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    IC26 Search Results

    IC26 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TLV320AIC26IRHB Texas Instruments Low-Power Mono ADC/Stereo DAC With HP/Speaker Amplifier and 12-Bit Measurement ADC 32-VQFN -40 to 85 Visit Texas Instruments Buy
    TPIC2603DWG4 Texas Instruments 6-Channel Serial Interface Low-Side Driver 24-SOIC Visit Texas Instruments Buy
    TPIC2603DWR Texas Instruments 6-Channel Serial Interface Low-Side Driver 24-SOIC -40 to 125 Visit Texas Instruments Buy
    TLV320AIC26IRHBR Texas Instruments Low-Power Mono ADC/Stereo DAC With HP/Speaker Amplifier and 12-Bit Measurement ADC 32-VQFN -40 to 85 Visit Texas Instruments Buy
    TPIC2603DWRG4 Texas Instruments 6-Channel Serial Interface Low-Side Driver 24-SOIC Visit Texas Instruments Buy
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    IC26 Price and Stock

    Microchip Technology Inc MIC2606YML-TR

    IC REG BOOST ADJ 500MA 8MLF
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    DigiKey MIC2606YML-TR Reel 15,000 5,000
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    MIC2606YML-TR Cut Tape 5,234 1
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    MIC2606YML-TR Cut Tape 1,082 1
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    Mouser Electronics MIC2606YML-TR 1,836
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    Newark MIC2606YML-TR Reel 5,000
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    Microchip Technology Inc MIC2606YML-TR 170
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    NAC MIC2606YML-TR 10,000 1
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    Avnet Silica MIC2606YML-TR 13 Weeks 5,000
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    Master Electronics MIC2606YML-TR 5,000
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    Microchip Technology Inc MIC2619YD6-TR

    IC REG BOOST ADJ 350MA TSOT23-6
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    DigiKey MIC2619YD6-TR Reel 9,000 3,000
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    Mouser Electronics MIC2619YD6-TR 12,151
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    Newark MIC2619YD6-TR Cut Tape 6,096 1
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    Microchip Technology Inc MIC2619YD6-TR 1,313
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    NexGen Digital MIC2619YD6-TR 6,615
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    Avnet Silica MIC2619YD6-TR 10 Weeks 3,000
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    Chip1Stop MIC2619YD6-TR Cut Tape 203
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    EBV Elektronik MIC2619YD6-TR 8 Weeks 3,000
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    Microchip Technology Inc MIC26950YJL-TR

    IC REG BUCK ADJ 12A 28QFN
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    DigiKey MIC26950YJL-TR Reel 3,000 1,000
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    MIC26950YJL-TR Cut Tape 894 1
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    Avnet Americas MIC26950YJL-TR Reel 1,000
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    Mouser Electronics MIC26950YJL-TR 922
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    Microchip Technology Inc MIC26950YJL-TR 2,972
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    Avnet Silica MIC26950YJL-TR 8 Weeks 1,000
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    EBV Elektronik MIC26950YJL-TR 8 Weeks 1,000
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    Microchip Technology Inc MIC26901YJL-TR

    IC REG BUCK ADJ 9A 28QFN
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    DigiKey MIC26901YJL-TR Reel 2,000 1,000
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    MIC26901YJL-TR Cut Tape 608 1
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    Avnet Americas MIC26901YJL-TR Reel 1,000
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    Mouser Electronics MIC26901YJL-TR 731
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    Newark MIC26901YJL-TR Reel 1,000
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    Microchip Technology Inc MIC26901YJL-TR
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    NAC MIC26901YJL-TR 1,000
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    Avnet Silica MIC26901YJL-TR 7 Weeks 1,000
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    EBV Elektronik MIC26901YJL-TR 12 Weeks 1,000
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    Master Electronics MIC26901YJL-TR
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    Microchip Technology Inc MIC261201YJL-TR

