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    INTEL BGA SOLDER Search Results

    INTEL BGA SOLDER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    INTEL BGA SOLDER Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    EMB-9670

    Abstract: rg82855gme fw82801db fw82801db intel Intel RG82855GME RG82855 Intel FW82801DB 82855gme RTL8101L 82801DB
    Text: EMB-9670 Supports Intel Pentium®M / Celeron® M CPU Intel® 855GME Pentium® M / Celeron® M ITX Main Board  1 DIMM up to 1 GB DDR SDRAM HDWXUHV n Supports 90 nm Intel® FC-PGA 478 / μFC-BGA 479 Pentium® M / Celeron® M CPU n Intel® 82855GME Chipset


    Original     		EMB-9670 855GME 82855GME 16-bit RG82855GME 44-pin 40-pin 82562ET RTL8101L, 82551QM/82551ER EMB-9670 rg82855gme fw82801db fw82801db intel Intel RG82855GME RG82855 Intel FW82801DB RTL8101L 82801DB PDF

    rg82855gme

    Abstract: FW82801DB Intel RG82855GME EMB-9676 RG82855 82855gme fw82801db chipset fw82801db intel FW82801 dvi to lvds
    Text: EMB-9676 1 DIMM up to 1 GB DDR SDRAM Intel 855GME Pentium® M / Celeron® M Mini ITX Motherboard Supports Intel® Pentium® M / Celeron® M CPU Features n Supports 90nm Intel® µFC-PGA 478 / µFC-BGA 479 Pentium® M / Celeron® M CPU n Intel® 855GME / ICH4 Chipset


    Original     		EMB-9676 855GME 184-pin RG82855GME RTL8110S 44-pin 40-pin 16-bit rg82855gme FW82801DB Intel RG82855GME EMB-9676 RG82855 82855gme fw82801db chipset fw82801db intel FW82801 dvi to lvds PDF

    ICH8M

    Abstract: t7400 ALC883 GM965 RTL8111B ECM-GM965 gme965 lvds 1920 AC97 W83627HG-AW
    Text: ECM-GM965 3.5" Intel GME965 Core 2 Duo Micro Module LAN 2 LAN 1 DIO VGA COM 2 Features n Supports 65nm Intel® µFC-PGA 478 / µFC-BGA 479 CoreTM 2 Duo CPU COM 1 n Intel® GME965 / ICH8-M Chipset n One 200-pin SODIMM up to 2 GB DDR2 SDRAM CF Socket solder side


    Original     		ECM-GM965 GME965 200-pin RTL8111B GME965 44-pin Du920 ICH8M t7400 ALC883 GM965 ECM-GM965 lvds 1920 AC97 W83627HG-AW PDF

    Intel 80C188 emulator

    Abstract: intel 80188 intel 80c188 similar ic book Intel BGA Solder free circuit logic analyzer 80C186 80C188
    Text: ACCESSORIES/ADAPTERS EMULATION TECHNOLOGY, INC. Intel Emulator Adapters, Test Clips and Accessories • ■ ■ ■ ■ ■ ■ ■ Over 100 Different Intel Adapters Available Ball Grid Array BGA Support Surface Mountable or Clip-On Versions Available PQFP Test Clips Available to Test


    Original     		Intel386TM, Intel486TM 80C186, 80C186XL/EA/EB/EC, 80L186EA/EB/EC, 80C188, 80C188XL/EA/EB/EC, 80L188EA/EB/EC, Intel386 Intel486 Intel 80C188 emulator intel 80188 intel 80c188 similar ic book Intel BGA Solder free circuit logic analyzer 80C186 80C188 PDF

    fcbga package weight

    Abstract: Thermagon PBGA-B495 shinetsu fcBGA PACKAGE thermal resistance Thermagon t pad Intel Mobile Celeron Processor BGA T-PCM27-94 shin-etsu G-749
    Text: Thermal Design Guideline for Intel Processors in the BGA2 and Micro FC-BGA Packages for Embedded Applications April 2002 Order Number: 273716-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		EID-LPT-ALX-003 EID-LPT-ALX-004 EID-LPP3-ALX-001 fcbga package weight Thermagon PBGA-B495 shinetsu fcBGA PACKAGE thermal resistance Thermagon t pad Intel Mobile Celeron Processor BGA T-PCM27-94 shin-etsu G-749 PDF

