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    INTEL PIN GRID ARRAY PACKAGE Search Results

    INTEL PIN GRID ARRAY PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    INTEL PIN GRID ARRAY PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


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    88 lead cpga

    Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
    Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING PDF

    Communication Network Riser

    Abstract: dvo connector 815E ATA100 Pentium III Developer
    Text: product brief Intel 815E Scalable Performance Board Development Kit Product Highlights Evaluation Board • Scalable performance supporting processors in a 370-pin Flip-Chip Pin Grid Array FC-PGA or (FC-PGA2) package from the Intel® Celeron® processor at 566 MHz to the


    Original     		370-pin USA/0901/5K/IL11188C Communication Network Riser dvo connector 815E ATA100 Pentium III Developer PDF

    EIA-364-53

    Abstract: PGA370 amp pga socket MP-AX166BCD703 EIA-364-32 PGA 370 PGA zif socket EIA-364-17 augat
    Text: ZIF Socket PGA 370 DESCRIPTION/APPLICATION Thomas & Betts’ new Augat PGA 370 Socket is Intel® qualified. The lever actuated zero LAZ insertion force pin grid array (PGA) sockets allows PC end-users to upgrade their Intel® based Celeron machines. This highly acclaimed


    Original     		excelle-364-21 EIA-364-30 EIA-364-17 EIA-364-32 EIA-364-31 EIA-364-56 MP-AX166BCD703 OEMD31 MG-8/99/2 EIA-364-53 PGA370 amp pga socket MP-AX166BCD703 PGA 370 PGA zif socket augat PDF

    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


    Original     		A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package PDF

    outline of the heat slug for JEDEC

    Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


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    ppga package

    Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


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    ADV9614

    Abstract: Glass Seal PGA
    Text: CUSTOMER ADVISORY GLASS SEAL PGA Overview In 1993 Altera converted its 68-, 84-, and 100-pin solder-seal Pin Grid Array PGA packages to a glass-sealed PGA package. However, since Altera acquired the Intel product line in 1994 the company has been supporting orders for the solder seal PGA package. Going forward, Altera


    Original     		100-pin MIL-STD-883, 9626C) ADV9614 ADV9614 Glass Seal PGA PDF

    Matthey

    Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, Matthey sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap PDF

    tucker

    Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, tucker CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1 PDF

    Robinson Nugent pga

    Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, Robinson Nugent pga burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa PDF

    Intel 1702 eprom

    Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
    Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC


    Original     		CH02LINK Intel 1702 eprom 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28 PDF

    INTEL 28F640

    Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
    Text: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3 PDF

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


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    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


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    sl5l5

    Abstract: KC80526LY400256 Pentium 3 SL52R FSB 800 PRESCOTT 800 GC80503CS166EXT/SL3B8 SY028 SY016 GC80503CS166EXT KC80526LY400256 SL546 GC80503CSM66166
    Text: Infrastructure Processor Division IA Product Line Overview November 1, 2004 Curt Durrant Copyright 2004 Intel Corporation The Intel logo and Intel are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United states and other countries.


    Original     		E7520 E7320 E7501 E7501 sl5l5 KC80526LY400256 Pentium 3 SL52R FSB 800 PRESCOTT 800 GC80503CS166EXT/SL3B8 SY028 SY016 GC80503CS166EXT KC80526LY400256 SL546 GC80503CSM66166 PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


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    transistor b 1238

    Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension
    Text: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA*) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than


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    uFCBGA 478 pin

    Abstract: Chipsets mpga478 RJ80530VY400256 RK80530RY009256 810E2 RJ80530 FV80524RX366128 celeron 815 RB80526RX566128
    Text: Intel R Celeron(R) Processors for Embedded Computing US Home | Intel Worldwide Where to Buy | Training & Events | Contact Us | About Intel Advanced Hardware Design Products Processors Embedded Components Embedded Intel Architecture Processors Intel® Celeron®


    Original     		478-pin 478-pin 370-pin 440MX 440BX uFCBGA 478 pin Chipsets mpga478 RJ80530VY400256 RK80530RY009256 810E2 RJ80530 FV80524RX366128 celeron 815 RB80526RX566128 PDF

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays PDF

    FV80524RX366128

    Abstract: RB80526RY850128 RB80526RX566128 celeron 566 celeron 850 FV80524RX300128 FV80524RX433128 FC-PGA 370 intel 440bx intel 810 chipset
    Text: product brief Intel Celeron® Processors for Applied Computing Celeron® Processor Product Highlights Performance • 300, 366, 433, 566, 733, 850 MHz, and 1.2 GHz processor speeds ■ 32K L1 cache 16K code and 16K data ■ 128K integrated L2 cache; 256K for 1.2 GHz


    Original     		440BX 815/E, 810E2 USA/0901/5K/IL11188D FV80524RX366128 RB80526RY850128 RB80526RX566128 celeron 566 celeron 850 FV80524RX300128 FV80524RX433128 FC-PGA 370 intel 440bx intel 810 chipset PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    82915g motherboard

    Abstract: Intel 915G 82915GV 915Gv BGA PACKAGE thermal profile lga775 intel 82915gl PENTIUM4 intel 915gv components 915PL ICH6
    Text: R Intel 915G/915GV/915GL/910GL Express Chipset Thermal Design Guide For the Intel® 82915G/82915GV/82915GL, 82910GL Graphics and Memory Controller Hub GMCH February 2005 Document Number: 301469-006 R THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES,


    Original     		915G/915GV/915GL/910GL 82915G/82915GV/82915GL, 82910GL 915G/915GV/910GL 82915g motherboard Intel 915G 82915GV 915Gv BGA PACKAGE thermal profile lga775 intel 82915gl PENTIUM4 intel 915gv components 915PL ICH6 PDF

    Chomerics T710

    Abstract: PHC029C02012 845 motherboard foxconn motherboard intel 845 845 motherboard circuit a1349 INTEL 845 sdr 845 motherboard check point ICH2
    Text: R Intel 845 Chipset Thermal and Mechanical Design Guidelines Design Guide September 2001 Document Number: 298586-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		A65066-001 A67031-001 A61203-001 A13494-005 HB96030-DW A67625-001 PHC029C02012 Chomerics T710 PHC029C02012 845 motherboard foxconn motherboard intel 845 845 motherboard circuit a1349 INTEL 845 sdr 845 motherboard check point ICH2 PDF