    IC REG BUCK ADJ 12A 28QFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MIC261201YJL-TR Reel 1,000 1,000
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    MIC261201YJL-TR Cut Tape 683 1
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    Avnet Americas MIC261201YJL-TR Reel 4 Weeks 1,000
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    Mouser Electronics MIC261201YJL-TR 1,562
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    Newark MIC261201YJL-TR Reel 1,000
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    Microchip Technology Inc MIC261201YJL-TR 40,990
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    Avnet Silica MIC261201YJL-TR 6 Weeks 1,000
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    IC26 Datasheets (9)

    Part ECAD Model Manufacturer Description Curated Type PDF
    IC264-22501-1 Yamaichi Electronics Ball Grid Array (BGA, 1.50mm Pitch) Original PDF
    IC264-22501-1-MF Yamaichi Electronics Ball Grid Array (BGA, 1.50mm Pitch) Original PDF
    IC264-22501-NN-1 Yamaichi Electronics Ball Grid Array (BGA, 1.50mm Pitch) Original PDF
    IC264-22501-NN-1-MF Yamaichi Electronics Ball Grid Array (BGA, 1.50mm Pitch) Original PDF
    IC264-22501-NP-1 Yamaichi Electronics Ball Grid Array (BGA, 1.50mm Pitch) Original PDF
    IC264-22501-NP-1-MF Yamaichi Electronics Ball Grid Array (BGA, 1.50mm Pitch) Original PDF
    IC264-22501-PN-1 Yamaichi Electronics Ball Grid Array (BGA, 1.50mm Pitch) Original PDF
    IC264-22501-PN-1-MF Yamaichi Electronics Ball Grid Array (BGA, 1.50mm Pitch) Original PDF
    IC26 Chapter 7 2000 Philips Semiconductors Packint Methods for ICs Original PDF

    IC26 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    IC264

    Abstract: No abstract text available
    Text: IC264 - Open Top Ball Grid Array BGA Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: Contact Force: 1,000MΩ min. at 100V DC 100V AC for 1 minute 1 Ω max. at 10mA/20mV max.


    Original
    PDF IC264 10mA/20mV IC264-22501-1-* 50x14

    Untitled

    Abstract: No abstract text available
    Text: IC264 Series Open Top Ball Grid Array (BGA, 1.50mm Pitch) Part Number (Details) IC264 - 225 01 - 1 - * - MF Specifications 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 1 Ω max. at 10mA/20mV max.


    Original
    PDF IC264 10mA/20mV IC264-22501-1-* 50x14

    ic26

    Abstract: No abstract text available
    Text: 6/4/2014 IC26 Series DIP Dimensions | YAMAICHI ELECTRONICS Home | Site Map | Japanese | Our Worldwide Sites Search Dimension drawing Contact cross section Print board layout (Reference only) Table of dimensions Unit: mm Part Number No. of Contacts Pitch


    Original
    PDF IC26-0603-GG4 IC26-0803-GG4 IC26-1003-GG4 IC26-1403-GG4 IC26-1603-GG4 IC26-3606-GG4 IC26-4006-GG4 IC26-4206-GG4 IC26-4806-GG4 IC26-6409-GG4 ic26

    Untitled

    Abstract: No abstract text available
    Text: IC26_CHAPTER_4_2000_2.copy Page 1 Tuesday, May 23, 2000 12:51 PM CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 IC26_CHAPTER_4_2000_2.copy Page 2 Tuesday, May 23, 2000 12:51 PM Philips Semiconductors


    Original
    PDF MBK103

    Untitled

    Abstract: No abstract text available
    Text: BGA IC264 Series IC264-22501-1- *-* Socket Series Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: No. of Leads No Mark: Both Pins 1 & 2 PN: Only Pin 1 NP: Only Pin 2 NN: No Pins Pin Count 225 Material PEI Glass Filled UL94V-0