    rg82855gme

    Abstract: Intel RG82855GME FW82801DB fw82801db chipset fw82801db intel r5c551 ECM-5716 Chrontel CH7301C 82855GME EE-S5
    Text: ECM-5716 5.25" Intel 855GME Pentium® M / Celeron® M Mini Module Features 2 USB 2.0 COM 1 n Supports 90nm Intel® FC-PGA 478 / μFC-BGA 479 Pentium® M / Celeron® M CPU LPT VGA n Intel® 82855GME Chipset FDD n One 184-Pin DIMM up to 1 GB DDR SDRAM with ECC Supported


    Original     		ECM-5716 855GME 82855GME 184-Pin IEEE-1394A R5C551 82562ET 82551ER 82541ER rg82855gme Intel RG82855GME FW82801DB fw82801db chipset fw82801db intel r5c551 ECM-5716 Chrontel CH7301C EE-S5 PDF

    intel 775 motherboard diagram

    Abstract: celeron MOTHERBOARD CIRCUIT diagram PC MOTHERBOARD intel 815 circuit diagram BGA PACKAGE TOP MARK intel Intel 865 F Chipset intel celeron Block Diagram 273804 BP 109 ir sensor datasheet celeron processor intel p4 motherboard power supply circuit diagram
    Text: Ultra-Low Voltage Intel Celeron® Processor 0.13 µ in the Micro FC-BGA Package at 650 MHz and 400 MHz Datasheet Product Features • ■ ■ ■ ■ ■ ■ Ultra-Low Voltage Intel® Celeron® Processor (0.13µ) with the following processor core/bus speeds:


    Original     		16-Kbyte 256-Kbyte) intel 775 motherboard diagram celeron MOTHERBOARD CIRCUIT diagram PC MOTHERBOARD intel 815 circuit diagram BGA PACKAGE TOP MARK intel Intel 865 F Chipset intel celeron Block Diagram 273804 BP 109 ir sensor datasheet celeron processor intel p4 motherboard power supply circuit diagram PDF

    Untitled

    Abstract: No abstract text available
    Text: Ultra-Low Voltage Intel Celeron® Processor 0.13 µ in the Micro FC-BGA Package at 650 MHz and 400 MHz Datasheet Product Features • ■ ■ ■ ■ ■ ■ Ultra Low Voltage Intel® Celeron® Processor (0.13µ) with the following processor core/bus speeds:


    Original     		16-Kbyte 256-Kbyte) PDF

    diagram motherboard

    Abstract: free circuit diagram of intel 865 motherboard microprocessors architecture of 8151 intel 775 motherboard diagram intel celeron Block Diagram PC intel 865 MOTHERBOARD CIRCUIT diagram 82443MX CK-408 MLF2012A4R7KT
    Text: Ultra-Low Voltage Intel Celeron® Processor 0.13 µ in the Micro FC-BGA Package at 650 MHz and 400 MHz Datasheet Product Features • ■ ■ ■ ■ ■ ■ Ultra-Low Voltage Intel® Celeron® Processor (0.13µ) with the following processor core/bus speeds:


    Original     		16-Kbyte 256-Kbyte) diagram motherboard free circuit diagram of intel 865 motherboard microprocessors architecture of 8151 intel 775 motherboard diagram intel celeron Block Diagram PC intel 865 MOTHERBOARD CIRCUIT diagram 82443MX CK-408 MLF2012A4R7KT PDF

    heller 1700

    Abstract: BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse
    Text: APPLICATION NOTE Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide April 1998 Order Number: 243759-001 Mobile Pentium ® II Processor Mini-Cartridge 240-Pin BGA Connector Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		240-Pin heller 1700 BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse PDF

