INTEL PACKAGING HANDBOOK Search Results

INTEL PACKAGING HANDBOOK Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance
XPH2R106NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
XPH3R206NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
TPH4R008QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N)

INTEL PACKAGING HANDBOOK Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
PLCC 68 intel package dimensions Abstract: 240800 intel packaging handbook 240800 MCS-96 N80C196KR INTEL PLCC 68 dimensions n80c196 Intel mcs-40 MCS-51 intel 68 PLCC Text: MCS -51 and MCS -96 Packaging Information November 1994 Order Number 272118-001 COPYRIGHT INTEL CORPORATION 1995 1 Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or copyright for sale and use of Intel products except as provided in	Original	MCS-51 MCS-96 84-LEAD 44-Lead 68-Lead 52-Lead 84-Lead PLCC 68 intel package dimensions 240800 intel packaging handbook 240800 N80C196KR INTEL PLCC 68 dimensions n80c196 Intel mcs-40 intel 68 PLCC	PDF
MCS-96 Abstract: 240800 intel packaging handbook 240800 PLCC 68 intel package dimensions intel HANDBOOK MCS-51 MCS 48 Intel 100 pin PQFP dimension mcs 96 rohs MCS-96 datasheet Text: MCS -51 and MCS ®-96 Packaging Information July 2004 Order Number: 272118-002 1 COPYRIGHT INTEL CORPORATION: 2004 Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in	Original	MCS-51 MCS-96 44/52/68/84-LEAD 44-Lead 68-Lead 52-Lead 84-Lead 240800 intel packaging handbook 240800 PLCC 68 intel package dimensions intel HANDBOOK MCS 48 Intel 100 pin PQFP dimension mcs 96 rohs MCS-96 datasheet	PDF
intel packaging handbook 240800 Abstract: Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging Text: 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM CH08WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 8 MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.1. INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and	Original	CH08WIP intel packaging handbook 240800 Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging	PDF
intel DOC Abstract: Intel Environmental Standards handbook BRD22 shicoh intel HANDBOOK c0180-018-0250 Text: 80960 RM/RN 42.5 mm H-PBGA SHOCK TEST REPORT FOR HEATSINK THERMAL SOLUTIONS Test Performed by Kimberly Harth and Eric Gelvin, Intel Corporation CEG Packaging Engineering March 1999 Purpose The purpose of the board-level mechanical testing for the 80960 RM/RN is to determine that there is no	Original		PDF
87C196KN Abstract: intel embedded microcontroller handbook 8XC196KC Users manual 87C196KD Users manual MCS51 Manual 87C196KD20 8XC196KC Users Guide 8XC196KD users manual 87C196MH MCS-96 Users guide Text: ZapCode II Handbook A Guide to Electronic ROM-code Transmittal ZapCode II Handbook December 1995 Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of	Original		PDF
JESD94 Abstract: intel 8008 intel 8008 cpu QSC chipsets Projects assembly 8086 intel INTEL 1980 ssqa Free Projects with assembly language 8086 Intel Environmental Standards handbook INTEL LOT NUMBER code label Text: Intel Quality System Handbook September 2008 IQS Handbook Revision History Date Disclaimers Revision Notes September 2008 3.0 Added 48/14 content, completed other minor edits August 2006 2.0 Updated corporate mission, modiﬁed section 7.2.3, revised typography	Original		PDF
transport media and packing Abstract: ic shelf life Ultrasonic cleaner circuit diagram MIL-B-81705 moisture sensitive handling and packaging PQFP moisture sensitive handling and packaging IPC-SM-786 IPC-SM-786A PLCC 68 intel package dimensions smt 28rh Text: CHAPTER 8 MOISTURE SENSITIVITY DESICCANT PACKING HANDLING OF PSMCs INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and establishes preconditioning flows which encompasses moisture absorption thermal stress and	Original		PDF
pioneer PAL 007 A Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions	Original		PDF
TSOP-48 pcb LAYOUT Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010 Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions	Original		PDF
land pattern for TSOP 2-44 Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions	Original		PDF
PAL 007 pioneer Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56 Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions	Original		PDF
a5657 Abstract: DOD Handbook 263 CERAMIC PIN GRID ARRAY CPGA lead frame diode databook tote design technology Text: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD	Original	yo980. a5657 DOD Handbook 263 CERAMIC PIN GRID ARRAY CPGA lead frame diode databook tote design technology	PDF
a5657 Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame EOS ESD S 61.1 ZIF socket design guidelines Text: Component Handling Precaution 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD	Original		PDF
a5657 Abstract: EOS ESD S 61.1 A5655 transistor databook st 2000 Packaging Text: ESD/EOS 6.1 ESD 6.1.1 Electrostatic Discharge ESD 6 Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD can occur in the manufacturing, shipping, receiving, and field handling of integrated circuits or	Original		PDF

