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    INTEL SO PACKAGE GUIDE Search Results

    INTEL SO PACKAGE GUIDE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    INTEL SO PACKAGE GUIDE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    honeywell pcm45

    Abstract: mpga479 pcm45 ECC-00177-01-GP L2400 PCM45F T2500 INTEL embedded processors Core 2 duo socket 478 motherboard manual cpu socket mPGA479m
    Text: Intel CoreTM Duo processor on 65 nm process for Embedded Applications Thermal Design Guide February 2006 Order Number: 311161-001 February 2006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		PDF

    EEP-N41ES-02

    Abstract: EEP-N41CS-01 mobile Thermal Design Guide intel MOTHERBOARD pcb design in MPGA479M G751 shinetsu EEP-N41SS-01 Intel Pentium 4 Processors 745
    Text: Intel Pentium® M Processor on 90 nm process with 2-MB L2 Cache for Embedded Applications Thermal Design Guide February 2006 Reference Number: 302231-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF

    PCM45F

    Abstract: ECC-00177-01-GP heatsink EEP-N41CS-I1-GP cpu socket mPGA479m MPGA479M thermal test vehicle -intel ECC-00178-01-GP intel package drawings
    Text: Dual-Core Intel Xeon® processor LV and ULV Thermal Design Guide August 2006 Reference Number: 311374-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


    Original     		PDF

    INTEL fcBGA PACKAGE thermal resistance

    Abstract: fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide"
    Text: Ultra Low Voltage Intel Celeron® Processor in the Micro FC-BGA Package Thermal Design Guide October 2002 Order Number: 273802-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		PL1664-65) INTEL fcBGA PACKAGE thermal resistance fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide" PDF

    ECC-00060-01

    Abstract: 252612 G751 thermal design guide -intel micro-FCPGA intel MOTHERBOARD pcb design
    Text: Intel Pentium® M Processor and Celeron® M Processor for Embedded Applications Thermal Design Guide February 2006 Order Number: 273885-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF

    1168-ball micro-FCBGA

    Abstract: fujikura heat sink 478 Celeron d 2,26 001ss INTEL Micro-FCPGA Package Dimensions
    Text: Intel Celeron® M Processor on 90 nm Process for Embedded Applications Thermal Design Guide April 2005 Reference Number: 305994-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Intel Edison Board Support Package User Guide September 2014 Revision 001 Document Number: 331188-001 Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information.


    Original     		6ad20f049a c03195ed6e-r0/linux-edison-standardbuild/ c03195ed6er0/linux/arch/x86/configs/i386 PDF

    Passive Heatsink FCBGA

    Abstract: celeron 600 G751 fanless motherboard 3017* intel
    Text: ULV Intel Celeron® M Processor at 600 MHz for Embedded Applications Thermal Design Guide May 2004 Order Number: 302288-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS


    Original     		PDF

    intel MOTHERBOARD pcb design in

    Abstract: L7500 Intel Centrino Duo Mobile "September 2007" T7500 C1100 ECC-00177-01-GP PCM45F T7400 intel mechanical drawings intel MOTHERBOARD pcb design
    Text: Intel Core 2 Duo processor on 65 nm process for Embedded Applications Thermal Design Guide August 2007 Order Number: 315345-003US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED


    Original     		315345-003US intel MOTHERBOARD pcb design in L7500 Intel Centrino Duo Mobile "September 2007" T7500 C1100 ECC-00177-01-GP PCM45F T7400 intel mechanical drawings intel MOTHERBOARD pcb design PDF

    PCM45F

    Abstract: ECC-00177-01-GP thermal test vehicle -intel 3157* intel intel celeron socket 475
    Text: Intel Celeron® processor at 1.66 GHz / 1.83 GHz Thermal Design Guide January 2007 Order Number: 315745-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


    Original     		PDF

    Thermagon T-MATE2905

    Abstract: mmx black anodized aluminum plate LAYOUT GUIDELINES DDR Intel motherboard 82854 cooler master shinetsu 855GME AF-S-10H-07B THIRD generation chassis fanless motherboard
    Text: R Intel 82854 Graphics Memory Controller Hub GMCH for Fanless Set Top Box Applications Thermal Design Guide March 2005 Revision 1.0 Reference Number: D14844-001 Legal Statements INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO


