camtex trays
Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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PLCC 84 PINS
Abstract: camtex trays MIL-I-8835A
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
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IPC-SM-786A
Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
Text: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid
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IPC-SM-780
Abstract: No abstract text available
Text: Reflow Soldering Guidelines January 1998, ver. 2 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid
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ANSI/IPC-SM-786)
IPC-TM-650)
JESD22-A112)
IPC-SM-780
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MIL-I-8835A
Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from
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strapack s-669
Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,
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NEC A39A
Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES
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C10943XJ6V0IF00
IEI-635,
IEI-1213)
ED-7411
NEC A39A
NEC A39A 240
SOP28 330 mil land pattern
NEC A39A 8 PIN
mjh 106
120-PIN 282 185 01
smd TRANSISTOR code b6
ED-7500
transistor a39a
SIP 400B
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4572 smd 8pin
Abstract: 100 PIN "PGA" ALTERA DIMENSION CMGA17-P100E 02D-00194 altera 24pin dip drawing
Text: Altera Device Package Outlines March 1995, ver. 5 In tro d u c tio n Data Sheet This data sheet provides package outlines for all Altera devices. Package outlines are listed here in ascending pin count order. Table 1 summarizes the maximum lead coplanarity for Altera J-lead and QFP packages:
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304-Pin
560-Pin
4572 smd 8pin
100 PIN "PGA" ALTERA DIMENSION
CMGA17-P100E
02D-00194
altera 24pin dip drawing
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Untitled
Abstract: No abstract text available
Text: GLOSSARY OF PACKAGING ABBREVIATIONS CLCC Ceramic Leaded Chip Carrier. Solder sealed, mul tilayer ceramic. COB Chip on Board. CQFP Glass sealed Ceramic Quad Flat Pack with gull wing leads. Also called CERQUAD or CQUAD. CQUAD Same as CQFP. DPAK Small power transistor package for surface mount.
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O-220)
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Untitled
Abstract: No abstract text available
Text: SONY CXP87500 Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description The CXP87500 is a CMOS 8-bit single chip micro computer of piggyback/evaluator combined type, which is developed for evaluating the function of the CXP87532/87540. 100 pin PQFP Ceramic
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CXP87500
CXP87500
CXP87532/87540.
16-bit
326ns
288MHz
27C512
40Kbytes
1344bytes
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80386SL
Abstract: No abstract text available
Text: 1C Test Clips Pomona JEDEC PQFP Test Clips Pomona's JEDEC QFP test clips are designed to fit on surface-mounted plastic and ceramic JEDEC chips. Choose from three clip types designed to give you optimum func tionality and ease of use for testing, troubleshooting
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84 pin PGA socket
Abstract: No abstract text available
Text: From: DocuFACTSUn] Ph* 949-253-7438 16038801932 Pomona 8-20-99 ll:59ara p. 4 of 6 Model 5998A 240 Lead QFP Test Clip with PGA, .50 mm Lead Pitch These new test clips provide the user with an easy means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad
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59ara
D5S98A/C
PomonadCCESS90428
84 pin PGA socket
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PJ71
Abstract: pj71 data PJ-71 M24-P "FRC"
Text: SONY Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description 100 pin PQFP Ceramic The CXP81900 is a CMOS 8-bit single chip micro computer ot piggyback/evaluator combined type, which is developed for evaluating the function of the CXP81952/81960.
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CXP81900
CXP81952/81960.
250ns
16MHz
333ns
12MHz
122ns
32kHz
12-channel,
s/16MHz)
PJ71
pj71 data
PJ-71
M24-P
"FRC"
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LU PWM
Abstract: QFP 160 CXP83124A
Text: SONY Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description 100 pin PQFP Ceramic The CXP83200A is a CMOS 8-bit single chip microcomputer ot piggyback/evaluator combined type, which is developed for evaluating the function of the CXP83120A/83124A and CXP83232/83240.
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CXP83200A
CXP83120A/83124A
CXP83232/83240.