    Original
    PDF IC264 IC264-22501-1- 1000M 10mA/20mV UL94V-0 IC264-22501-1

    Untitled

    Abstract: No abstract text available
    Text: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS166I April 2001 – Revised January 2006 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not


    Original
    PDF TMS320VC5502 SPRS166I TMS320VC5502 SPRS166I SPRS166H

    Untitled

    Abstract: No abstract text available
    Text: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS166H April 2001 – Revised November 2004 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not


    Original
    PDF TMS320VC5502 SPRS166H TMS320VC5502 SPRS166H SPRS166G

    SD 5143

    Abstract: 5509A SPRS205K TMS320VC5509A XDS510 PORT14
    Text: TMS320VC5509A Fixed-Point Digital Signal Processor Data Manual Literature Number: SPRS205K November 2002 − Revised January 2008 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments


    Original
    PDF TMS320VC5509A SPRS205K SPRS205J SPRS205K. SD 5143 5509A SPRS205K XDS510 PORT14

    TMS320

    Abstract: TMS320C5000 TMS320VC5501 TMS320VC5502 XDS510 Analog devices catalog 5502 mcbsp
    Text: TMS320VC5502 Fixed-Point Digital Signal Processor Data Manual PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.


    Original
    PDF TMS320VC5502 SPRS166K SPRS166J SPRS166K TMS320 TMS320C5000 TMS320VC5501 TMS320VC5502 XDS510 Analog devices catalog 5502 mcbsp

    circuit diagram for 7.1 home theatre amplifier

    Abstract: simple 5.1 home theatre amplifier circuit diagram with usb philips home theatre tea7000 5.1 home theatre audio system diagram for making 7.1 home theatre schematic diagram SmD TRANSISTOR 1fs circuit schematic for wireless headphone with mic schematic diagram of bluetooth headphone circuit for 7.1 home theatre system
    Text: SAA8200HL Ensation Base integrated wireless audio baseband Rev. 02 — 17 October 2005 Preliminary data sheet 1. General description The Ensation Base, SAA8200HL, is part of the integrated wireless audio system chip set offered by Philips. This chip set enables the development of low cost wireless digital audio


    Original
    PDF SAA8200HL SAA8200HL, SAA8200HL) TEA7000) TEA7000 SAA8200 SAA8200HL circuit diagram for 7.1 home theatre amplifier simple 5.1 home theatre amplifier circuit diagram with usb philips home theatre tea7000 5.1 home theatre audio system diagram for making 7.1 home theatre schematic diagram SmD TRANSISTOR 1fs circuit schematic for wireless headphone with mic schematic diagram of bluetooth headphone circuit for 7.1 home theatre system

    FCP-40-03

    Abstract: FCP-1403 FCP-1603-07 FCP-1603-0701 FCP-2806-07 FCP-2606-07 FCP-16-03 FCP-1403-0701 IC26 FCP-4003
    Text: FC Series 1.27mm pitch Rat Cable IDC Connector Contact pitch 2.54mm FC Series (icv*-yMR&*«<7) 2 .5 4 m m p it c h ( ja Y A M A IC H I 'O ^ U = C T R 0 N IC 5 ( 1 .2 7 m m p it c h 7 7 7 Features • ICv * r y h < r—-7J\,z • ^ m w c v 'r v h&IC26:> U- X PP)JC30S/ U- X PP)


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    PDF KttIC26S/ Q00MQGU: DC500V 500VDC AC700V 700VAC 30mQOT FCP-1403-0701 FCP-1603-0701 FCP-2003-0701 FCP-40-03 FCP-1403 FCP-1603-07 FCP-2806-07 FCP-2606-07 FCP-16-03 IC26 FCP-4003

    IC26-1403-GG4

    Abstract: IC26-1603-GG4 ic26a IC26-2003-G d803 IC26-3206-GG4 IG26-4B06-GG4 IC26-1803-GG4 24G6 1013
    Text: IC26 Series DIP 2.54mm Pitch GUBCTR0NIC5 Features 7 7 ’y ^X ® S A fc B & ih R o H S it ^ W Highly reliable four-point contact design Machined sleeves eliminating solder or flux penetration Stand-off preventing blowholes in solder joints RoHS compliant