MLT 22 522 Abstract: DA82562ET 82562ET AC97 100BASE-TX Intel Express Text: 82562ET 10/100 Mbps Platform LAN Connect PLC Networking Silicon Datasheet Product Features • ■ ■ ■ ■ ■ ■ ■ IEEE 802.3 10BASE-T/100BASE-TX compliant physical layer interface IEEE 802.3u Auto-Negotiation support Digital Adaptive Equalization control	Original	82562ET 10BASE-T/100BASE-TX 10BASE-T 48-pin ADV10 82562ET SSOP48 MLT 22 522 DA82562ET AC97 100BASE-TX Intel Express	PDF
Untitled Abstract: No abstract text available Text: 82562EP 10/100 Mbps Platform LAN Connect PLC Networking Silicon Datasheet Product Features IEEE 802.3 10BASE-T/100BASE-TX compliant physical layer interface IEEE 802.3u Auto-Negotiation support Digital Adaptive Equalization control Link status interrupt capability	Original	82562EP 10BASE-T/100BASE-TX 10BASE-T 64-pin A36414-004	PDF
cash box guard with procedure minor project Abstract: cash box guard project with procedure hydrofluoric acid computer motherboard Refurbishing reverse osmosis chiquita stress among student york chillers I300I roundup eco Text: Commitment Around the Globe Designing for the Future Environmental, Health and Safety Performance Report Printed April 1999 www.intel.com Designing for the Future Table of Contents This year’s report is printed on recycled and recyclable paper. Each year we test new technologies in sustainable paper	Original	0499/30K/DS/KG/LS/MP CH10-22 cash box guard with procedure minor project cash box guard project with procedure hydrofluoric acid computer motherboard Refurbishing reverse osmosis chiquita stress among student york chillers I300I roundup eco	PDF
PC82562EP Abstract: RC82562 82562EP 82562EZ Text: 82562EP 10/100 Mbps Platform LAN Connect PLC Networking Silicon Datasheet Product Features • ■ ■ ■ ■ ■ ■ ■ IEEE 802.3 10BASE-T/100BASE-TX compliant physical layer interface IEEE 802.3u Auto-Negotiation support Digital Adaptive Equalization control	Original	82562EP 10BASE-T/100BASE-TX 10BASE-T 64-pin an62EP PC82562EP RC82562 82562EZ	PDF
motherboard canada ices 003 class b DDR Abstract: motherboard canada ices 003 class b IOP80219 motherboard canada ices-003 class b intel ss4000-e motherboard FC ICES 003 CLASS B SS4000-E System Board D40818-201 motherboard canada ices-003 motherboard intel ices-003 class b Text: Intel Entry Storage System SS4000-E Technical Product Specification Hardware Intel Order D42567-001 Revision 1.1 Storage Systems Group Marketing Table of Contents Intel® Entry Storage System SS4000-E Revision History Date Dec 1, 2005 Revision Number	Original	SS4000-E D42567-001 motherboard canada ices 003 class b DDR motherboard canada ices 003 class b IOP80219 motherboard canada ices-003 class b intel ss4000-e motherboard FC ICES 003 CLASS B SS4000-E System Board D40818-201 motherboard canada ices-003 motherboard intel ices-003 class b	PDF
