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    Infineon Technologies AG IGC193T120T8RMX1SA

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC193T120T8RMX1SA)
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    Avnet Americas IGC193T120T8RMX1SA Waffle Pack 20 Weeks 1,089
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    Untitled

    Abstract: No abstract text available
    Text: IGC193T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target applications Chip Type


    Original     		PDF IGC193T120T8RM IGC193T120T8RM L7713U, L7713O,

    Untitled

    Abstract: No abstract text available
    Text: IGC193T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target applications Chip Type


    Original     		PDF IGC193T120T8RM IGC193T120T8RM L7713U, L7713O,

    ff600r12me4

    Abstract: ff600r12me ff600r12me4_b11
    Text: IGC193T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target applications Chip Type


    Original     		PDF IGC193T120T8RM IGC193T120T8RM IEC62258-3: L7713U, L7713O, ff600r12me4 ff600r12me ff600r12me4_b11