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Catalog Datasheet	MFG & Type	PDF	Document Tags
IRFC3815B Abstract: IRFC3815 Text: PD - 95827 IRFC3815B D HEXFET Power MOSFET Die in Wafer Form l l 100% Tested at Probe Available in Chip Pack, Unsawn wafer, Sawn on Film G Key Electrical Characteristics TO-274 package Parameter V(BR)DSS RDS(on) VGS(th) IDSS IGSS TJ TSTG Description	Original	PDF	IRFC3815B O-274 100nA IRFC3815B IRFC3815

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MFG & Type

PDF

Document Tags

IRFC3815B

Abstract: IRFC3815
Text: PD - 95827 IRFC3815B D HEXFET Power MOSFET Die in Wafer Form l l 100% Tested at Probe Available in Chip Pack, Unsawn wafer, Sawn on Film G Key Electrical Characteristics TO-274 package Parameter V(BR)DSS RDS(on) VGS(th) IDSS IGSS TJ TSTG Description

Original

PDF

IRFC3815B O-274 100nA IRFC3815B IRFC3815