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    PDF 2il33 IC26-2003-G IG26-24G3-GG4 IG26-24G6-GG4 IC26-2803-GG4 IG26-2804-GG4 IG26-2806-GG4 IC26-3206-GG4 IC26-3606-GG4 IC26-4006-GG4 IC26-1403-GG4 IC26-1603-GG4 ic26a d803 IG26-4B06-GG4 IC26-1803-GG4 24G6 1013

    Untitled

    Abstract: No abstract text available
    Text: FEATURES ORDERING CODE • IC26—2010—GS3L Round pin contacts with four leaf springs. • Screw machined sleeves prevent solder or flux penetration. L : 12.84 tor wrapping use only • Standoffs prevent blow holes. Terminal length option Unmarked : 3.20 (standard)


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    PDF IC26--2010--GS3L at500VDC 700VAC IC26-- IC26--1810-- IC2S--1910-- IC26--2010-- Z54X18" 54X19

    Untitled

    Abstract: No abstract text available
    Text: BGA _ IC264 Series Characteristics Insulation Resistance: Withstanding Voltage: 1000M Q or more at 100 VDC 100 VAC for 1 Minute Contact Resistance: 1Q or less at 10mA/20mV Initial -40’ C - +150'C Operating Temperature: Material


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    PDF IC264 1000M 10mA/20mV UL94V-0

    IC26V-0603-GG4

    Abstract: No abstract text available
    Text: IC26V Series DIP 2.54mm Pitch Features w m x v -7 ti\ & a ,/ cs y ^ ' y ^ x < D m x ^ m ± RoHSJt^*MS Highly reliable four-point contact design Machined sleeves eliminating solder or flux penetration Stand-off preventing blowholes in solder joints RoHS compliant


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    PDF IC26V IC26V-2003 IC26V-3206-GG4 IC26V-3606-GG4 IC26V-4006-GG4 IC26V-4206-GG4 IC26V-4806-GG4 IC26V-0603-GG4

    Untitled

    Abstract: No abstract text available
    Text: PS SERIES r ^ F # f BOARD-to-BOARD SIP, DIP, PGA 1 .d k- AW •D IP TYPE •S IP TYPE FEATURES • Plugs designed to implement stack mounting of PC boards using conventional 1C sockets (IC26 and IC140 series for SIP/DIP, IC122 series for PGA). • A wide variety of terminal lengths available (3 types for DIP, 4 types


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    PDF IC140 IC122 000MD at500VDC 700VAC UL94V-0 10X10 11X11 12X12 13X13

    Untitled

    Abstract: No abstract text available
    Text: FC SERIES 2.54mm p i& lh ^ fer UTswi pitch flat cakte cowiecfioft, JCsocket maitog type FEATURES S P E C IFIC A TIO N S • •PERFORMANCE Flat cable connectors for mating with 1C socket. • Applicable IC sockets: IC26 series (DIP , see page 7 IC30 series (DIP), see page 9


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    PDF FCP-07) FCP-03) 000MQ at500VDC 700VAC FCP-03 FX-003 FA-005

    IC2660

    Abstract: SOT-23-5 driver TI
    Text: IC2660 miCREL IttyBitty Charge Pump Preliminary Information General Description Features The M IC2660 IttyBitty™ charge pum p functions as a lowcurrent, step-upconverterw hereconventionalinductorbased, dc-to-dc converters are too com plex and expensive. This


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    PDF IC2660 T-23-5 appr19 OT-23-5 MIC2660 IC2660 SOT-23-5 driver TI

