IDSP02 Search Results

IDSP02 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Mil-Std-202F 215j Abstract: Polyimide Text: Polyimide Component Labels SPECIFICATION SHEET specifications Thermal transfer polyimide adhesive label material shall be specially designed for circuit board manufacturing where there will be direct contact with wave solder and IR flow. The label shall withstand flash temperatures as high as 617°F for up	Original	PDF	IDSP02 SA-IDSP02 Mil-Std-202F 215j Polyimide

Catalog Datasheet

MFG & Type

PDF

Document Tags

Mil-Std-202F 215j

Abstract: Polyimide
Text: Polyimide Component Labels SPECIFICATION SHEET specifications Thermal transfer polyimide adhesive label material shall be specially designed for circuit board manufacturing where there will be direct contact with wave solder and IR flow. The label shall withstand flash temperatures as high as 617°F for up

Original

PDF

IDSP02 SA-IDSP02 Mil-Std-202F 215j Polyimide