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    Amphenol Aerospace IO2-120C

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    Amphenol Aerospace IO2-160C (700)

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    STMicroelectronics EVLCMB1-AIO210W

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    Advantech Co Ltd EMIO-210S-MPU01E

    2 CH RS-232 MODULE WITH EXTERNAL
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    IO21 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS166I April 2001 – Revised January 2006 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not


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    PDF TMS320VC5502 SPRS166I TMS320VC5502 SPRS166I SPRS166H

    Untitled

    Abstract: No abstract text available
    Text: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS166H April 2001 – Revised November 2004 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not


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    PDF TMS320VC5502 SPRS166H TMS320VC5502 SPRS166H SPRS166G

    V2DA

    Abstract: VDIP1
    Text: Future Technology Devices International Ltd. V2DIP1-48 VNC2-48 Development Module Datasheet Document Reference No.: FT_000236 Version 1.0 Issue Date: 2010-04-15 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom


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    PDF V2DIP1-48 VNC2-48 895-V2DIP1-48 V2DIP1-48 V2DA VDIP1

    K743

    Abstract: military specification M55302 10-296943-22 removal tool snap on tools for electronic IO2-120 MIL-G-45204 MIL-P-46161 amphenol 77820 MB3-132 io3051
    Text: Amphenol Low Mating Force Rectangular Connectors 12-035-10 MIL-C-55302 Amphenol Table of Contents Page No. 1 Item The B3 Contact Innovation 2, 3 Low Mating Force Electrical Connectors 4 Low Mating Force Hybrid Configurations 5–8 8, 9 10, 11 How to Order


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    PDF MIL-C-55302 L-2104 L-2081 K743 military specification M55302 10-296943-22 removal tool snap on tools for electronic IO2-120 MIL-G-45204 MIL-P-46161 amphenol 77820 MB3-132 io3051

    TMS320

    Abstract: TMS320C5000 TMS320VC5501 TMS320VC5502 XDS510 Analog devices catalog 5502 mcbsp
    Text: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.


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    PDF TMS320VC5502 SPRS166K SPRS166J SPRS166K TMS320 TMS320C5000 TMS320VC5501 TMS320VC5502 XDS510 Analog devices catalog 5502 mcbsp

    RT3PE600L

    Abstract: RT3PE3000L AES-128 PAC10 LG484 ProASICPLUS Flash Family FPGAs Advanced v0.1
    Text: Advance v0.1 Radiation-Tolerant ProASIC3 Low-Power SpaceFlight Flash FPGAs with Flash*Freeze Technology Features and Benefits • High-Performance, Low-Skew Global Network • Architecture Supports Ultra-High Utilization MIL-STD-883 Class B Qualified Packaging


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    PDF MIL-STD-883 RT3PE600L RT3PE3000L AES-128 PAC10 LG484 ProASICPLUS Flash Family FPGAs Advanced v0.1

    Untitled

    Abstract: No abstract text available
    Text: Document No.: FT_000061 FT2232H DUAL HIGH SPEED USB TO MULTIPURPOSE UART/FIFO IC Datasheet Version 2.08 Clearance No.: FTDI#77 Future Technology Devices International Ltd FT2232H Dual High Speed USB to Multipurpose UART/FIFO IC The FT2232H is FTDI‟s 5th generation of USB


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    PDF FT2232H 480Mb/s) 480Mbits/Second) 12MHz AN2232L-1

    Advanced Boot Block Flash

    Abstract: AES-128 CS201 CS281 CS289 AGLP125
    Text: v1.5 IGLOO PLUS Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation 5 µW Power Consumption in Flash*Freeze Mode


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    PDF 130-nm, Advanced Boot Block Flash AES-128 CS201 CS281 CS289 AGLP125

    A3P600

    Abstract: A3P060 A3P1000 A3P125 A3P250 AECQ100 AEC-Q100 FG144 FG256 FG484
    Text: v1.0 Automotive ProASIC3 Flash Family FPGAs Features and Benefits Low Power • 1.5 V Core Voltage • Support for 1.5-V-Only Systems • Low-Impedance Flash Switches High-Temperature AEC-Q100–Qualified Devices • Grade 2 105°C TA 115°C TJ • Grade 1 125°C TA (135°C TJ)


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    PDF AEC-Q100 A3P600 A3P060 A3P1000 A3P125 A3P250 AECQ100 FG144 FG256 FG484

    A3PE1500

    Abstract: A3PE3000 IO23PDB0V2 IO23NDB0V2 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
    Text: ProASIC3E Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .


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    PDF 208-Pin A3PE600 IO112PDB6V1 IO85NPB5V0 A3PE1500 A3PE3000 IO23PDB0V2 IO23NDB0V2 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1

    A3PE3000L FG484

    Abstract: Actel pdf on radio emitter A3PE3000L FG144 FG256 FG324 FG484 PQ208 TDP 245 Y
    Text: v1.3 ProASIC3L Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • Dramatic Reduction in Dynamic and Static Power Savings • 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power • Low Power Consumption in Flash*Freeze Mode Allows for


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    PDF 130-nm, A3PE3000L FG484 Actel pdf on radio emitter A3PE3000L FG144 FG256 FG324 FG484 PQ208 TDP 245 Y

    QN68

    Abstract: VQ100 actel part markings
    Text: Advance v0.4 ProASIC®3 nano Flash FPGAs Features and Benefits Advanced I/Os Wide Range of Features • 10 k to 250 k System Gates • Up to 36 kbits of True Dual-Port SRAM • Up to 71 User I/Os Reprogrammable Flash Technology • • • • 130-nm, 7-Layer Metal 6 Copper , Flash-Based CMOS Process


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    PDF 130-nm, 128-Bit QN68 VQ100 actel part markings

    A3P250

    Abstract: A3P060 A3P1000 Datasheet A3P125 IO97RSB2 IO52NDB1 FBGA A3P250 fbga 256 A3P250 ACTEL ACTEL FBGA 144
    Text: Automotive ProASIC3 Packaging 3 – Package Pin Assignments 100-Pin VQFP 100 1 Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .


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    PDF 100-Pin A3P060 IO62RSB1 IO31RSB0 GAA2/IO51RSB1 A3P250 A3P1000 Datasheet A3P125 IO97RSB2 IO52NDB1 FBGA A3P250 fbga 256 A3P250 ACTEL ACTEL FBGA 144

    actel vqfp

    Abstract: IO87RSB1
    Text: ProASIC3 nano Packaging 3 – Package Pin Assignments 48-Pin QFN Pin 1 48 1 Notes: 1. This is the bottom view of the package. 2. The die attach paddle of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at


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    PDF 48-Pin A3PN010 GEC0/IO37RSB1 IO06RSB0 IO36RSB1 GDA0/IO05RSB0 GEA0/IO34RSB1 actel vqfp IO87RSB1

    IO91RSB2

    Abstract: Datasheet AGLN060 81-Pin Datasheet AGLN020 AGLN020 IO10RSB0 AGLN010
    Text: IGLOO nano Packaging 3 – Package Pin Assignments 36-Pin UC Pin 1 Pad Corner 6 5 4 3 2 1 A B C D E F Note: This is the bottom view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .


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    PDF 36-Pin AGLN010 IO21RSB1 IO18RSB1 IO13RSB1 GDC0/IO00RSB0 IO06RSB0 GDA0/IO04RSB0 GEC0/IO37RSB1 IO91RSB2 Datasheet AGLN060 81-Pin Datasheet AGLN020 AGLN020 IO10RSB0

    729-Pin

    Abstract: Axcelerator FPGAs AX125 IO126PB3F11 AG18 FBGA 896 896-Pin Axcelerator Family FPGAs
    Text: Axcelerator Family FPGAs Package Pin Assignments 180-Pin CSP A1 Ball Pad Corner 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P Figure 3-1 • 180-Pin CSP Bottom View Note For Package Manufacturing and Environmental information, visit Resource center at


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    PDF 180-Pin AX125 IO32NB3F3 IO59NB5F5 729-Pin Axcelerator FPGAs IO126PB3F11 AG18 FBGA 896 896-Pin Axcelerator Family FPGAs

    TMS320VC5501PGF300

    Abstract: No abstract text available
    Text: TMS320VC5501 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS206H December 2002 − Revised November 2004 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments


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    PDF TMS320VC5501 SPRS206H MTQF020A S-PQFP-G176) MS-026 TMS320VC5501PGF300

    Untitled

    Abstract: No abstract text available
    Text: TMS320VC5501 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS206E December 2002 − Revised October 2003 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to


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    PDF TMS320VC5501 SPRS206E shouldPRZ020D SPRS206E S-PQFP-G176) MS-026 176-Pin

    GC5325

    Abstract: No abstract text available
    Text: User's Guide SLWU075A – October 2011 – Revised January 2012 TSW3065EVM – Standalone LO Source This document describes the steps to properly operate and understand the TSW3065EVM Evaluation Module. TSW3065EVM eliminates expensive signal generators and also acts as a demo enabler for TI


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    PDF SLWU075A TSW3065EVM TSW3065EVM TSW3725, TSW6011, GC5330, GC5325, GC5325

    Untitled

    Abstract: No abstract text available
    Text: Revision 22 IGLOO Low Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation 5 µW Power Consumption in Flash*Freeze Mode


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    PDF

    FT245M

    Abstract: 93c46 rotated FT245BM transistor 2n3906 93C46/56/66 93C46 93C56 93C66 93LC46B CRC16
    Text: FT245BM USB FIFO USB - Parallel I.C. The FT245BM is the 2nd generation of FTDI’s popular USB FIFO i.c. This device not only adds extra functionality to it’s FT8U245AM predecessor and reduces external component count, but also maintains a high degree of pin


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    PDF FT245BM FT8U245AM DS245B FT245M 93c46 rotated transistor 2n3906 93C46/56/66 93C46 93C56 93C66 93LC46B CRC16

    QN68

    Abstract: VQ100 PAC11 ProASIC3 handbook
    Text: Advance v0.5 ProASIC®3 nano Flash FPGAs Features and Benefits Advanced I/Os Wide Range of Features • 10 k to 250 k System Gates • Up to 36 kbits of True Dual-Port SRAM • Up to 71 User I/Os Reprogrammable Flash Technology • • • • 130-nm, 7-Layer Metal 6 Copper , Flash-Based CMOS Process


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    PDF 130-nm, 128-Bit QN68 VQ100 PAC11 ProASIC3 handbook

    AES-128

    Abstract: FG256 FG484
    Text: v2.0 IGLOOe Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation Low-Power Active FPGA Operation Flash*Freeze Technology Enables Ultra-Low Power


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    PDF 130-nm, AES-128 FG256 FG484

    A54 ZENER

    Abstract: AFS600-FG256 mark AT0 QN108 CORE8051 bipolar ROM
    Text: v2.0 Actel Fusion Family of Mixed-Signal FPGAs Features and Benefits In-System Programming ISP and Security High-Performance Reprogrammable Flash Technology Advanced Digital I/O • • • • • Secure ISP with 128-Bit AES via JTAG • FlashLock® to Secure FPGA Contents


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    PDF 128-Bit 130-nm, A54 ZENER AFS600-FG256 mark AT0 QN108 CORE8051 bipolar ROM