    Original     		D14844-001 335C866801A 51-SA AF-S-10H-07B ECB-002272 ECB-00228 ECB-00229 Thermagon T-MATE2905 mmx black anodized aluminum plate LAYOUT GUIDELINES DDR Intel motherboard 82854 cooler master shinetsu 855GME AF-S-10H-07B THIRD generation chassis fanless motherboard PDF

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF

    FCBGA 956 pin

    Abstract: heatsink ECC-00178-01-GP ECC-00177-01-GP Instrumentation Amplifier IC with tl084 C1100 G751 PCM45F mobile processors 956-ball
    Text: Intel Core 2 Duo Mobile Processors on 45-nm process for Embedded Applications Thermal Design Guide June 2008 Order Number: 320028-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND


    Original     		45-nm FCBGA 956 pin heatsink ECC-00178-01-GP ECC-00177-01-GP Instrumentation Amplifier IC with tl084 C1100 G751 PCM45F mobile processors 956-ball PDF

    CH7317

    Abstract: ch7315 SERVICE MANUAL ibm 915g samsung CRT tv troubleshooting guide PCF 7951 dvi transmitter 1364 CHRONTEL ch7307 i965GM0 Chrontel CH7308 Silicon Image 1364
    Text: Intel Embedded Graphics Drivers and Video BIOS v9.0 User’s Guide June 2008 Document Number: 274041-014US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS


    Original     		274041-014US CH7317 ch7315 SERVICE MANUAL ibm 915g samsung CRT tv troubleshooting guide PCF 7951 dvi transmitter 1364 CHRONTEL ch7307 i965GM0 Chrontel CH7308 Silicon Image 1364 PDF

    intel 8250

    Abstract: 8250 intel intel E1000 0X00800000 ARMv5 intel 8250 datasheet e1000 intel driver ep80219 Memory Access Scheduler i386 ex board
    Text: Intel I/O Processors Linux - Debian Installation Guide March 2006 Order Number: 306507003US March 2006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		306507003US intel 8250 8250 intel intel E1000 0X00800000 ARMv5 intel 8250 datasheet e1000 intel driver ep80219 Memory Access Scheduler i386 ex board PDF

    a7860

    Abstract: a7860 8 pin SA-1110 SA1110DEVBD SA-1111 UDA1341 Intel StrongARM SA-1111 Development Module Hardware Release Notes SA11X1 278278
    Text: Intel StrongARM* SA-1110/SA-1111 Development Kit Quick Start Procedures User’s Guide July 2000 Order Number: 278339-002 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any


    Original     		SA-1110/SA-1111 SA11x1 a7860 a7860 8 pin SA-1110 SA1110DEVBD SA-1111 UDA1341 Intel StrongARM SA-1111 Development Module Hardware Release Notes SA11X1 278278 PDF

    motherboard pentium 4

    Abstract: Pentium 4 Processor atx chassis design guide heat and mass transfer motherboard intel pentium 4 Intel confidential design documents "pentium 4 Processors" pentium 4 INTEL confidential pentium intel motherboard design
    Text: Intel Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide Version 1.0 Reorder Number 249348-001 January 2001 Intel® Pentium® 4 Processor in the 423-pin Package Thermal-Mechanical Support Design Guide Version 1.0 DISCLAIMERS


    Original     		423-pin motherboard pentium 4 Pentium 4 Processor atx chassis design guide heat and mass transfer motherboard intel pentium 4 Intel confidential design documents "pentium 4 Processors" pentium 4 INTEL confidential pentium intel motherboard design PDF