    INTEL fcBGA PACKAGE thermal resistance

    Abstract: fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide"
    Text: Ultra Low Voltage Intel Celeron® Processor in the Micro FC-BGA Package Thermal Design Guide October 2002 Order Number: 273802-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		PL1664-65) INTEL fcBGA PACKAGE thermal resistance fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide" PDF

    INTEL 28F640

    Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
    Text: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3 PDF

    intel 80251

    Abstract: 80251 ic intel 8051 intel 80196 intel 8031 datasheet 80196 intel 8031 intel 80196 microcontroller 80196 microcontroller controller intel 80196 family
    Text: EMULATORS EMULATION TECHNOLOGY, INC. Intel Emulator Adapters, Test Clips and Accessories • ■ ■ ■ ■ ■ ■ ■ Over 100 Different Adapters Available Ball Grid Array BGA Support Surface Mountable or Clip-On Versions Available PQFP Test Clips Available to Test


    Original     		80196KB/KC/KD, intel 80251 80251 ic intel 8051 intel 80196 intel 8031 datasheet 80196 intel 8031 intel 80196 microcontroller 80196 microcontroller controller intel 80196 family PDF

    BGA PACKAGE TOP MARK intel

    Abstract: intel BGA PACKAGE TOP MARK BGA PACKAGE TOP MARK CG-041493 Intel BGA Solder bga intel
    Text: E PRELIMINARY Mechanical Specification for Easy BGA Package March 1999 Revision: 2.0 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in


    Original     		32-Mb 64-Mb 128-Mb BGA PACKAGE TOP MARK intel intel BGA PACKAGE TOP MARK BGA PACKAGE TOP MARK CG-041493 Intel BGA Solder bga intel PDF

    pci1420pdv

    Abstract: 430TX 82365SL PCI1420 PCI1420GHK PCI1420PDVG4
    Text: PCI1420 GHK/PDV www.ti.com SLLA228 – MONTH 2003 PC Card Controllers FEATURES • • • • • • • • • Fully compatible with the Intel 430TX Mobile Triton II chipset A 208-pin Low-Profile QFP (PDV), 209-terminal MicroStar BGA™ package (GHK), or the 209-terminal lead-free (Pb,


    Original     		PCI1420 SLLA228 430TX 208-pin 209-terminal 16-bit TPS2206/2216 pci1420pdv 430TX 82365SL PCI1420GHK PCI1420PDVG4 PDF

    PV14 schematic diagram

    Abstract: SIS 650 sis 962l quanta NBC3801 SiS302ELV varistor SEN 470K D7 01ub B220LFA NBC107
    Text: 1 2 3 VM5 MLB 4 5 6 7 8 01 CPU Thermal INTEL P4 SOCKET-478 Block Diagram P29 Thermal sensor & Fan P3 P4 P5 A A HostBus CRT CRT DDC2B NB SIS 650 DDR 2100MB/s (133MHz) Memory 1x D-SUB 15-Pin P11 VB 12bit VA 12bit (702 PIN BGA) P14 P15 P16 P6 P7 P8 P9 LVDS


    Original     		SOCKET-478) 15-Pin 2100MB/s 133MHz) 12bit 12bit SIS302ELV 266MHz 133MB/s 33MHZ) PV14 schematic diagram SIS 650 sis 962l quanta NBC3801 varistor SEN 470K D7 01ub B220LFA NBC107 PDF

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF

    intel packaging handbook 240800

    Abstract: hot wire mass airflow sensor heat pipes intel tuflok 43537 data sheet IC 7408 drawn pin configuration of ic 7408 stamford voltage regulator 82439HX EMBMOD133
    Text: Intel Embedded Processor Module Thermal Design Guide Application Note June 1998 Order Number: 273143-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		IASK9801 NP970255 intel packaging handbook 240800 hot wire mass airflow sensor heat pipes intel tuflok 43537 data sheet IC 7408 drawn pin configuration of ic 7408 stamford voltage regulator 82439HX EMBMOD133 PDF