    Untitled

    Abstract: No abstract text available
    Text: IC26V Series SIP 2.54m m Pitch ypiffli Features w m x ' j - 7 b \ te htis y ^ v ^ X C D m A Z f f i l t x f y p j- x iC 'k - v T , i£A ,fc(D 7n-jt\-Ji,% iyjik &mwm rtab RoHSJI^^JS Highly reliable four-point contact design Machined sleeves eliminating solder or flux penetration


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    PDF IC26V IC26V-20 UC26V-* 10-GG4 IC26VS/

    Untitled

    Abstract: No abstract text available
    Text: BGA IC264 Series CHARACTERISTICS Insulation Resistance Withstanding Voltage Contact Resistance Operating Temperature Contact Resistance 100M Q or m ore at 100VDC 100VAC for one m inute IQ or less at 10mA/20mV or less initial 40°C ~ +150°C 25g~35g per individual contact


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    PDF IC264 100VDC 100VAC 10mA/20mV IC264-22501-1-* IC264-22501

    IC26-0310-GG4

    Abstract: IC26-0510-GG4 IC26-0710-GG4 IC26-0410-GG4 IC26-1410-GG4 IC26-1310-GG4 IC26-1210-GG4 TY 1016
    Text: IC26 Series SIP 2.54mm Pitch (@e£CTONIC5 ^ Features « X ' J - m t t A ,tc s 7 7 > y ^ X ig A € B & ih 7 , $ y \ t X 7 \ C . J ; ^ T N i* fv t c < D Z ? n - 7 b - ) l% m ± R o H S ^ W Highly reliable four-point contact design Machined sleeves eliminating solder or flux penetration


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    PDF IC26-201 DC500VÂ 000MQ AC700Vrmsl^ IC26-0510-GG4 IC26-0610-GG4 IC26-0710-GG4 IC26-0B10-GG4 IC26-0910-GG4 IC26-1010-GG4 IC26-0310-GG4 IC26-0410-GG4 IC26-1410-GG4 IC26-1310-GG4 IC26-1210-GG4 TY 1016

    Untitled

    Abstract: No abstract text available
    Text: 1C 26 SERIES DiP 2.54rmn pitch FEATURES ORDERING CODE • Round pin contacts with four leaf springs. • Screw machined sleeves prevent solder or flux penetration. • Standoffs prevent blow holes. IC26— 2003— GS3L L: 12.84 (ior wrapping use only! Terminal length option Unmarked : 3.20 (Standard)


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    PDF 54rmn 700VAC 500VDC

    Untitled

    Abstract: No abstract text available
    Text: A Table Of Contents ^Arrays Pages Pin Grid Arrays / Zero Insertion Force PG A/ZIF PG A/ZIF PG A/ZIF Open top PG A/ZIF (Interstitial) PGA / ZIF (Open Top, Interstitial) NP89 NP161 NP171 NP236 NP178 9-10 11-12 13-14 15-16 17-18 IC264 NP276 19 20-21 Ball Grid Arrays


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    PDF NP161 NP171 NP236 NP178 IC264 NP276 IC280 NP291 NP351 IC-176

    IC26-0803-GG4

    Abstract: MSP88LV020 MSP88LV ic160z-0444-24" msp88 IC26-1403-GG4 fujitsu device NVPROM cross reference IC26-0803 30-B5
    Text: YAMAICHI ELECTRONICS Production 1C Sockets IC26 S /y - X SIP IC 140$/'J-X (DIP) IC26Series(SIP) IC140Series(DIP) ►P02 1 I »-P09' IC30 î / ' J - X (SIP) IC1602/U—X(PLCC) IC30Series(SIP) IC160 Series(PLCC) IC140 $ /'J -X (SIP) IC 149S/U -X (QFP) IC140Series(SIP)


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    PDF IC26Series IC140Series IC30Series IC140Ã IC160 IC149S/U-X IC149 IC26S/ IC26-0803-GG4 MSP88LV020 MSP88LV ic160z-0444-24" msp88 IC26-1403-GG4 fujitsu device NVPROM cross reference IC26-0803 30-B5