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    JEDEC QFP44 Search Results

    JEDEC QFP44 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP139AIYAHR Texas Instruments JEDEC DDR5 temperature sensor with 0.5 °C accuracy 6-DSBGA -40 to 125 Visit Texas Instruments Buy
    SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments
    SN74SSQEB32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQEC32882ZALR Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy

    JEDEC QFP44 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    QFP44-P-1010-0

    Abstract: 44P6N
    Text: 44P6N-A Plastic 44pin 10✕10mm body QFP EIAJ Package Code QFP44-P-1010-0.80 Weight g 0.59 Lead Material Alloy 42 MD e JEDEC Code – HD 34 b2 44 ME D 1 33 I2 HE E Recommended Mount Pad Symbol 23 11 12 22 A A2 L1 b y A1 e c F L Detail F A A1 A2 b c D E e


    Original     		PDF 44P6N-A 44pin QFP44-P-1010-0 44P6N

    44P6N

    Abstract: No abstract text available
    Text: 44P6N-B Plastic 44pin 10✕10mm body QFP EIAJ Package Code QFP44-P-1010-0.80 Weight g 0.59 Lead Material Alloy 42 MD e JEDEC Code – HD 34 b2 44 ME D 1 33 I2 HE E Recommended Mount Pad Symbol 23 11 12 22 A c A2 L1 b y F A1 e L Detail F A A1 A2 b c D E e


    Original     		PDF 44P6N-B 44pin QFP44-P-1010-0 44P6N

    QFP44

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 1.3 mm ; body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A


    Original     		PDF QFP44: OT307-2 QFP44

    jedec QFP44

    Abstract: SOT205-1
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 2.35 mm ; body 14 x 14 x 2.2 mm SOT205-1 c y X 33 A 23 34 22 ZE e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index 44 L 12 detail X 1 11 ZD e v M A wM


    Original     		PDF QFP44: OT205-1 OT205-1 133E01A jedec QFP44 SOT205-1

    sot853

    Abstract: QFP44
    Text: Package outline Philips Semiconductors QFP44: plastic quad flat package; 44 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm SOT853-1 c y X A 33 23 34 ZE 22 e A A2 E HE (A 3) A1 w pin 1 index θ M Lp bp L 44 detail X 12 1 11 w bp e ZD M D v M A v M B B HD


    Original     		PDF QFP44: OT853-1 sot853 QFP44

    QFP44

    Abstract: No abstract text available
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 2.35 mm ; body 14 x 14 x 2.2 mm SOT205-1 c y X 33 A 23 34 22 ZE e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index 44 L 12 detail X 1 11 ZD e v M A wM


    Original     		PDF QFP44: OT205-1 133E01 QFP44

    QFP44

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 2.35 mm ; body 14 x 14 x 2.2 mm SOT205-1 c y X 33 A 23 34 22 ZE e E HE A A2 (A 3) A1 wM pin 1 index θ bp 44 Lp L 12 detail X 1 11 ZD e v M A wM


    Original     		PDF QFP44: OT205-1 133E01 QFP44

    MS-022

    Abstract: QFP44 SOT803-1 sot803
    Text: PDF: 2003 Jan 31 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT803-1 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 pin 1 index θ bp Lp L 12 44 detail X 1 11 wM bp e v M A ZD


    Original     		PDF QFP44: OT803-1 134E05 MS-022 ED-7311CB MS-022 QFP44 SOT803-1 sot803

    QFP44

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP44: plastic quad flat package; 44 leads lead length 1.3 mm ; body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 detail X 11 1 wM bp e ZD v M A


    Original     		PDF QFP44: OT307-2 QFP44

    Untitled

    Abstract: No abstract text available
    Text: Package outline QFP44: plastic quad flat package; 44 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT803-1 c y X A 33 23 34 22 ZE e E HE A A2 wM pin 1 index (A 3) A1 θ bp Lp L 12 44 detail X 1 11 wM bp e v M A ZD D B v M B HD 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF QFP44: OT803-1 134E05 MS-022 ED-7311CB

    Untitled

    Abstract: No abstract text available
    Text: Package outline QFP44: plastic quad flat package; 44 leads lead length 1.3 mm ; body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF QFP44: OT307-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline QFP44: plastic quad flat package; 44 leads lead length 2.35 mm ; body 14 x 14 x 2.2 mm SOT205-1 c y X 33 A 23 34 22 ZE e E HE A A2 (A 3) A1 wM pin 1 index θ bp 44 Lp L 12 detail X 1 11 e ZD wM bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF QFP44: OT205-1 133E01

    DIP18 package

    Abstract: SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225
    Text: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20


    Original     		PDF DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP40 DIP18 package SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225

    VQFN28

    Abstract: DIP18 DIP20 DIP32 SDIP28 jedec MS-013 QFP100-P-1420
    Text: パッケージコード一覧 ４．パッケージコード一覧（NJRCコード vs. EIAJコード対応） 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 VQFN28 DIP18 DIP20 DIP32 SDIP28 jedec MS-013 QFP100-P-1420

    QFP80

    Abstract: SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 QFP80 SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32

    PLCC84 package

    Abstract: DBS13P DBS17P DIP18 DIP20 HDIP18 LQFP48 LQFP64 LQFP80 PLCC68
    Text: PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP VSO Soldering nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS DIL-bent-SIL


    Original     		PDF DBS13P OT141-6 DBS17P OT243-1 OT97-1; OT97DE DIP14 OT27-1 DIP16 OT190-1 PLCC84 package DBS13P DBS17P DIP18 DIP20 HDIP18 LQFP48 LQFP64 LQFP80 PLCC68

    SOP18 EIAJ

    Abstract: QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 SOP18 EIAJ QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ

    QFP80

    Abstract: QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013
    Text: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 QFP80 QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013

    DIP18

    Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28
    Text: パッケージコード一覧 ４．パッケージコード一覧（NJRCコード vs. EIAJコード対応） 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28

    DIP18

    Abstract: DIP20 DIP40
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP18 DIP20 DIP40

    sc6038

    Abstract: SC-6038 K 2941 SOT393-1 DBS13P DIP20 DIP28 HDIP18 LQFP100 LQFP48
    Text: PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP Soldering 1816 1818 1822 1823 1827 1830 1836 1839 1841 1849 1851 1852 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS DIL-bent-SIL


    Original     		PDF OT157-2 DBS13P OT141-6 OT97-1 DIP16 OT38-1 DIP20 OT146-1 DIP28 OT316-1 sc6038 SC-6038 K 2941 SOT393-1 DBS13P DIP20 HDIP18 LQFP100 LQFP48

    MS-013

    Abstract: MS013 jedec MS-013 SOP40 jedec DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28
    Text: パッケージコード一覧 ４．パッケージコード一覧（NJRCコード vs. EIAJコード対応） 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 MS-013 MS013 jedec MS-013 SOP40 jedec DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28

    DIP18

    Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 jedec MS-013 SC-43A
    Text: パッケージコード一覧 ２．パッケージコード一覧（NJRCコード vs. EIAJコード対応） 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一


    Original     		PDF DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP40 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 jedec MS-013 SC-43A

    DIP40

    Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
    Text: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)


    Original     		PDF OT97-1 DIP14 OT27-1 DIP16 OT38-1 DIP20 OT146-1 DIP24 OT101-1 DIP28 DIP40 LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1