ShineTsu G-749 Abstract: intel packaging handbook 240800 AD1021 600E 733B PGA370 XTS454 273325 G749 G-749 Text: Intel Pentium® III Processor Thermal Design Guide Application Note December 2001 Order Number: 273325-004 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual	Original		PDF
80286 80386 80486 microprocessor features Abstract: intel 8086 internal structure intel 8080 family Free Projects with assembly language 8086 210997 intel traceability code intel advanced flash esd level comprehensive intel 80486 architecture INTRODUCTION The material and process technology steps used to Text: D Intel’s Quality System 1998 Order Number 210997-007 3/23/98 10:37 AM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in	Original		PDF
LOG TX2 1108 Abstract: mu-2f ST 78L05A LM386 speaker mu2f 89C024 C14S4 intel PLD LM386 LOW POWER AUDIO AMPLIFIER IC- BLOCK DIAGRAM AND PINOUT 89c026 Text: INTEL CORP MEMORY/PLD/ bfiE D • MÔ2bl7b DDÔSDST Sfi2 ■ ITL2 in t e l 89C124FX DATA/FAX MODEM CHIP SET ■ 9600 bps Send and Receive FAX ■ On-Chip Hybrid ■ V.29 and V.27ter Compatible ■ DTMF and Pulse Dialing ■ Supports Communicating Applications	OCR Scan	89C124FX 27ter EIA/TIA-578 22bis, 42bis LOG TX2 1108 mu-2f ST 78L05A LM386 speaker mu2f 89C024 C14S4 intel PLD LM386 LOW POWER AUDIO AMPLIFIER IC- BLOCK DIAGRAM AND PINOUT 89c026	PDF
80376 Abstract: block diagram for intel 82C59A 82380 82370 intel 82C59A 29018 dram refresh Text: 82370 INTEGRATED SYSTEM PERIPHERAL • High Performance 32-Bit DMA Controller for 16-Blt Bus — 16 MBytes/Sec Maximum Data Transfer Rate at 16 MHz — 8 Independently Programmable Channels ■ 20-Source Interrupt Controller — Individually Programmable Interrupt	OCR Scan	32-Bit 16-Blt 20-Source 82C59A 16-Bit 82C54 100-Pin 132-Pin 80376 block diagram for intel 82C59A 82380 82370 intel 82C59A 29018 dram refresh	PDF
89C124FX Abstract: 240800 Text: intei ß fö g y B M M V 89C124FX DATA/FAX MODEM CHIP SET 9600 bps Send and Receive FAX On-Chip Hybrid V.29 and V.27ter Compatible DTMF and Pulse Dialing Supports Communicating Applications Specification CAS Automatic Speed Matching In Reliable and Normal Modes	OCR Scan	89C124FX RS-232/V 28-Lead 64-Lead 89C126FX" 68-Lead 80-Lead 27ter 240800	PDF

INTEL PACKAGING HANDBOOK Search Results

INTEL PACKAGING HANDBOOK Result Highlights (5)

INTEL PACKAGING HANDBOOK Datasheets Context Search

PLCC 68 intel package dimensions

MCS-96

intel packaging handbook 240800

intel DOC

87C196KN

JESD94

transport media and packing

pioneer PAL 007 A

TSOP-48 pcb LAYOUT

land pattern for TSOP 2-44

PAL 007 pioneer

a5657

a5657

a5657

MLT 22 522

Untitled

cash box guard with procedure minor project

PC82562EP

motherboard canada ices 003 class b DDR

ShineTsu G-749

80286 80386 80486 microprocessor features

LOG TX2 1108

80376

89C124FX