16-bit
400ns
10MHz
500kHz
32kHz
CXP83200A
LU PWM
QFP 160
CXP83124A
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Untitled
Abstract: No abstract text available
Text: SONY CXP81800 Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description 100 pin PQFP Ceramic The CXP81800 is a CMOS 8-bit single chip micro computer of piggyback/evaluator combined type, which is developed for evaluating the function of the
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CXP81800
CXP81800
CXP81840A/81848A.
333ns
12MHz
250ns
16MHz
122\is
32kHz
27C256,
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Untitled
Abstract: No abstract text available
Text: SONY CXP81900 CMOS 8-bit Single Chip Microcomputer Description The CXP81900 is a CMOS 8-bit single chip micro computer of piggyback/evaluator combined type, which is developed for evaluating the function of the CXP81952/81960. Piggyback/ evaluator type 100 pin PQFP Ceramic
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CXP81900
CXP81900
CXP81952/81960.
250ns
16MHz
333ns
12MHz
32kHz
27C256,
27C512
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Philips T5 Fluorescent
Abstract: No abstract text available
Text: SONY Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description 80 pin PQFP Ceramic The CXP82900 is a CMOS 8-bit single chip microcomputer ot piggyback/evaluator combined type, which is developed for evaluating the function of the CXP82940/82948/82952/82960.
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CXP82900
CXP82940/82948/82952/82960.
16-bit
250ns
16MHz
122ns
32kHz
27C512
CXP82900-U01Q
80-pin
Philips T5 Fluorescent
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Untitled
Abstract: No abstract text available
Text: SONY Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description 100 pin PQFP Ceramic The CXP87300 is a CMOS 8-bit single chip micro computer ot piggyback/evaluator combined type, which is developed for evaluating the function of the CXP87352/87360.
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CXP87300
CXP87352/87360.
16-bit
333ns
12MHz
250ns
16MHz
32kHz
12-channel,
20ns/16MHz)
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Untitled
Abstract: No abstract text available
Text: SONY CXP87800 Piggyback/ evaluator type CMOS 8-bit Single Chip Microcomputer Description The CXP87800 is a CMOS 8-bit single chip micro computer of piggyback/evaluator combined type, which is developed for evaluating the function of the CXP87852/87860. 100 pin PQFP Ceramic
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CXP87800
CXP87800
CXP87852/87860.
16-bit
250ns
16MHz
27C512
12-channel,
100PIN
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XCS3201FN
Abstract: ATT92020 80386SL MC68HC11A1FU
Text: Pomona Innovative Solutions For IC Test Anc Development Expressly designed to facilitate testing of your surface-mounted devices, Pomona IC Test Clips and Pomona Solder-On Adapters are engineered in form and function to provide a convenient interface to logic analyzers for fast and reliable
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Untitled
Abstract: No abstract text available
Text: SONY CORP/COMPONENT PRODS 50E Ô3623Ô3 D 0003^72 T CXB1504Q-Y SO NY, Dual D Flip-Flop with Set, Reset and Differential I/O T -9 à .-ò 7 -o $ Description Pin Assignm ent The CXB1504Q-Y is an ultra high speed monolithic ECL IC, which contains two D type Flip-Flops with
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CXB1504Q-Y
CXB1504Q-Y
24pin
QFP-24M-S01)
32pin
QFP-32M-L02)
QFP-32C-L01)
32pin
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SOP48
Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Text: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7
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QFP12
QFP13
QFP15
QFP14
12X12X1
14X20X2
14X14X1
SOP48
CF RM sot89
SOP38
14X14X2
epson QFP 216
45x45 mm bga
14x14x2.7
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1310 sony
Abstract: No abstract text available
Text: SONY CORP/COMPONENT PRODS SOE D 0302303 00030^5 7 • CXB1132Q/Q-Y SO N Y. b - o <? - e>5 ~ 9, 8, Dual 4-bit Universal Shift Register Description Pin Assignm ent The C X B 1 1 3 2 Q is an ultra high speed monolithic Universal Shift Register with variable bit length.
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CXB1132Q/Q-Y
24pin
QFP-24M-S01)
-H-00a0-C
32pin
QFP-32C-L01)
32pin
16pin
QFP-32M-L02)
1310 sony
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