    PF38F4050L0YBQ0

    Abstract: R2528 PF38F4050 RD48F4400 RD48F4400L0 Intel SCSP GE28F256K18C PF48F4400L NP378 PF48F4400L0
    Text: Listing of Tools US Home | Intel Worldwide Where to Buy | Training & Events | Contact Us | About Intel Search Developer site Enter keywords Electronic Tools Catalog: Intel Flash Memory Components Intel® Flash Memory Programmer Intel Corp. FPG Architecture: Flash Memory Components


    Original     		RD38F3350WWZDQ1 FPRO2SCSP96Q FP2INSCSP2648 R26481X) PF38F4050L0YBQ0 R2528 PF38F4050 RD48F4400 RD48F4400L0 Intel SCSP GE28F256K18C PF48F4400L NP378 PF48F4400L0 PDF

    intel packaging handbook 240800

    Abstract: heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759
    Text: A AP-759 APPLICATION NOTE Intel Embedded Processor Module EMBMOD133 Thermal Design Guide December, 1997 Order Number: 273143-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		AP-759 EMBMOD133) Inte31 intel packaging handbook 240800 heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759 PDF

    BGA 256 PACKAGE power dissipation

    Abstract: capacitance in BGA package BGA 256 PACKAGE thermal resistance bga Crack Intel BGA Solder
    Text: Technical Notes December 8, 1997 Revision 1.0 THERMAL, ELECTRICAL AND MECHANICAL CONSIDERATIONS IN APPLYING BGA TECHNOLOGY TO A DESIGN ABSTRACT This document briefly discusses the thermal, mechanical and electrical design considerations associated with using ball-grid array components.


    Original     		com/design/i960/packdata/2451 BGA 256 PACKAGE power dissipation capacitance in BGA package BGA 256 PACKAGE thermal resistance bga Crack Intel BGA Solder PDF

    J-STD-013

    Abstract: AP-399 pad DIAGRAM for RJ45 on pc board Pulse bob smith termination electrical fast transient testing 82559 printed circuit board AD30 H1012 A5829-01 82559based
    Text: 82559 Printed Circuit Board PCB Design Application Note (AP-399) Revision 1.0 January 1999 Order Number: 739073-001 Revision History Revision Date Revision Description Jan. 1999 1.0 First Release Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		AP-399) J-STD-013 AP-399 pad DIAGRAM for RJ45 on pc board Pulse bob smith termination electrical fast transient testing 82559 printed circuit board AD30 H1012 A5829-01 82559based PDF

    810 MOTHERBOARD CIRCUIT diagram

    Abstract: intel 810 MOTHERBOARD pcb CIRCUIT diagram intel 810 MOTHERBOARD pcb CIRCUIT flotherm Intel BGA intel MOTHERBOARD pcb CIRCUIT diagram 82801AA 82801AB 82810-DC100 AP-589
    Text: Intel 810 Chipset: Thermal Design Considerations Application Note AP-670 June 1999 Order Number: 292228-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		AP-670 810 MOTHERBOARD CIRCUIT diagram intel 810 MOTHERBOARD pcb CIRCUIT diagram intel 810 MOTHERBOARD pcb CIRCUIT flotherm Intel BGA intel MOTHERBOARD pcb CIRCUIT diagram 82801AA 82801AB 82810-DC100 AP-589 PDF

    82801DB

    Abstract: ICH4 intel 82801DB thermal specifications ICH4 Datasheet 82870P2 ATA-33 P64H2 82870P2 64-bit Hub 2 bga thermal cycling reliability
    Text: R Intel 82801DB I/O Controller Hub 4 ICH4 Design Guide Intel® 82801DB ICH4 Thermal and Mechanical Design Guidelines October 2002 Document Number: 298651-002 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		82801DB ICH4 intel 82801DB thermal specifications ICH4 Datasheet 82870P2 ATA-33 P64H2 82870P2 64-bit Hub 2 bga thermal cycling reliability PDF