawing
BGA sumitomo
724p
EP1C12
Altera pdip top mark
epm7032 plcc
FBGA672
192 BGA PACKAGE thermal resistance
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LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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TQFP 100 pin ic
Abstract: 208ld
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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PQFP 176
Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●
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144-Pin
100-Pin
256-Pin
780-Pin
256-Pin
68-Pin
PQFP 176
240 pin rqfp drawing
EP3C5E144
EP1K50-208
processor cross reference
EP3C16F484
MS-034 1152 BGA
84 FBGA thermal
TQFP 144 PACKAGE DIMENSION
FBGA 1760
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footprint jedec MS-026 TQFP AEB
Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5
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32-lead,
44-lead,
48-lead,
64-lead
100-lead,
144-lead,
24-lead,
20-lead,
footprint jedec MS-026 TQFP AEB
footprint jedec MS-026 LQFP
jedec mo-142 footprint
13-2L
footprint jedec MS-026 TQFP
48C1
28P6
JEDEC MS-026 footprint
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0555B
Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7
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44-Lead,
48-Lead,
64-Lead
100-Lead,
144-Lead,
24-Lead,
20-Lead,
0555B
footprint jedec MS-026 TQFP AEB
20D3
48C1
footprint jedec MS-026 TQFP 128
jedec mo-142 footprint
TSOP 1238
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footprint jedec MS-026 TQFP
Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat
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32-lead,
44-lead,
48-lead,
64-lead
100-lead,
0555D
11/99/xM
footprint jedec MS-026 TQFP
atmel 0328
PQFP chip size
CERAMIC LEADLESS CHIP CARRIER 68
MS-026-AED
ATMEL 740
64 CERAMIC LEADLESS CHIP CARRIER LCC
8 lead side brazed
ATMEL 342
atmel 545
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100L
Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Text: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP
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CS-007
Abstract: Amkor Electronics Amkor mold compound
Text: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld
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TQFP 100 pin ic
Abstract: tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124
Text: LEADFRAME data sheet TQFP Features: Thin Quad Flat Pack TQFP Packages: Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink
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MS-026
TQFP 100 pin ic
tqfp 7x7 1.4 tray
tqfp 7x7 tray
MS-026
JEDEC tray standard 17 x 17
tqfp 64 thermal resistance
MS-026 TQFP
TQFP Package 44 lead
tqfp 32 thermal resistance
CO-124
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BGA and QFP Package mounting
Abstract: MCP Technology Trend EE13 jwg2 EE13 JWG SC47D tfBGA PACKAGE thermal resistance EIA and EIAJ standards Combo (Spindle VCM) Driver BGA and QFP Package EE-13
Text: PACKAGE TRENDS 1-1 Packaging Trends Needs of electronic equipment Optimized System Integration Performance • Multiple functions • High speed • High output Outline • Small • Thin • Light Assembly • Automation • Systematization • High density
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ADG732
Abstract: ADG726 S16A S16B design of 16-1 multiplexer SU48 6-PIN s9ad
Text: a 16-/32-Channel, 4 ⍀ +1.8 V to +5.5 V, ؎2.5 V Analog Multiplexers ADG726/ADG732 FEATURES 1.8 V to 5.5 V Single Supply ؎2.5 V Dual-Supply Operation 4 ⍀ On Resistance 0.5 ⍀ On Resistance Flatness 48-Lead TQFP or 48-Lead 7 mm ؋ 7 mm CSP Packages Rail-to-Rail Operation
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16-/32-Channel,
ADG726/ADG732
48-Lead
32-to-1
16-to-1
ADG725/ADG731
ADG726
ADG732
MO-220-VKKD-2
ADG732
ADG726
S16A
S16B
design of 16-1 multiplexer
SU48 6-PIN
s9ad
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Untitled
Abstract: No abstract text available
Text: a 16-/32-Channel, 4 ⍀ +1.8 V to +5.5 V, ؎2.5 V Analog Multiplexers ADG726/ADG732 FEATURES 1.8 V to 5.5 V Single Supply ؎2.5 V Dual-Supply Operation 4 ⍀ On Resistance 0.5 ⍀ On Resistance Flatness 48-Lead TQFP or 48-Lead 7 mm ؋ 7 mm CSP Packages Rail-to-Rail Operation
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16-/32-Channel,
ADG726/ADG732
48-Lead
32-to-1
16-to-1
ADG725/ADG731
ADG726
MO-220-VKKD-2
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EP4CE6 package
Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
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EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
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JEDEC MS-026 BED
Abstract: footprint jedec MS-026 TQFP 144 100-PIN TQFP XILINX DIMENSION
Text: H XILIN X XC95144XL High Performance CPLD S e p te m b e r 28, 1 9 9 8 V e rs io n 1.0 Preliminary Product Specification Features Power E stim ation • • • • Power dissipation in CPLDs can vary substantially depend ing on the system frequency, design application, and output
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XC95144XL
XC9500XL
JEDEC MS-026 BED
footprint jedec MS-026 TQFP 144
100-PIN TQFP XILINX DIMENSION
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