Ablebond 8390
Abstract: sil154 kyro PowerVR B1G5 HC100 PowerVR imagination technologies bitblt kyro 2 Bt868
Text: Integrated 2D/3D graphics accelerator – Product Overview PRELIMINARY DATA FEATURES • PowerVR Series 3 arcade performance 3D ● DirectX7 Flexible Vertex Format support ● 8 layer Multi-texturing ● Twin high performance texturing pipelines ● Full triangle setup hidden surface
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Ablebond 8390
sil154
kyro
PowerVR
B1G5
HC100
PowerVR imagination technologies
bitblt
kyro 2
Bt868
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MPC555
Abstract: MPC555LFMZP40 REV K3 MPC555LFMVR40 MPC555LFMZP40
Text: MPC555LFMZP40 Information General information Package information Environmental and Compliance information Manufacturing and Qualification information Ordering information
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MPC555LFMZP40
MPC555
448KFLASH
PBGA-B272
MPC555LFMZP40 REV K3
MPC555LFMVR40
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MIL-STD 833 test method 3015
Abstract: ST1305 M14C04 M14C16 ST1200 ST1305B ST1331 ST1333 ST1335 ST1336
Text: D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side contact side – Support for the chip
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csp defects
Abstract: 13B1 IMT-2000 PCB design for very fine pitch csp package mitsubishi gaAs 1998 plasma display address electrode driving
Text: The Dawn of 3D Packaging as System-in-Package SIP Morihiro Kada Abstract The three-dimensional chip-stacked CSP, which started with a flash/SRAM combination memory for cellular phones, was the forerunner from which 3D system packages realize full-scale capability. In the future, 3D package technology will act as a savior in achieving greater shrink of
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POWER TRANSFORMER E154515
Abstract: scheme e131175 sampo E159656 foxconn e253117 e131175 XEPEX E140166 sony bando power transformer power transformer e190246 tamradio transformer e199273
Text: 10129 LIST OF COMPANY IDENTIFICATIONS The List of Company Identifications contains the trade names, trademarks, or other designations authorized for use in lieu of these Company names. ‘‘ ’’ — 2CS SRL ’’ — ACT CO LTD ‘‘ ‘‘ ’’ — 3E HK LTD
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2702 eprom
Abstract: ST1305B ST1331 ISO/IEC 7816-1 micromodule MICROMODULES M14C04 M14C16 ST1200 ST1333
Text: D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side contact side – Support for the chip
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J-STD-20
Abstract: J-STD20 MIL-STD-883, Method 1010 JESD22A110 MIL-STD-883 Method 2010 Solder ball shear J-STD-035 JESD22-B117 JESD22-A110 bx372
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: G-0203-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 3/22/2002 Super BGA Packages 6/30/2002 Geoffrey Cortes
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G-0203-01
BS304
BS304
QEH84735
RC1PPC23)
EIA/JESD22-A110
MIL-STD-883,
JESD22-A103
J-STD-20
J-STD20
MIL-STD-883, Method 1010
JESD22A110
MIL-STD-883 Method 2010
Solder ball shear
J-STD-035
JESD22-B117
JESD22-A110
bx372
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JESD22-A104D
Abstract: Tsi310A-133CE HL832EX TSI310A-133CEY TSI310 A104D HL832 E679FB JESD22-A118
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1010-03 DATE: Product Affected: TSI310A-133CE TSI310A-133CEY Date Effective: Contact: Title: Phone #: Fax #: E-mail: 28-Jan-2011
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A1010-03
TSI310A-133CE
TSI310A-133CEY
28-Jan-2011
28-Oct-2010
JESD22-A104D
JESD22-A118
JESD22-A113
JESD22-A104D
Tsi310A-133CE
HL832EX
TSI310A-133CEY
TSI310
A104D
HL832
E679FB
JESD22-A118
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