    478 SOCKET PIN LAYOUT

    Abstract: Intel socket 478 PIN LAYOUT 478 SOCKET PINOUT 478 SOCKET pentium m 740 laptop motherboard testing points mpga478b motherboard component layout 478 processor pinout datasheet laptop processor socket pin out hand movement based fan speed control
    Text: R Intel Pentium® 4 Processor in the 478-Pin Package Thermal Design Guidelines Design Guide August 2001 Document Number: 249889-001 ® ® Intel Pentium 4 Processor in the 478-Pin Package Thermal Design Guidelines R Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		478-Pin 478 SOCKET PIN LAYOUT Intel socket 478 PIN LAYOUT 478 SOCKET PINOUT 478 SOCKET pentium m 740 laptop motherboard testing points mpga478b motherboard component layout 478 processor pinout datasheet laptop processor socket pin out hand movement based fan speed control PDF

    6300ESB

    Abstract: intel package drawings thermal specifications Pentium II Xeon
    Text: Intel 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide February 2004 Order Number: 300682-001 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		6300ESB intel package drawings thermal specifications Pentium II Xeon PDF

    intel 845 MOTHERBOARD SERVICE MANUAL

    Abstract: intel 845 MOTHERBOARD MANUAL socket 478 motherboard manual PC 845 MOTHERBOARD SERVICE MANUAL 478 SOCKET PINOUT 478 processor pinout intel 845 MOTHERBOARD CIRCUIT Intel socket 478 PIN LAYOUT laptop motherboard resistors manual mpga478b motherboard
    Text: R Intel Pentium® 4 Processor in the 478-Pin Package Thermal Design Guidelines Design Guide May 2002 Document Number: 249889-003 ® ® Intel Pentium 4 Processor in the 478-Pin Package Thermal Design Guidelines R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		478-Pin intel 845 MOTHERBOARD SERVICE MANUAL intel 845 MOTHERBOARD MANUAL socket 478 motherboard manual PC 845 MOTHERBOARD SERVICE MANUAL 478 SOCKET PINOUT 478 processor pinout intel 845 MOTHERBOARD CIRCUIT Intel socket 478 PIN LAYOUT laptop motherboard resistors manual mpga478b motherboard PDF

    M32A

    Abstract: m32at
    Text: TM Intel EtherExpress PRO/100 Mobile CardBus Adapter User’s Guide For information on DOS, IBM OS/2, 32-bit ODI drivers, and Windows 3.x, and supplementary information on Windows 95, see the Windows Help file HELPDOCS.HLP on the Intel Installation Disk. Also view the README.TXT file


    Original     		PRO/100 32-bit 950/950a M32A m32at PDF

    FAR52

    Abstract: DFAR252 MON960 gdb960
    Text:  i960 Processor Tools License Guide Order Number: 614851-007 Revision Revision History Date -001 Original Issue. 06/93 -002 Revised for CTOOLS960 R4.5 and GNU/960 R2.4. 05/94 -003 Revised for CTOOLS960 R4.6, GNU/960 R4.6, and MON960 R2.1. 11/94 -004 Revised for CTOOLS R5.0 and MON960 R3.0.


    Original     		CTOOLS960 GNU/960 MON960 FAR52 DFAR252 gdb960 PDF

    82801DB

    Abstract: ICH4 intel 82801DB thermal specifications ICH4 Datasheet 82870P2 ATA-33 P64H2 82870P2 64-bit Hub 2 bga thermal cycling reliability
    Text: R Intel 82801DB I/O Controller Hub 4 ICH4 Design Guide Intel® 82801DB ICH4 Thermal and Mechanical Design Guidelines October 2002 Document Number: 298651-002 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		82801DB ICH4 intel 82801DB thermal specifications ICH4 Datasheet 82870P2 ATA-33 P64H2 82870P2 64-bit Hub 2 bga thermal cycling reliability PDF

    DFAR252

    Abstract: MON960
    Text: i960 Processor Tools License Guide Order Number: 614851-006 Revision Revision History Date -001 Original Issue. 06/93 -002 Revised for CTOOLS960 R4.5 and GNU/960 R2.4. 05/94 -003 Revised for CTOOLS960 R4.6, GNU/960 R4.6, and MON960 R2.1. 11/94 -004 Revised for CTOOLS R5.0 and MON960 R3.0.


    Original     		CTOOLS960 GNU/960 MON960 FAR52 DFAR252 PDF